CM1457 4-, 6-, 8-Channel EMI Filter Array with ESD Protection Description • Four, Six or Eight Channels of EMI Filtering • ±15 kV ESD Protection (IEC 61000−4−2, Contact Discharge) at • • • WLCSP15 CP SUFFIX CASE 567BR WLCSP10 CP SUFFIX CASE 567BJ External Pins Greater than −40 dB of Attenuation at 1 GHz MIL−STD−883 International ESD Standard Chip Scale Package (CSP) with 0.40 mm Pitch and 0.25 mm CSP Solder Ball which Features Extremely Low Parasitic Inductance for Optimum Filter and ESD Performance OptiGuard Coating for Improved Reliability at Assembly These Devices are Pb−Free and are RoHS Compliant Applications • LCD and Camera Data Lines in Mobile Handsets • I/O Port Protection for Mobile Handsets, Notebook Computers, • • • Computers Wireless Handsets Handheld PCs/PDAs LCD and Camera Modules © Semiconductor Components Industries, LLC, 2013 May, 2013 − Rev. 6 An* (Internal Pins) 1.8 pF GND (Pins B1−B4) 4.7 pF 35 nH 35 nH Cn* (External Pins) MARKING DIAGRAM N57 yww CM1457−06 CM1457−04 10−Bump CSP 15−Bump CSP N57 N57 N57 w/yww/yyww N57 yyww CM1457−08 20−Bump CSP = CM1457−04CP = CM1457−06CP = CM1457−08CP = date code ORDERING INFORMATION Device Package Shipping† CM1457−04CP CSP−10 (Pb−Free) 3500/Tape & Reel CM1457−06CP CSP−15 (Pb−Free) 3500/Tape & Reel CM1457−08CP CSP−20 (Pb−Free) 3500/Tape & Reel PDAs, etc. • EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook WLCSP20 CP SUFFIX CASE 567BV BLOCK DIAGRAM N57 w Features • http://onsemi.com 6 pF The CM1457 is an inductor-based (L-C) EMI filter array with ESD protection, which integrates four, six, or eight filters in a CSP form factor with 0.40 mm pitch. Each EMI filter channel of the CM1457 is implemented with the component value of 6 pF − 35 nH – 4.7 pF − 35 nH – 1.8 pF. The cut-off frequency at −3 dB attenuation is 300 MHz and can be used in applications where the data rates are as high as 160 Mbps, while providing greater than −35 dB attenuation over the 800 MHz to 2.7 GHz frequency range. The parts include ESD diodes on every I/O pin and provide a high level of protection against electrostatic discharge (ESD). The ESD protection diodes connected to the external filter ports are designed and characterized to safely dissipate ESD strikes of ±15 kV, which is beyond the maximum requirement of the IEC61000−4−2 international standard. This device is particularly well suited for wireless handsets, mobile LCD modules and PDAs because of its small package format and easy-to-use pin assignments. In particular, the CM1457 is ideal for EMI filtering and protecting data and control lines for the LCD display and camera interface in mobile handsets. The CM1457 incorporates OptiGuard which results in improved reliability at assembly. It is manufactured with a 0.40 mm pitch and 0.25 mm CSP solder ball to provide up to 28% board space savings vs. competing CSP devices with 0.50 mm pitch and 0.30 mm CSP solder ball. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1 Publication Order Number: CM1457/D CM1457 PACKAGE / PINOUT DIAGRAMS Orientation Marking Top View (Bumps Down View) + A 1 2 3 Bottom View (Bumps Up View) 4 C1 B A1 A1 CM1457−04CP 10−Bump CSP Orientation Marking + A 1 2 3 4 5 C1 C CM1457−06CP 15−Bump CSP A + 2 4 3 5 B2 A2 A3 A4 C3 C4 C5 6 7 C2 B1 Orientation Marking 1 C4 6 B Orientation Marking C3 B1 Orientation Marking C C2 B2 C6 B3 A1 A1 A2 A3 A4 A5 A6 C2 C3 C4 C5 C6 C7 8 C1 B Orientation Marking C B1 A1 A1 B2 A2 A3 B3 A4 A5 C8 B4 A6 A7 A8 CM1457−08CP 20−Bump CSP Table 1. PIN DESCRIPTIONS Pin Number Pin Number −04 −06 −08 −04 −06 −08 A1 A1 A1 Pin Description Filter #1 (Internal) C1 C1 C1 Filter #1 (External) A2 A2 A2 Filter #2 (Internal) C2 C2 C2 Filter #2 (External) A3 A3 A3 Filter #3 (Internal) C3 C3 C3 Filter #3 (External) A4 A4 A4 Filter #4 (Internal) C4 C4 C4 Filter #4 (External) − A5 A5 Filter #5 (Internal) − C5 C5 Filter #5 (External) − A6 A6 Filter #6 (Internal) − C6 C6 Filter #6 (External) − − A7 Filter #7 (Internal) − − C7 Filter #7 (External) − − A8 Filter #8 (Internal) − − C8 Filter #8 (External) B1, B2 B1−B3 B1−B4 Pin Description GND http://onsemi.com 2 CM1457 SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units −65 to +150 °C DC current per Inductor 15 mA DC Package Power Rating 0.5 W Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units −40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Parameter Symbol Conditions Min Typ Max Units LTOT Total Channel Inductance 70 nH RTOT Total Channel DC Resistance 45 W CTOT_0V Total Channel Capacitance, 0 V bias 0 V dc; 1 MHz, 30 mV rms Total Channel Capacitance, 2.5 V bias 2.5 V dc; 1 MHz, 30 mV rms Stand−off Voltage I = 10 mA ILEAK Diode Leakage Current VIN = +3.3 V VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10 mA ILOAD = −10 mA VESD In−system ESD Withstand Voltage a) Contact Discharge per IEC 61000−4−2 standard, Level 4 (External Pins) b) Contact Discharge per IEC 61000−4−2 standard, Level 4 (Internal Pins) CTOT_2.5V VST fC (Notes 2 and 3) Cut−off Frequency ZSOURCE = 50 W, ZLOAD = 50 W 20 24 12.5 pF 5.5 5.6 −1.5 pF V 0.1 0.5 6.8 −0.8 9.0 −0.4 mA V kV ±15 ±2 300 MHz 1. TA = 25°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. 3. Unused pins are left open. APPLICATION INFORMATION Refer to Application Note “The Chip Scale Package”, for a detailed description of Chip Scale Packages offered by ON Semiconductor. http://onsemi.com 3 CM1457 PERFORMANCE INFORMATION 0 dB INSERTION LOSS −10 dB −20 dB −30 dB −40 dB −50 dB 3 10 100 1000 2000 6000 FREQUENCY (MHz) Figure 1. Insertion Loss vs. Frequency (0 V Bias) 0 dB INSERTION LOSS −10 dB −20 dB −30 dB −40 dB −50 dB 3 10 100 1000 FREQUENCY (MHz) Figure 2. Insertion Loss vs. Frequency (2.5 V Bias) http://onsemi.com 4 2000 6000 CM1457 PACKAGE DIMENSIONS WLCSP10, 1.67x1.05 CASE 567BJ−01 ISSUE O È È PIN A1 REFERENCE 2X 0.05 C 2X 0.05 C D A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E DIM A A1 A2 b D E eD eE TOP VIEW OptiGuard Option ÉÉÉÉ 0.05 C A2 A RECOMMENDED SOLDERING FOOTPRINT* 0.05 C NOTE 3 A1 C SIDE VIEW SEATING PLANE A1 eD/2 10X b 0.05 C A B 0.03 C eD MILLIMETERS MIN MAX 0.69 0.54 0.17 0.24 0.42 REF 0.24 0.29 1.67 BSC 1.05 BSC 0.400 BSC 0.347 BSC PACKAGE OUTLINE 0.35 eE 0.35 0.40 PITCH C B 10X 0.25 DIMENSIONS: MILLIMETERS A 1 2 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 4 5 6 BOTTOM VIEW http://onsemi.com 5 CM1457 PACKAGE DIMENSIONS WLCSP15, 2.47x1.05 CASE 567BR−01 ISSUE O È È PIN A1 REFERENCE 2X 0.05 C 2X D 0.05 C A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E DIM A A1 A2 b D E eD eE TOP VIEW OptiGuard Option ÉÉÉÉÉÉ 0.05 C A2 A RECOMMENDED SOLDERING FOOTPRINT* 0.05 C NOTE 3 A1 C SIDE VIEW SEATING PLANE eD/2 15X b 0.05 C A B 0.03 C eD MILLIMETERS MIN MAX 0.69 0.54 0.17 0.24 0.42 REF 0.24 0.29 2.47 BSC 1.05 BSC 0.400 BSC 0.347 BSC PACKAGE OUTLINE A1 0.35 eE 0.35 C 15X 0.40 PITCH B 0.25 DIMENSIONS: MILLIMETERS A 1 2 3 4 5 6 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 7 8 9 BOTTOM VIEW http://onsemi.com 6 CM1457 PACKAGE DIMENSIONS WLCSP20, 3.27x1.05 CASE 567BV−01 ISSUE O PIN A1 REFERENCE 2X 0.05 C 2X ÈÈ ÈÈ D A E 0.05 C DIM A A1 A2 b D E eD eE TOP VIEW ÉÉÉÉÉÉÉÉ OptiGuard Option 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B A2 MILLIMETERS MIN MAX 0.69 0.54 0.17 0.24 0.42 REF 0.24 0.29 3.27 BSC 1.05 BSC 0.400 BSC 0.347 BSC A 0.05 C NOTE 3 A1 C SIDE VIEW SEATING PLANE eD/2 b 20X 0.05 C A B 0.03 C eD eE C B A 1 2 3 4 5 6 7 8 9 10 1112 BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT* PACKAGE OUTLINE A1 0.35 0.35 20X 0.40 PITCH 0.25 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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