PANASONIC AN44066A

DATA SHEET
Part No.
AN44066A
Package Code No.
SSOP032-P-0300B
Publication date: July 2009
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AN44066A
Contents
„ Overview ……………………………………………………………………………………………………………. 3
„ Features ……………………………………………………………………………………………………………. 3
„ Applications ………………………………………………………………………………………………………… 3
„ Package ……………………………………………………………………………………………………………. 3
„ Type ………………………………………………………………………………………………………………… 3
„ Application Circuit Example ………………………………………………………………………………………. 4
„ Pin Descriptions ……………………………………………………………………………………………………. 5
„ Absolute Maximum Ratings ………………………………………………………………………………………. 6
„ Operating Supply Voltage Range ………………………………………………………………………………… 6
„ Allowable Current and Voltage Range …………………………………………………………………………... 7
„ Electrical Characteristics …………….……………………………………………………………………………
8
„ Electrical Characteristics (Reference values for design) …………….…………………………………………. 10
„ Technical Data …………………………………………………………………………………………………….. 11
y I/O block circuit diagrams and pin function descriptions ……………………………………………………… 11
y Control mode ………………………………….………………………………………………………………….. 16
y PD ⎯ Ta diagram …………………………………………………………………………………………………. 21
„ Usage Notes ………………………………………….……………………………………………………………. 22
y Special attention and precaution in using ……………………………………………………………………… 22
y Notes of Power LSI ………………………………………………………………………………………………. 23
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AN44066A
AN44066A
Driver IC for Stepping Motor
„ Overview
AN44066A is a two channels H-bridge driver IC. Bipolar stepping motor can be controlled by this single driver IC.
2-phase, half-step, 1-2 phase, W1-2 phase can be selected.
„ Features
y 2-phase input control by rationalization of interface (2-phase excitation, half-step, and 1-2 phase excitation enabled)
y 4-phase input control (W1-2 phase excitation enabled)
y Built-in CR chopping (with frequency selected)
y Built-in standby function
y Built-in thermal protection and low voltage detection circuit
y Built-in 5 V power supply
„ Applications
y IC for stepping motor drives
„ Package
y 32 pin Plastic Shrink Small Outline Package (SSOP Type)
„ Type
y Bi-CDMOS IC
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AN44066A
„ Application Circuit Example
BC1 18
0.01 μF
BC2 17
16 VPUMP
CHARGE
PUMP
0.01 μF
PHB1 26
Gate Circuit
IN0
IN3 30
3 BOUT2
S Q
R
IN2 29
5 RCSB
7 BOUT1
15 VM2
VREFB 20
TJMON 32
PWMSW 24
S5VOUT
0.1 μF
PWMSW
TSD
OSC
UVLO
47 μF
BLANK
VREFA 19
1 VM1
9 AOUT2
Q S
R
11 RCSA
IN1 28
13 AOUT1
IN0 27
ENABLEA 31
PHA1 25
IN2
STBY 22
S5VOUT 21
Reg
Gate Circuit
23 GND
VM
0.1 μF
Note) y This application circuit is shown as an example but does not guarantee the design for mass production set.
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AN44066A
„ Pin Descriptions
Pin No.
Pin name
Type
Description
1
VM1
Power supply
2
N.C.
—
3
BOUT2
4
N.C.
5
RCSB
6
N.C.
7
BOUT1
8
N.C.
9
AOUT2
10
N.C.
11
RCSA
12
N.C.
13
AOUT1
14
N.C.
—
15
VM2
Power supply
16
VPUMP
Output
Charge Pump circuit output
17
BC2
Output
Charge Pump capacitor connection 2
18
BC1
Output
Charge Pump capacitor connection 1
19
VREFA
Input
Phase A torque reference voltage input
20
VREFB
Input
Phase B torque reference voltage input
21
S5VOUT
Output
Internal reference voltage (5 V output)
22
STBY
Input
Standby setting
23
GND
Ground
Signal ground
24
PWMSW
Input
PWM frequency selection input
25
PHA1
Input
Phase A phase selection input
26
PHB1
Input
Phase B phase selection input
27
IN0
Input
Phase A output torque control 1
28
IN1
Input
Phase A output torque control 2
29
IN2
Input
Phase B output torque control 1
30
IN3
Input
Phase B output torque control 2
31
ENABLEA
Input
Phase A/B start/stop signal input
32
TJMON
Output
—
Input
/ Output
—
Output
—
Output
—
Input
/ Output
—
Output
Output
Motor power supply 1
N.C.
