TI TPS92310DGS/NOPB

TPS92310
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SNVS792 – FEBRUARY 2012
TPS92310 Off-Line Primary Side Sensing Controller With PFC
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FEATURES
DESCRIPTION
•
The TPS92310 is an off-line controller specifically
designed to drive high power LEDs for lighting
applications. With the primary side sensing, constant
on-time and quasi-resonant switching techniques, the
TPS92310 application circuit gives high Power
Factor, good EMI performance and high system
efficiency. Also, using this device, low external
component count application solutions can be
designed easily. Power Factor Correction is inherent
if the TPS92310 is operated in the constant on-time
mode with an adaptive algorithm. The control
algorithm of TPS92310 adjusts the on-time with
reference to the primary side inductor peak current
and secondary side inductor discharge time
dynamically, the response time of which is set by an
external capacitor. Also, minimized EMI and switching
loss is achieved with quasi-resonant switching. Other
supervisory features of the TPS92310 include cycleby-cycle primary side inductor current limit, VCC
under-voltage lockout, output over-voltage protection
and thermal shutdown. The TPS92310 is available in
the VSSOP-10 package.
1
2
•
•
•
•
•
Regulates LED Current Without Secondary
Side Sensing
Adaptive ON-Time Control With Inherent PFC
Critical-Conduction-Mode (CRM) With ZeroCurrent Detection (ZCD) for Valley Switching
Programmable Switch Turn ON Delay
Programmable Constant ON-Time (COT) and
Peak Current Control
Over-Temperature Protection
APPLICATIONS
•
•
LED Lamps: A19 (E26/27, E14), PAR30/38,
GU10
Solid State Lighting
Typical Application
D3
T1
CIN
D1
LED Stack
R1
LP
LS
COUT
VLAUX
AC
IN
R4
D2
R2
*Z1
LAUX
Y1
R3
CZCD
VSW
GND
TPS92310
CVCC
DZCD
CCOMP
VCC
GATE
ZCD
ISNS
AGND
PGND
COMP
MODE1
DLY
MODE2
Q1
RISNS
RDLY
*Optional
Figure 1.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
TPS92310
SNVS792 – FEBRUARY 2012
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Connection Diagram
Top View
VCC
GATE
ZCD
ISNS
AGND
PGND
COMP
MODE1
DLY
MODE2
Figure 2. 10-Pin VSSOP
Pin Descriptions
2
Pin
Name
Description
1
VCC
Power supply input
Application Information
2
ZCD
Zero crossing detection input
3
AGND
Small signal ground
4
COMP
Compensation network
Output of the error amplifier. Connect a capacitor from this pin to
ground to set the frequency response of the LED current regulation
loop.
5
DLY
Delay control input
Connect a resistor from this pin to ground to set the delay between
switching ON and OFF periods.
6
MODE2
Mode selection input 2
Select operating mode for isolated or non-isolated mode.
7
MODE1
Mode selection input 1
Select operating mode for peak current mode or constant ON time.
8
PGND
Power ground
9
ISNS
Current sense voltage feedback
10
GATE
Gate driver output
This pin provides power to the internal control circuitry and gate driver.
Connect a 10µF capacitor from this pin to ground.
The pin senses the voltage of the auxiliary winding for zero current
detection.
Signal ground.
Power ground. This pin must be connected to the AGND pin externally
for normal operation. This pin has no internal connection to PGND.
Switch current sensing input.
Gate driving signal to the external switching MOSFET.
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2)
VCC to GND
-0.3V to 40V
DLY, COMP, ZCD to GND
-0.3V to 7V
ISNS to GND
-0.3V to 7V
GATE to GND
-0.3V to 12V (5ns, –5V)
MODE1 to GND
-0.3V to 7V
MODE2 to GND
ESD Rating, HBM
-0.3V to 7V
(3)
±2 kV
Machine Model
200V
Storage Temperature Range
-65°C to +125°C
Junction Temperature
(1)
(2)
(3)
+150°C
Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the
device is intended to be functional, but device parameter specifications may not be ensured. For ensured specifications and test
conditions, see the Electrical Characteristics. All voltages are with respect to the potential at the GND pin, unless otherwise specified.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
Human Body Model, applicable std. JESD22-A114-C.
