VISHAY GBP15

GBPC12, 15, 25 and 35
Vishay Semiconductors
Glass Passivated Single-Phase Bridge Rectifier
GBPC-W
Major Ratings and Characteristics
GBPC
~
IF(AV)
12 A, 15 A, 25 A, 35 A
VRRM
50 V to 1000 V
IFSM
200 A, 300 A, 300 A, 400 A
IR
5 µA
VF
1.1 V
Tj max.
150 °C
~
~
~
~
~
Features
Mechanical Data
• UL Recognition file number E54214
• Universal 3-way terminals: snap-on, wire wraparound, or P.C.B. mounting
• Typical IR less than 0.3 µA
• High surge current capability
• Low thermal resistance
• Solder Dip 260 °C, 40 seconds
Case: GBPC, GBPC-W
Epoxy meets UL-94V-0 Flammability rating
Terminals: Nickel plated on faston lugs or Silver
plated on wire leads (E4 Suffix), solderable per
J-STD-002B and JESD22-B102D. Suffix letter "W"
added to indicate wire leads
(e.g.
GBPC12005W)
Polarity: As marked, Positive lead by belevled corner
Mounting Torque: 20 inches-lbs. max.
Typical Applications
General purpose use in ac-to-dc bridge full wave rectification for Power Supply, Home Appliances, Office
Equipment, Industrial Automation applications
Maximum Ratings
Ratings at 25 °C ambient temperature unless otherwise specified.
Parameter
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified output
current (See Fig.1)
Peak forward surge current single sinewave superimposed on rated load
Rating (non-repetitive, for t greater than
1 ms and less than 8.3 ms) for fusing
Symbols
GBPC12
GBPC15
GBPC25
GBPC35
GBPC12
GBPC15
GBPC25
GBPC35
GBPC12
GBPC15
GBPC25
GBPC35
RMS isolation voltage from case to leads
Operating junction storage temperature range
Document Number 88612
08-Jul-05
VRRM
VRMS
VDC
IF(AV)
IFSM
I2 t
VISO
TJ, TSTG
005
50
35
50
01
100
70
100
GBPC12, 15, 25, 35
02
04
06
200
400
600
140
280
420
200
400
600
12
15
25
35
200
300
300
400
160
375
375
660
2500
- 55 to + 150
Units
08
800
560
800
10
1000
700
1000
V
V
V
A
A
A2 sec
V
°C
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1
GBPC12, 15, 25 and 35
Vishay Semiconductors
Electrical Characteristics
Ratings at 25 °C ambient temperature unless otherwise specified.
Parameter
Test condition Symbols
GBPC12, 15, 25, 35
005
01
02
04
06
Units
08
10
IF = 6.0 A
IF = 7.5 A
IF = 12.5 A
IF = 17.5 A
VF
1.1
V
Maximum reverse DC current at rated DC
blocking voltage per leg
TA = 25 °C
TA = 125 °C
IR
5.0
500
µA
Typical junction capacitance per leg
at 4 V, 1 MHz
CJ
300
pF
Maximum instantaneous
forward drop per leg
GBPC12
GBPC15
GBPC25
GBPC35
Thermal Characteristics
Ratings at 25 °C ambient temperature unless otherwise specified.
Parameter
Symbols
GBPC12, 15, 25, 35
005
GBPC12-25
GBPC35
Typical thermal resistance per leg (1)
01
02
04
RθJC
06
Units
08
10
1.9
1.4
°C/W
Notes:
(1) Thermal resistance from junction to case per leg
(2) Bolt down on heatsink with silicone thermal compound between bridge and mounting surface for maximum heat transfer with #10 screw
Ratings and Characteristics Curves
(TA = 25 °C unless otherwise noted)
40
GBPC35
Bridges Mounted on
9.5 x 3.5 x 4.6"
(22.9 x 8.9 x 11.7 cm)
AL. Finned Plate
35
30
5 x 6 x 4.9"
AL, Finned Plate
25
20
5 x 4 x 3"
AL. Finned Plate
15
6 x 2.2 x 2.2"
AL. Finned Plate
10
5
0
60 HZ Resistive or
Inductive Load
0
25
50
100
125
150
175
200
Figure 1. Maximum Output Rectified Current
2
60 HZ Resistive or
Inductive Load
35 RthS-A = 0.5 °C/W
30
GBPC25
25 RthS-A = 0.5 °C/W
20
GBPC15
RthS-A = 1.0 °C/W
15
10
GBPC12
5 RthS-A = 1.0 °C/W
0
75
Case Temperature (°C)
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Average Forward Current (A)
Average Forward Current (A)
40
0
10
20
30
40
50
60
70
80
90 100
Ambient Temperature (°C)
Figure 2. Maximum Output Rectified Current
Document Number 88612
08-Jul-05
GBPC12, 15, 25 and 35
Vishay Semiconductors
70
Instantaneous Reverse Leakage
Current (μA)
Average Power Dissipation of Bridge (W)
80
60
50
TJ = TJ max.