Phase B motor drive output 2
N.C.
Phase B current detection
N.C.
Phase B motor drive output 1
N.C.
Phase A motor drive output 2
N.C.
Phase A current detection
N.C.
Phase A motor drive output 1
N.C.
Motor power supply 2
VBE monitor
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AN44066A
„ Absolute Maximum Ratings
Note) Absolute maximum ratings are limit values which are not destructed, and are not the values to which operation is guaranteed.
A No.
Parameter
Symbol
Rating
Unit
Note
1
Supply voltage (Pin 1, 15)
VM
37
V
*1
2
Power dissipation
PD
0.427
W
*2
3
Operating ambient temperature
Topr
–20 to +70
°C
*3
4
Storage temperature
Tstg
–55 to +150
°C
*3
5
Output pin voltage (Pin 3, 7, 9, 13)
VOUT
37
V
*4
6
Motor drive current (Pin 3, 7, 9, 13)
IOUT
±0.8
A
*4
7
Flywheel diode current (Pin 3, 7, 9, 13)
If
0.8
A
*4
Notes) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
*2 : The power dissipation shown is the value at Ta = 70°C for the independent (unmounted) IC package without a heat sink.
When using this IC, refer to the PD-Ta diagram of the package standard and design the heat radiation with sufficient margin so that the
allowable value might not be exceeded based on the conditions of power supply voltage, load, and ambient temperature.
*3 : Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25°C.
*4 : Do not apply external currents or voltages to any pin not specifically mentioned.
For the circuit currents, "+" denotes current flowing into the IC, and "−" denotes current flowing out of the IC.
„ Operating Supply Voltage Range
Parameter
Operating supply voltage range
Symbol
Range
Unit
Note
VM
10.0 to 34.0
V
*
Note) *: The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
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AN44066A
„ Allowed Voltage and Current Ranges
Notes) y Rating Voltage is voltage of pin on GND
y Do not apply current or voltage from outside to any pin not listed above.
y For the circuit currents, "+" denotes current flowing into the IC, and "−" denotes current flowing out of the IC.
Pin No.
Pin name
Rating
Unit
Note
5
RCSB
2.5
V
—
11
RCSA
2.5
V
—
16
VPUMP
(VM – 1) to 43
V
*1
17
BC2
(VM – 1) to 43
V
*1
18
BC1
VM + 0.3
V
*1
19
VREFA
–0.3 to 6
V
—
20
VREFB
–0.3 to 6
V
—
22
STBY
–0.3 to 6
V
—
24
PWMSW
–0.3 to 6
V
—
25
PHA1
–0.3 to 6
V
—
26
PHB1
–0.3 to 6
V
—
27
IN0
–0.3 to 6
V
—
28
IN1
–0.3 to 6
V
—
29
IN2
–0.3 to 6
V
—
30
IN3
–0.3 to 6
V
—
31
ENABLEA
–0.3 to 6
V
—
Pin No.
21
Pin name
S5VOUT
Rating
Unit
Note
–5 to 0
mA
*1
*2
Notes) *1 : Do not apply external voltages to this pin. Set not to exceed allowable range at any time.
*2 : This is the rating under the condition that VM is used in the range between 16 V and 34 V. When VM is used in the range between 10 V and
16 V, the rating is –1.4 mA to 0.
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AN44066A
„ Electrical Characteristics at VM = 24 V
Note) Ta = 25°C±2°C unless otherwise specified.
B
No.