Operating Conditions
Supply Voltage range VCC
13V to 36V
Junction Temperature (TJ)
Thermal Resistance (θJA)
(1)
-40°C to +125°C
(1)
120°C/W
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design. In applications where high power dissipation
and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient
temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation
of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as
given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).
Electrical Characteristics
VCC = 18V unless otherwise indicated. Typicals and limits appearing in plain type apply for TA = TJ = +25°C. Limits appearing
in boldface type apply over the full Operating Temperature Range. Data sheet minimum and maximum specification limits
are specified by design, test or statistical analysis.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
VCC Turn on threshold
23.4 / 23
VCCTurn off threshold
11.1 / 10.4
25.6
27.8 / 29
V
13
14.7 / 15.7
V
SUPPLY VOLTAGE INPUT (VCC)
VCC-UVLO
Hysteresis
12.6
ISTARTUP
Startup Current
VCC=VCC-UVLO–3.0V
10
12.5
14.75
µA
IVCC
Operating supply current
Not switching
0.9
1.2
1.5
mA
65kHz switching, CLOAD = 1nF
2
mA
ZERO CROSS DETECT (ZCD)
IZCD
ZCD bias current
VZCD-OVP
ZCD over-voltage
threshold
VZCD= 5V
TOVP
Over voltage de-bounce
time
VZCD-ARM
ZCD Arming threshold
VZCD = Increasing
1.16
VZCD-TRIG
ZCD Trigger threshold
VZCD = Decreasing
0.48
VZCD-HYS
ZCD Hysteresis
VZCD-ARM-VZCD-TRIG
4.1
0.1
1
µA
4.3
4.5
V
3
cycle
1.24
1.3
V
0.6
0.77
V
0.64
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Electrical Characteristics (continued)
VCC = 18V unless otherwise indicated. Typicals and limits appearing in plain type apply for TA = TJ = +25°C. Limits appearing
in boldface type apply over the full Operating Temperature Range. Data sheet minimum and maximum specification limits
are specified by design, test or statistical analysis.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
COMPENSATION (COMP)
ICOMP-SOURCE
Internal reference current
for primary side current
regulation
VCOMP = 2.0V, VISNS = 0V, Measure at
COMP pin
27
µA
gmISNS
ISNS error amp
transconductance
Δ VISNS to Δ ICOMP @ VCOMP = 2.5V
100
µmho
VCOMP
COMP operating range
2.0
3.5
V
1.26
V
DELAY CONTROL (DLY)
VDLY
DLY pin internal reference
voltage
IDLY-MAX
DLY source current
1.21
VDLY= 0V
250
1.23
µA
CURRENT SENSE (ISNS)
VISNS-OCP
Over Current Detection
Threshold
Non isolation mode
0.59
0.64
0.68
V
VISNS-OCP
Over Current Detection
Threshold
Isolation mode
3.2
3.4
3.6
V
IISNS
Current Sense Bias
Current
VISNS= 5V
-1
1
µA
TOCP
Over current Detection
Propagation Delay
Measure GATE pulse width at VISNS = 5V
210
ns
GATE DRIVER (GATE)
VGATE-H
GATE high drive voltage
IGATE = 50mA source
8
9.4
11.86
V
VGATE-L
GATE low drive voltage
IGATE = 50mA sink
28
80
167
mV
TON-MIN
Minimum ON time
360
540
720
ns
TOFF-MAX
Maximum OFF time
ZCD = GND
50
72
94
µs
tGATE-RISE
Rise time
CLOAD = 1nF
110
ns
tGATE-FALL
Fall time
CLOAD = 1nF
20
ns
Thermal shutdown
temperature (1)
165
°C
Thermal Shutdown
hysteresis
20
°C
THERMAL SHUTDOWN
TSD
(1)
4
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 165°C (typ.) and
disengages at TJ = 145°C (typ).
