HSMP-381Z Low Distortion Attenuator RF PIN Diodes In Surface Mount SOD-323 Package Data Sheet Description/Applications Features Avago Technologies’ HSMP-381Z is designed for low distortion attenuator applications. It is housed in a low cost, industrial standard surface mount package - SOD-323. This package offers customers who already use them in SOT23 and SOT-323 packages, a logical transition to a smaller package outline to accommodate end product design with limited board space. • 2 Leads Surface Mount Package The HSMP-381Z has low distortion and high IP3 characteristics. The device can operate in microwave frequencies and suitable to be used as attenuating circuits in Infrastructure and CATV applications. A SPICE model is not available for PIN diodes as SPICE does not provide for a key PIN diode characteristic -carrier lifetime. Package Marking and Pin Connections cathode K? Anode Note: Package marking provides orientation and identification “K” = Device Code “?” = Month code indicates the month of manufacture • Low Distortion Attenuating • Microwave Frequency Operation • Tape and Reel Options Available • Low Failure in Time (FIT) Rate • MSL1 & Lead Free Table 1. Absolute Maximum Ratings [1] at Tc = +25°C Symbol Parameter Unit Max Rating If Forward Current (1 µs Pulse) Amp 1 PIV Peak Inverse Voltage V 100 Tj Junction Temperature °C 150 Tstg Storage Temperature °C -60 to 150 qjb Thermal Resistance [2] °C/W 135 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. Thermal Resistance is measured from junction to board using IR method. Table 2. Electrical Specifications at Tc = +25°C Test Conditions Minimum Breakdown Voltage VBR (V) Maximum Total Capacitance CT (pF) Minimum Resistance at IF = 0.01mA, RH (Ω) Maximum Resistance at IF = 20mA, RL (Ω) Maximum Resistance at IF = 100mA, RT (Ω) Resistance at IF = 1mA, RM (Ω) 100 0.35 1500 10 3.0 48 to 70 VR = VBR Measure IR≤ 10uA VR = 50V f = 1MHz IF = 0.01mA f = 100MHz IF = 20mA f = 100MHz IF = 100mA f = 100MHz IF = 1mA f = 100MHz Note : Rs parameters are tested under AQL 1.0 Table 3. Typical Parameters at Tc = +25°C Test Conditions Carrier Lifetime t (ns) Reverse Recovery Time Trr (ns) Total Capacitance CT (pF) 1500 300 0.27 IF = 50mA IR = 250mA VR = 10V IF = 20mA 90% Recovery VR = 50V f = 1MHz Typical Performance Curves at Tc = +25°C 100.00 10000 1000 FORWARD CURRENT (mA) RF RESISTANCE (OHMS) TA = +85˚C TA = +25˚C TA = -55˚C 100 10 10.00 1.00 0.10 +125˚C +25˚C -50˚C 0.01 1 0.01 0.10 1.00 10.00 100.00 0 0.2 FORWARD CURRENT (mA) 0.50 120 0.45 110 0.40 1 MHz 0.35 0.30 0.25 1 1.2 Figure 2. Forward Current vs. Forward Voltage INPUT INTERCEPT POINT (dBm) TOTAL CAPACITANCE (pF) Figure 1. RF Resistance vs. Forward Bias Current 0.4 0.6 0.8 FORWARD VOLTAGE (V) 30 MHz 0.20 100 Diode Mounted as a Series Attenuator in a 50 Ohm Microstrip and tested at 123 MHz 90 80 70 60 50 0.15 0 2 4 6 8 10 12 14 REVERSE VOLTAGE (V) Figure 3. RF Capacitance vs. Reverse Bias 16 18 20 40 1000 100 10 DIODE RF RESISTANCE (OHMS) Figure 4. 2nd Harmonic Input Intercept Point vs. Diode RF Resistance Note: 3. Typical values were derived using limited samples during initial product characterization and may not be representative of the overall distribution. Package Outline and Dimension PCB Footprint G CATHODE MARK B L K 1 0.8 H 2.3 F A E 0.9 2 Dimension in mm J D C I M DIM A B C D E F G H I J K L M4 M MILLIMETERS _ 0.2 2.50 + _ 1.25 +0.05 _ 0.05 0.90 + 0.30+0.06/-0.04 _ 0.05 1.70 + MIN 0.17 _ 0.03 0.126 + 0~0.1 1.0 MAX _0.05 0.15 + 0.4 2 +4/-2 ~6 Device Orientation Top View REEL K? K? COVER TAPE K? USER FEED DIRECTION 8 mm K? CARRIER TAPE 4 mm Note: "K" represents package marking code "?" represents date code End View Tape Dimensions Specification < Unit: mm > A. hole pitch : 50 Pitch Tolerance : 200 ± 0.3 Part Number Ordering Information Part number No. of Units Container HSMP-381Z-BLKG 100 Anti-static bag HSMP-381Z-TR1G 3000 7” reel For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0331EN AV02-0406 - July 31, 2007