40
Resistive or
Inductive Load
30
20
10
0
TJ = 150 °C
10
1
40
30
20
10
50 - 400 V
600 - 1000 V
TJ = 25 °C
0.1
0.01
0
TJ = 125 °C
100
Capacitive Load
0
Average Output Current (A)
Figure 3. Maximum Power Dissipation
GBPC35
GBPC15
GBPC25
100
10
Reverse Voltage (V)
Figure 4. Maximum Non-Repetitive Peak Forward Surge Current
Per Leg
Figure 7. Typical Junction Capacitance Per Leg
100
1,000
10
Transient Thermal Impedance (°CW)
Instantaneous Forward Current (A)
100
10
1
100
Number of Cycles at 60 HZ
TJ = 25 °C
Pulse Width = 300 μs
1% Duty Cycle
1
0.1
0.6
0.8
1
1.2
1.4
1.6
Instantaneous Forward Voltage (V)
Figure 5. Typical Instantaneous Forward Characteristics Per Leg
Document Number 88612
08-Jul-05
100
TJ = 25 °C
f = 1.0 MHZ
Vsig = 50MVp-p
50
0.01
0.4
80
GBPC12
1.0 Cycle
1
60
600
TJ = TJ max.
0.5 Single Sine-Wave
100
40
Figure 6. Typical Reverse Leakage Characteristics Per Leg
Junction Capacitance (pF)
Peak Forward Surge Current (A)
500
20
Percent of Rated Peak Reverse Voltage (%)
TJ = 25 C
f = 1.0 MHZ
Vsig = 50MVp-p
100
10
1
0.01
0.1
1
10
100
t, Heating Time (sec.)
Figure 8. Typical Transient Thermal Impedance Per Leg
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GBPC12, 15, 25 and 35
Vishay Semiconductors
Package outline dimensions in inches (millimeters)
GBPC
GBPC-W
Hole for
#10 Screw
0.220 (5.59)
DIA.
0.200 (5.08)
1.135 (28.8)
1.115 (28.3)
0.732 (18.6)
0.692 (17.6)
1.135 (28.8)
1.115 (28.3)
0.24 (6.0)
0.18 (4.6)
0.042 (1.07)
0.038 (0.97)
DIA.
0.310 (7.62)
0.290 (7.36)
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4
0.24 (6.0)
0.18 (4.6)
0.732 (18.6)
0.692 (17.6)
0.470 (11.9)
0.430 (10.9)
0.50 (12.7)
0.44 (11.7)
Hole for
#10 Screw
0.220 (5.59) DIA.
0.200 (5.08)
0.672 (17.1)
0.632 (16.1)
AC
0.672 (17.1)
0.632 (16.1)
1.135 (28.8)
1.115 (28.3)
0.582 (14.8)
0.542 (13.8)
0.034 (0.86)
0.030 (0.76)
0.732 (18.6)
0.692 (17.6)
0.094 (2.4)
DIA.
1.25
(31.8)
MIN.
1.135 (28.8)
1.115 (28.3)
0.034 (0.86)
0.030 (0.76)
0.310 (7.62)
0.290 (7.36)
0.25
(6.35)
0.840 (21.3)
0.740 (18.8)
Document Number 88612
08-Jul-05