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Typical Performance Characteristics
All curves taken at VCC=18V with configuration in typical application for driving seven power LEDs with ILED=350mA shown in
this datasheet. TA=25°C, unless otherwise specified.
15.0
VCC-UVLO vs Temperature
VCC Startup Voltage vs Temperature
28
VCCSTARTUP VOLTAGE (V)
14.5
VCC-UVLO(V)
14.0
13.5
13.0
12.5
12.0
11.5
11.0
-50
80
27
26
25
24
23
22
-25
0
25 50 75
TEMPERATURE (°C)
Figure 3.
100 125
-50
TOFF-MAX vs Temperature
600
-25
0
25
50
75
TEMPERATURE (°C)
Figure 4.
100 125
TON-MIN vs Temperature
78
580
74
TON-MIN(ns)
TOFF-MAX(us)
76
72
70
68
66
64
560
540
520
500
62
60
-50
1.50
480
-25
0
25
50
75
TEMPERATURE ( °C)
Figure 5.
100 125
-50
IVCC-SD vs Temperature
5.2
1.45
100 125
VZCD-OVP vs Temperature
4.8
1.35
VZCD-OVP(V)
IVCC-SD(mA)
0
25 50 75
TEMPERATURE (°C)
Figure 6.
5.0
1.40
1.30
1.25
1.20
1.15
4.6
4.4
4.2
4.0
1.10
3.8
1.05
1.00
-50
-25
-25
0
25 50 75
TEMPERATURE (°C)
Figure 7.
100 125
3.6
-50
-25
0
25 50 75
TEMPERATURE (°C)
Figure 8.
100 125
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Typical Performance Characteristics (continued)
All curves taken at VCC=18V with configuration in typical application for driving seven power LEDs with ILED=350mA shown in
this datasheet. TA=25°C, unless otherwise specified.
1.50
VZCD-ARM vs Temperature
1.45
0.75
0.70
1.35
VZCD-TRIG(V)
VZCD-ARM(V)
1.40
1.30
1.25
1.20
1.15
0.60
0.56
0.45
1.05
-25
0
25 50 75
TEMPERATURE (°C)
Figure 9.
0.40
-50
100 125
VISNS-OCP (Isolated Mode) vs Temperature
4.2
4.0
0.9
3.8
0.8
3.6
3.4
3.2
0
25 50 75
TEMPERATURE (°C)
Figure 10.
100 125
0.7
0.6
0.5
0.4
3.0
0.3
2.8
2.6
-50
-25
VISNS-OCP (Non-Isolated Mode) vs Temperature
1.0
VISNS-OCP(V)
VISNS-OCP(V)
0.65
0.50
1.10
1.00
-50
VZCD-TRIG vs Temperature
0.80
0.2
-25
0
25 50 75
TEMPERATURE (°C)
Figure 11.
100 125
-50
-25
0
25 50 75
TEMPERATURE (°C)
Figure 12.
100 125
VGATE vs Temperature
11.0
10.5
VGATE(V)
10.0
9.5
9.0
8.5
8.0
7.5
7.0
-50
6
-25
0
25 50 75
TEMPERATURE (°C)
Figure 13.
100 125
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GATE
SIMPLIFIED INTERNAL BLOCK DIAGRAM
VC1
VCC
BIAS & VREF
VREF
UVLO
PGND
MODE1
MODE Decode
TSD
MODE2
ZC
ZCD
LEB
ON
VTRIG/VARM
CONTROL
iLimit
LEB
OVP
ISNS
OCP
TON
VC1
TON
Control
COMP
TON Peak Hold
VONpk
IREF
D
UVLO
AGND
DRV
COMP
ZC
OFT
DELAY
VONpk
ON
Idly
V/I
DLY
Figure 14. Simplified Block Diagram
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Application Information
The TPS92310 is an off-line controller specifically designed to drive LEDs with inherent Power Factor Correction
(PFC). This device operates in Critical Conduction Mode (CRM) with adaptive Constant ON-Time control, so that
high power factor can be achieved naturally. The TPS92310 can be used in isolated and non-isolated off-line
applications that cover most requirements for LED lighting applications. A typical application schematic is shown
in Figure 1. On the primary side, the off-line flyback converter consists of a transformer which includes three
windings LP, LS and LAUX, an external MOSFET Q1 and inductor current sensing resistor RISNS. On the output
side, the LS winding, the output diode D3, the output capacitor COUT and a LED string connected as the load.