Parameter
Symbol
Conditions
Limits
Min
Typ
Max
Unit Note
Power Block
1
High-level output saturation voltage
VOH
IIN = –0.5 A
VM –
0.47
VM –
0.31
—
V
—
2
Low-level output saturation voltage
VOL
IIN = 0.5 A
—
0.47
0.71
V
—
3
Flywheel diode forward voltage
VDI
IIN = ±0.5 A
0.5
1.0
1.5
V
—
4
Output leakage current
VM = 37 V, VRCS = 0 V
—
10
20
μA
—
5
Supply current (at when only control
system and charge Pump circuit are
ON)
ENABLEA = 3.3 V
STBY = 0 V
—
5.4
8.2
mA
—
6
Supply current (at standby mode)
STBY = 2.1 V
—
120
190
μA
—
ILEAK
IM
ISTBY
I/O Block
7
High-level IN input voltage
VINH
2.2
—
5.5
V
—
8
Low-level IN input voltage
VINL
0
—
0.6
V
—
9
High-level IN input current
IINH
IN0 = IN1 = IN2 = IN3 = 5 V
–10
―
10
μA
—
10
Low-level IN input current
IINL
IN0 = IN1 = IN2 = IN3 = 0 V
–15
―
15
μA
—
11
High-level PHA1/PHB1 input voltage
VPHAH
VPHBH
2.2
—
5.5
V
—
12
Low-level PHA1/PHB1 input voltage
VPHAL
VPHBL
0
—
0.6
V
—
13
High-level PHA1/PHB1 input current
IPHAH
IPHBH
PHA1 = PHB1 = 3.3 V
16.5
33
66
μA
—
14
Low-level PHA1/PHB1 input current
IPHAL
IPHBL
PHA1 = PHB1 = 0 V
–15
―
15
μA
—
15
High-level ENABLEA input voltage
VENABLEAH
2.2
—
5.5
V
—
16
Low-level ENABLEA input voltage
VENABLEAL
0
—
0.6
V
—
17
High-level ENABLEA input current
IENABLEAH
ENABLEA = 5 V
–10
―
10
μA
—
18
Low-level ENABLEA input current
IENABLEAL
ENABLEA = 0 V
–15
―
15
μA
—
19
High-level PWMSW input voltage
VPWMSWH
2.2
—
5.5
V
—
20
Low-level PWMSW input voltage
VPWMSWL
0
—
0.6
V
—
21
High-level PWMSW input current
IPWMSWH
PWMSW = 3.3 V
8
16.5
33
μA
—
22
Low-level PWMSW input current
IPWMSWL
PWMSW = 0 V
–15
―
15
μA
—
23
High-level STBY input voltage
VSTBYH
2.1
—
5.5
V
—
24
Low-level STBY input voltage
VSTBYL
0
—
0.6
V
—
25
High-level STBY input current
ISTBYH
STBY = 5 V
—
30
45
μA
—
26
Low-level STBY input current
ISTBYL
STBY = 0 V
–2
―
2
μA
—
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AN44066A
„ Electrical Characteristics (continued) at VM = 24 V
Note) Ta = 25°C±2°C unless otherwise specified.
B
No.
Parameter
Symbol
Conditions
Limits
Unit Note
Min
Typ
Max
83.3
100
125
μA
—
Torque Control Block
27
Input bias current
IREFA
IREFB
VREFA = 5 V
VREFB = 5 V
28
PWM frequency1
fPWM1
PWMSW = 0.6 V
34
52
70
kHz
—
29
PWM frequency2
fPWM2
PWMSW = 2.2 V
17
26
35
kHz
—
30
Pulse blanking time
VREFA = VREFB = 0 V
0.38
0.75
1.12
μs
—
31
Comp threshold H (100%)
VTH
VREFA = VREFB = 3.3 V
IN0 = IN1 = 0.6 V
IN2 = IN3 = 0.6 V
627
660
693
mV
—
32
Comp threshold C (67%)
VTC
VREFA = VREFB = 3.3 V
IN0 = 2.2 V, IN1 = 0.6 V
IN2 = 2.2 V, IN3 = 0.6 V
410
440
470
mV
—
33
Comp threshold L (33%)
VTL
VREFA = VREFB = 3.3 V
IN0 = 0.6 V, IN1 = 2.2 V
IN2 = 0.6 V, IN3 = 2.2 V
200
220
240
mV
—
TB
Reference Voltage Block
34
Reference voltage
VS5VOUT
IS5VOUT = 0 mA
4.5
5.0
5.5
V
—
35
Output impedance
ZS5VOUT
IS5VOUT = –1.5 mA, –3.5 mA
—
18
27
Ω
—
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AN44066A
„ Electrical Characteristics (Reference values for design) at VM = 24 V
Notes) Ta = 25°C±2°C unless otherwise specified.
The characteristics listed below are reference values derived from the design of the IC and are not guaranteed by inspection.
If a problem does occur related to these characteristics, we will respond in good faith to user concerns.
B No.