Additionally, an auxiliary supply circuit to power the TPS92310 after start-up with LAUX output is implemented.
The LAUX output voltage, VLAUX is also used to detect the zero crossing point due to the end of a complete
switching cycle. During the on-period, Q1 is turned on, the AC line input is rectified by the input bridge rectifier D1
and input capacitor CIN and current flows through LP, Q1 and RISNS to ground, input energy is stored in the
primary inductor LP. Simultaneously, the ISNS pin of the device monitors the voltage of the current sensing
resistor RISNS to perform the cycle-by-cycle inductor current limit function. While the MOSFET Q1 turned off,
current flow in LP ceased and the energy stored during the on cycle is released to output and auxiliary circuits.
The current in the secondary winding LS charges the output capacitor COUT through D3 and supplies the LED
load, the COUT also responsible to supply current to LED load during subsequent on-period. The current flows
through LAUX powers the TPS92310 through D2 and CVCC in steady state operation. The voltage across LAUX,
VLAUX is fed back to the ZCD pin through a resistor divider network formed by R2 and R3 to perform zero crossing
detection of VLAUX, which determines the end of the off-period of a switching cycle. The next on-period of a new
cycle will be initiated after an inserted delay of 2 x tDLY, the tDLY is programmable by a single resistor connecting
the DLY pin and ground. The setting of the delay time, tDLY will be described in separate paragraph.
During steady state operation, the duration of the on-period tON can be determined with two different modes: the
Constant On-Time (COT) mode and the Peak Current Mode (PCM), which are configured by setting the MODE1
and MODE2 pins. For the COT mode, tON is generated by comparing an internal fixed saw-tooth wave with the
voltage on the COMP pin, VCOMP. Since VCOMP is slow varying, tON is nearly constant within an AC line cycle. For
the PCM, the on-period is terminated when the voltage of the ISNS pin, VISNS reaches a threshold determined by
VCOMP. Since the instantaneous input voltage (AC voltage) varies, tON varies accordingly within an AC line cycle.
The duration of the off-period tOFF is determined by the rate of discharging of LS, which is governed by ILS-PEAK
and VLED. Also, ILS-PEAK equals to n × ILP-PEAK where n is the turn ratio of LP and LS. Figure 15 shows the typical
waveforms in normal operation.
VSW
2xtDLY
t
ILP
VCOMP
t
tON
ILS
ILED
VZCD
tOFF
t
VZCD-OVP
VZCD-PEAK
VZCD-ARM
VZCD-TRIG
tDLY
t
Figure 15. Primary and Secondary Side Current Waveforms
8
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Startup Bias and UVLO
During startup, the TPS92310 is in the startup state. It is powered from the AC line through R1 and D1 (Figure 1).
In the startup state, most of the internal circuits of the TPS92310 shut down so that the quiescent current is
minimized. When VCC (voltage on the VCC pin) reaches the rising threshold of the VCC-UVLO (typically 25.6V), the
TPS92310 is in the low frequency state, where tON and tOFF are fixed to 1.5μs and 72μs. When VZCD–PEAK is
higher than VZCD-ARM, the TPS92310 enters normal operation.
VSW
Low Freq state
Steady state
Startup
state
t
VCC
25.6V
13V
t
VZCD
VZCD-OVP
VZCD-ARM
t
Figure 16. Start up Bias Waveforms
Mode Decoder
The TPS92310 can operate in the Peak Current Mode (PCM) or Constant On-Time (COT) mode if an isolated
topology is used. The TPS92310 can also use a non-isolated topology. In this case, only the COT mode can be
selected. The COT mode gives a high power factor. The PCM can achieve a lower output current ripple. The
COT mode using a non-isolated topology can achieve a higher efficiency and good load regulation. The above
modes can be selected by setting the MODE1 and MODE2 pins according to Table 1. For normal operation of
the TPS92310, the MODE1 and MODE2 pins cannot be connect to ground at the same time. And these pin were
biased by an internal 1μA pull up, forcing any voltage into these pins are not allowed. The MODE decoder status
will latch-in only when VCC voltage reaches the VCC-UVLO turn on threshold during start-up.