Parameter
Symbol
Conditions
Reference values
Min
Typ
Max
Unit Note
Output Drivers
36
Output slew rate 1
VTr
Output voltage rising edge
—
270
—
V/μs
—
37
Output slew rate 2
VTf
Output voltage falling edge
—
330
—
V/μs
—
38
Dead time
TD
—
2.8
—
μs
—
Thermal Protection
39
Thermal protection operating
temperature
TSDon
—
150
—
ºC
—
40
Thermal protection hysteresis width
ΔTSD
—
40
—
ºC
—
40
50
60
kΩ
—
–20
—
20
%
—
PHA1 = PHB1 = 5 V
—
68
—
μA
*1
PWMSW = 5 V
—
42
—
μA
*1
VREF Block
41
Input impedance
42
Input impedance precision
ZVREFA
ZVREFB
VREFA = 5 V
VREFB = 5 V
—
I/O Block
43
High-level PHA1/PHB1 input current 2
44
High-level PWMSW input current 2
IPHAH2
IPHBH2
IPWMSWH2
Note) *1 : Refer to the “Usage Notes” (P.35) for the input current characteristics about PHA1, PHB1, PWMSW.
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AN44066A
„ Technical Data
y Circuit diagrams of the input/output part and pin function descriptions
Note) The characteristics listed below are reference values based on the IC design and are not guaranteed.
Pin
No.
Waveform
and voltage
Internal circuit
Impedance
Description
16
3k
3
5
7
9
11
13
3k
100k
―
Pin3 BOUT2
7 BOUT1
9 AOUT2
13 AOUT1
―
Pin3 : Phase B motor drive output 2
5 : Phase B current detection
7 : Phase B motor drive output 1
9 : Phase A motor drive output 2
11 : Phase A current detection
13 : Phase A motor drive output 1
―
Pin16 : Charge Pump circuit output
17 : Charge Pump capacitor
connection 2
Pin5 RCSB
11 RCSA
100k
4k
16
17
150k
―
BC2
17
125
VPUMP
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AN44066A
„ Technical Data (continued)
y Circuit diagrams of the input/output part and pin function descriptions (continued)
Note) The characteristics listed below are reference values based on the IC design and are not guaranteed.
Pin
No.
Waveform
and voltage
Internal circuit
Impedance
Description
150
18
BC1
―
18
―
Pin18 : Charge Pump capacitor
connection 1
200
Pin19 VREFA
20 VREFB
19
20
40k
―
50 kΩ
Pin19 : Phase A torque reference
voltage input
20 : Phase B torque reference
voltage input
4k
3.98k
15.91k
10k
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AN44066A
„ Technical Data (continued)
y Circuit diagrams of the input/output part and pin function descriptions (continued)
Note) The characteristics listed below are reference values based on the IC design and are not guaranteed.
Pin
No.
Waveform
and voltage
21
―
Internal circuit
Impedance
Pin21 S5VOUT
―
Description
Pin21 : Internal reference voltage
(5 V output)
21
2k
102k
Pin22 STBY
22
51.5k
22
154.5 kΩ
―
Pin22 : Standby setting
103k
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AN44066A
„ Technical Data (continued)
y Circuit diagrams of the input/output part and pin function descriptions (continued)
Note) The characteristics listed below are reference values based on the IC design and are not guaranteed.
Pin
No.
Waveform
and voltage
Internal circuit
Pin24 PWMSW
24
―
Impedance
4k
200k
Description
200 kΩ
Pin24 : PWM frequency selection
input
100 kΩ
Pin25 : Phase A phase selection input
26 : Phase B phase selection input
50k
Pin 25 PHA1
25
26
26 PHB1
―
4k
100k
50k
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AN44066A
„ Technical Data (continued)
y Circuit diagrams of the input/output part and pin function descriptions (continued)
Note) The characteristics listed below are reference values based on the IC design and are not guaranteed.
Pin
No.