Table 1. MODE Configuration
MODE1
MODE2
Mode of operation
OPEN
OPEN
COT mode using isolated topology
GND
OPEN
PCM using isolated topology
OPEN
GND
COT mode using non-isolated topology
GND
GND
Reserved
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Zero Crossing Detection
To minimized the switching loss of the external MOSFET, a zero crossing detection circuit is embedded in the
TPS92310. VLAUX is AC voltage coupled from VSW by means of the transformer, with the lower part of the
waveform clipped by DZCD. VLAUX is fed back to the ZCD pin to detect a zero crossing point through a resistor
divider network which consists of R2 and R3. The next turn on time of Q1 is selected VSW is the minimum, an
instant corresponding to a small delay after the zero crossing occurs. (Figure 17) The actual delay time depends
on the drain capacitance of the Q1 and the primary inductance of the transformer (LP). Such delay time is set by
a single external resistor as described in Delay Setting section.
During the off-period at steady state, VZCD reaches its maximum VZCD-PEAK (Figure 14), which is scalable by the
turn ratio of the transformer and the resistor divider network R2 and R3. It is recommended that VZCD-PEAK is set to
3V during normal operation.
n u VLED +VIN
n u VLED
VSW
tDLY
Figure 17. Switching Node Waveforms
Delay Time Setting
In order to reduce EMI and switching loss, the TPS92310 can insert a delay between the off-period and the onperiod. The delay time is set by a single resistor which connects across the DLY pin and ground, and their
relationship is shown in Figure 18. The optimal delay time depends on the resonance frequency between LP and
the drain to source capacitance of Q1 (CDS). Circuit designers should optimize the delay time according to the
following equation.
(1)
(2)
After determining the delay time, tDLY can be implemented by setting RDLY according to the following equation:
(3)
where KDLY = 32MΩ/ns is a constant.
60
RDLY(k )
50
40
30
20
10
0
0
400
800
1200 1600
DELAY TIME (ns)
2000
Figure 18. Delay Time Setting
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Protection Features
Output Open Circuit Protection
If the LED string is disconnected, VLED increases and thus VZCD-PEAK increases. When VZCD-PEAK is larger than
VZCD-OVP for 3 continues switching cycles, the Over Voltage Protection (OVP) feature is triggered such that the
TPS92310 becomes Over-Voltage (OV) state. In this case, the switching of Q1 is stopped, and VCC decreases
owing to the power consumption of the internal circuits of the TPS92310. When VCC drops below the falling
threshold of VCC-UVLO, the TPS92310 restarts, and re-enter into startup state (Figure 20).
Output Short Circuit Protection
If the LED string is shorted, VZCD-PEAKdrops. If VZCD-PEAK drops below VZCD-TRIG, the TPS92310 will under low
frequency operation. In this case, the power supplied from LAUX is not enough to maintain VCC, then VCC
decreases. If the short is removed during low frequency state, the TPS92310 will restore to steady state. If the
short sustains till VCC drops below the falling threshold of VCC-UVLO, the TPS92310 restarts, and becomes startup
state again. (Figure 19)
VSW
Steady
state
Low freq
state
Low freq
state
t
VCC
25.6V
13V
t
VZCD
VZCD-OVP
VZCD-ARM
t
VLED
t
Figure 19. Output Short Circuit waveforms
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Over Current Protection
The Over Current Protection (OCP) limits the drain current of the external MOSFET Q1 and prevent inductor /
transformer saturation. When VISNS reaches a threshold, the OCP is triggered and the output of the GATE pin is
low immediately. The threshold is typically 3.4V and 0.64V when the TPS92310 is using an isolated topology and
a non-isolated topology respectively.
Thermal Protection
Thermal protection is implemented by an internal thermal shutdown circuit, which activates at 160°C (typically) to
shut down the TPS92310. In this case, the GATE pin outputs low to turn off the external MOSFET, and hence no
power from the VAUX winding to VCC. Capacitor CVCC will discharge until UVLO. When the junction temperature
of the TPS92310 falls back below 130°C, the TPS92310 resumes normal operation.
Steady state
Startup
state
Low Freq state
VSW
OV state
Steady
state
Disconnect LED
Reconnect LED
Steady
state
Startup
state
Startup
state
Startup
state
Low
Freq
state
VCC
25.6V
13V
VZCD
VZCD-OVP
VZCD-ARM
VLED
ILED
Steady
state
Force output short circuit
Steady
state
Figure 20. Auto Restart Operation
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Design Example
The following design example illustrates the procedures to calculate the external component values for the
TPS92310 isolated single stage fly-back LED driver with PFC.
Design Specifications:
Input voltage range, VAC_RMS = 85VAC – 132VAC
Nominal input voltage, VAC_RMS(NOM) = 110VAC
Number of LED in serial =7
LED current, ILED = 350mA
Forward voltage drop of single LED = 3.0V
Forward voltage of LED stack, VLED = 21V
Key operating Parameters:
Converter minimum switching frequency, fSW = 75kHz
Output rectifier maximum reverse voltage, VD3(MAX) = 100V
Power MOSFET rating, VQ1(MAX) = 800V (2.5A/3.8Ω)
Power MOSFET Output Capacitance, CDS = 37pF (estimated)
Nominal output power, POUT = 8W
Start Up Bias resistor
During start up, the VCC will be powered by the rectified line voltage through external resistor, R1. The VCC start
up current, IVCC(SU) must set in the range IVCC(MIN)>IVCC(SU)>ISTARTUP(MAX) to ensure proper restart operation during
OVP fault. In this example, a value of 0.55mA is suggested. The resistance of R1 can be calculated by dividing
the nominal input voltage in RMS by the start up current suggested.
So, R1 = 110V/0.55mA = 200KΩ is recommended.
Transformer Turn Ratio
The transformer winding turn ratio, n is governed by the MOSFET Q1 maximum rated voltage, (VQ3(MAX)), highest
line input peak voltage (VAC-PEAK) and output diode maximum reverse voltage rating (VD3(MAX)). The output diode
rating limits the lower bound of the turn ratio and the MOSFET rating provide the upper bound of the turn ratio.
The transformer turn ratio must be selected in between the bounds. If the maximum reverse voltage of D3
(VD3(MAX)) is 100V. the minimum transformer turn ratio can be calculated with the equation in below.
(4)
In operation, the voltage at the switching node, VSW must be small than the MOSFET maximum rated voltage
VQ1(MAX) , For reason of safety, 10% safety margin is recommended. Hence, 90% of VQ1(MAX) is used in the
following equation.
(5)
(6)
where VOS is the maximum switching node overshoot voltage allowed, in this example, 50V is assumed. As a
rule of thumb, lower turn ratio of transformer can provide a better line regulation and lower secondly side peak
current. In here, turn ratio n = 3.8 is recommended.
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Switching Frequency Selection
TPS92310 can operate at high switching frequency in the range of 60kHz to 150kHz. In most off-line
applications, with considering of efficiency degradation and EMC requirements, the recommended switching
frequency range will be 60kHz to 80kHz. In this design example, switching frequency at 75kHz is selected.
Switching On Time
The maximum power switch on-time, tON depends on the low line condition of 85VAC. At 85VAC the switching
frequency was chosen at 75kHz. This transformer design will follow the formulae as shown below.
(7)
Transformer Primary Inductance
The primary inductance, LP of the transformer is related to the minimum operating switching frequency fSW,
converter output power POUT, system efficiency η and minimum input line voltage VAC_RMS(MIN). For CRM
operation, the output power, POUT can be described by the equation in below.
(8)
By re-arranging terms, the transformer primary inductance required in this design example can be calculated with
the equation follows:
(9)
The converter minimum switching frequency is 75kHz, tON is 5.3µs, VAC_RMS(MIN) = 85V and POUT = 8W, assume
the system efficiency, η = 85%. Then,
(10)
From the calculation in above, the inductance of the primary winding required is 0.81mH.
Calculate The Current Sensing Resistor
After the primary inductance and transformer turn ratio is determined, the current sensing resistor, RISNS can be
calculated.
The resistance for RISNS is governed by the output current and transformer turn ratio, the equation in below can
be used.
(11)
where VREF is fixed to 0.14V internally.
Transformer turn ratio, NP : NS is 3.8 : 1 and ILED = 0.35A
(12)
14
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TPS92310
GATE
Q1
ISNS
RISNS
PGND
PGND
Figure 21. RISNS Resistor Interface
D2
VCC
L3
R2
ZCD
CZCD
PGND
R3
PGND
DZCD
PGND
Figure 22. Auxiliary Winding Interface to ZCD
Auxiliary Winding Interface To ZCD
In Figure 22, R2 and R3 forms a resistor divider which sets the thresholds for over voltage protection of VLED,
VZCD-OVP, and VZCD-PEAK. Before the calculation, we need to set the voltage of the auxiliary winding, VLAUX at open
circuit.
For example :
Assume the nominal forward voltage of LED stack (VLED) is 21V.
To avoid false triggering ZCDOVP voltage threshold at normal operation, select ZCDOVP voltage at 1.3 times of the
VLED is typical in most applications. In case the transformer leakage is higher, the ZCDOVP threshold can be set
to 1.5 times of the VLED.
In this design example, open circuit AUX winding OVP voltage threshold is set to 30V. Assume the current
through the AUX winding is 0.4mA typical.
As a result, R2 is 66kΩ and R3 is 11kΩ. Also, for suppressing high frequency noise at the ZCD pin, a 15pF
capacitor connects the ZCD pin to ground is recommended.
Auxiliary Winding Vcc Diode Selection
The VCC diode D2 provides the supply current to the controller, low temperature coefficient , low reverse leakage
and ultra fast diode is recommended.
Compensation Capacitor And Delay Timer Resistor Selection
To achieve PFC function with a constant on time flyback converter, a low frequency response loop is required. In
most applications, a 2.2µF CCOMP capacitor is suitable for compensation.
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TPS92310
CVCC
VCC
DZCD
ZCD
AGND
CCOMP
COMP
RDLY
DLY
PGND
Figure 23. Compensation and DLY Timer connection
The resistor RDLY connecting the DLY pin to ground is used to set the delay time between the ZCD trigger to
gate turn on. The delay time required can be calculated with the parasitic capacitance at the drain of MOSFET to
ground and primary inductance of the transformer. Equation in below can be used to find the delay time and
Figure 18 can help to find the resistance once the delay time is calculated
(13)
For example, using a transformer with primary inductance LP = 1mH, and power MOSFET drain to ground
capacitor CDS=37pF, the tDLY can be calculated by the upper equation. As a result, tDLY=302ns and RDLY is
6.31kΩ. The delay time may need to change according to the primary inductance of the transformer. The typical
level of output current will shift if inappropriate delay time is chosen.
Output Flywheel Diode Selection
To increase the overall efficiency of the system, a low forward voltage schottky diode with appropriate rating
should be used.
Primary Side Snubber Design
The leakage inductance can induce a high voltage spike when power MOSFET is turned off. Figure 24 illustrate
the operation waveform. A voltage clamp circuit is required to protect the MOSFET. The voltage of snubber
clamp (VSN) must be higher than the sum of over shoot voltage (VOS), LED open load voltage multiplied by the
transformer turn ratio (n). In this examples, the VOS is 50V and LED maximum voltage, VLED(MAX) is 30V,
transformer turn ratio is 3.8. The snubber voltage required can be calculated with following equations.
VOS
VSN
VMOS_BV
n u VLED
VAC_PEAK
Vsw
Figure 24. Snubber Waveform
(14)
where n is the turn ratio of the transformer.
(15)
At the same time, sum of the snubber clamp voltage and VAC peak voltage (VAC_PEAK) must be smaller than the
MOSFET breakdown voltage (VMOS_BV). By re-arranging terms, equation in below can be used.
16
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(16)
In here, snubber clamp voltage, VSN = 250V is recommended.
Output Capacitor
The capacitance of the output capacitor is determined by the equivalent series resistance (ESR) of the LED,
RLED and the ripple current allowed for the application. The equation in below can be used to calculate the
required capacitance.
(17)
Assume the ESR of the LED stack contains 7 LEDs and is 2.6Ω, AC line frequency fAC is 60Hz.
In this example, LED current ILED is 350mA and output ripple current is 30% of ILED:
(18)
Then, COUT = 480μF.
In here, a 470μF output capacitor with 10μF ceramic capacitor in parallel is suggested.
PCB Layout Considerations
The performance of any switching power supplies depend as much upon the layout of the PCB as the
component selection. Good layout practices are important when constructing the PCB. The layout must be as
neat and compact as possible, and all external components must be as close as possible to their associated
pins. High current return paths and signal return paths must be separated and connect together at single ground
point. All high current connections must be as short and direct as possible with thick traces. The gate pin of the
switching MOSFET should be connected close to the GATE pin with short and thick trace to reduce potential
electro-magnetic interference. For off-line applications, one more consideration is the safety requirements. The
clearance and creepage to high voltage traces must be complied to all applicable safety regulations.
L1
NP : NS : NAUX = 3.8 : 1 : 1
LED+
3.3 mH
0.5A
600V
0.5A
R1a
100 kQ
CIN
0.1 PF
250V
90-135
VAC
LP
1A 600V
R1b
100 kQ
CAC
VR1
T1
C1
0.1 PF
D1
47 nF
R4
D3
1A 100V
LS
COUTa
COUTb
10 PF
470 PF
D2
BAV20
6±7
LED
RAC
20Q
*Z1
35V
22Q
CZCD
15 pF
CVCC
10 PF
CDSU4148
2.2 PF
6.34 kQ
DZCD
CCOMP
RDLY
*Optional
R2
66 kQ
LAUX
R3
11 kQ
LED2200 pF
U1
1
2
3
4
5
10
VCC
GATE
9
ISNS
ZCD
8
AGND PGND
7
COMP MODE1
6
DLY MODE2
Q1 STD3NK80Z
RISNS
1.52Q
TPS92310
Figure 25. Isolated topology schematic
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L1
3.3 mH
0.5A 600V
C1
0.1 PF
CIN
0.1 PF
0.5A
D1
NP:NAUX = 1:1
R1
200 k:
90-135
VAC
VR1
LP = LS
CAC
47 nF
R4
D2
20Q
0.1A
600V
T1
RAC
*Z1
22:
LAUX
R3
11 k:
CZCD
15 pF
3
4
CCOMP
2.2 PF
5
RDLY
6.34 k:
* Optional
1
2
DZCD
CDSU4148
VCC
GATE
ZCD
ISNS
AGND
PGND
COMP
MODE1
DLY
MODE2
6-7
LED
470 PF
R2
68 k:
35V
CVCC
10 PF
COUT
10
D3
1A 600V
Q1
9
8
7
6
RISNS
0.4:
TPS92310
Figure 26. Non-isolated topology schematic
18
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PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
TPS92310DGS/NOPB
ACTIVE
VSSOP
DGS
10
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
SL1B
TPS92310DGSR/NOPB
ACTIVE
VSSOP
DGS
10
3500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
SL1B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TPS92310DGS/NOPB
VSSOP
DGS
10
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
TPS92310DGSR/NOPB
VSSOP
DGS
10
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS92310DGS/NOPB
VSSOP
DGS
10
1000
210.0
185.0
35.0
TPS92310DGSR/NOPB
VSSOP
DGS
10
3500
367.0
367.0
35.0
Pack Materials-Page 2
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