27
28
29
30
31
Waveform
and voltage
Internal circuit
Impedance
Pin27 IN0
28 IN1
29 IN2
30 IN3
31 ENABLEA
―
4k
―
Pin27 : Phase A output torque
control 1
28 : Phase A output torque
control 2
29 : Phase B output torque
control 1
30 : Phase B output torque
control 2
31 : Phase A/B start/stop signal
input
―
Pin32 : VBE monitor
100k
32
―
Description
800
32
Pin32 TJMON
S5VOUT (Pin21)
VM(Pin1, Pin15)
Sym
bols
―
―
Diode
―
Zener diode
Ground
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AN44066A
„ Technical Data
y Control mode
1. Truth table
1) Control/Charge pump circuit
STBY
ENABLE
Control/Charge pump circuit
Output transistor
High
—
OFF
OFF
Low
High
ON
OFF
Low
Low
ON
ON
ENABLEA
PHA1/PHB1
AOUT1/BOUT1
AOUT2/BOUT2
Low
High
High
Low
Low
Low
Low
High
High
—
OFF
OFF
2) Output polarity
3) Output current of 2-phase excitation / half step / 1-2 phase excitation
IN0
IN2
A-ch. Output Current
B-ch. Output Current
Low
Low
(VREF / 5) × (1 / Rs)
(VREF / 5) × (1 / Rs)
High
Low
0
(VREF / 5) × (1 / Rs)
Low
High
(VREF / 5) × (1 / Rs)
0
High
High
(VREF / 5) × (1 / Rs) × (2 / 3) (VREF / 5) × (1 / Rs) × (2 / 3)
Notes) Rs : current detection region
IN1 = IN3 = Low level
4) Output current of W1-2 phase excitation
A-ch. output
IN0
IN2
IN1
A-ch. Output Current
Low
Low
Low
(VREF / 5) × (1 / Rs)
Low
Low
High
(VREF / 5) × (1 / Rs) × (1 / 3)
High
Low
Don't care
0
Low
High
Low
(VREF / 5) × (1 / Rs)
High
High
Low
(VREF / 5) × (1 / Rs) × (2 / 3)
IN0
IN2
IN3
B-ch. Output Current
Low
Low
Low
(VREF / 5) × (1 / Rs)
Low
Low
High
(VREF / 5) × (1 / Rs) × (1 / 3)
High
Low
Low
(VREF / 5) × (1 / Rs)
Low
High
Don't care
0
High
High
Low
(VREF / 5) × (1 / Rs) × (2 / 3)
Note) Rs : current detection region
B-ch. output
SDL00014AEB
Note) Rs : current detection region
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AN44066A
„ Technical Data (continued)
y Control mode (continued)
2. Output wave
1) Drive of 2-phase excitation (4steps sequence)
(IN0 to IN3 = Low)
1
2
3
4
1
A-ch.
Motor current
B-ch.
Motor current
A-ch.
Motor current
flow-in flow-out
VPHB1
B-ch.
Motor current
flow-in flow-out
VPHB1
flow-in flow-out
VPHA1
flow-in flow-out
VPHA1
FWD
2
3
4
REV
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AN44066A
„ Technical Data (continued)
y Control mode (continued)
2. Output wave (continued)
2) Drive of half step (8-steps sequence)
(IN1 = IN3 = Low)
(Ex.)
1 2 3 4 5 6 7 8
1 2 3 4 5 6 7 8
VPHB1
VPHB1
VIN0
VIN0
VIN2
VIN2
flow-out
B-ch.
Motor current
flow-in
flow-out
B-ch.
Motor current
A-ch.
Motor current
flow-in
A-ch.
Motor current
flow-in flow-out
VPHA1
flow-in flow-out
VPHA1
FWD
REV
REV
FWD
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AN44066A
„ Technical Data (continued)
y Control mode (continued)
2. Output wave (continued)
3) Drive of 1-2 phase excitation (8-steps sequence)
(IN1 = IN3 = Low)
(Ex.)
1
2
3
4
5
6
7
8
1
VPHB1
VPHB1
VIN0
VIN0
VIN2
VIN2
5
6
FWD
REV
REV
FWD
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7
8
flow-out
B-ch.
Motor current
4
flow-in
flow-out
B-ch.
Motor current
A-ch.
Motor current
flow-in
A-ch.
Motor current
3
flow-in flow-out
VPHA1
flow-in flow-out
VPHA1
2
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AN44066A
„ Technical Data (continued)
y Control mode (continued)
2. Output wave (continued)
Drive of W1-2 phase excitation (16-steps sequence)
1 2 3 4 5 6 7 8 9 101112 13 1415 16
1 2 3 4 5 6 7 8 9 1011 12 131415 16
VPHB1
VIN0
VIN0
VIN1
VIN1
VIN2
VIN2
VIN3
VIN3
A-ch.
Motor current
B-ch.
Motor current
A-ch.
Motor current
flow-in flow-out
VPHB1
B-ch.
Motor current
flow-in flow-out
VPHA1
flow-in flow-out
VPHA1
flow-in flow-out
4)
FWD
REV
REV
FWD
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AN44066A
„ Technical Data (continued)
y PD ⎯ Ta diagram
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AN44066A
„ Usage Notes
y Special attention and precaution in using
1. This IC is intended to be used for general electronic equipment and driving stepping motor.
Consult our sales staff in advance for information on the following applications:
x Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may
directly jeopardize life or harm the human body.
x Any applications other than the standard applications intended.
(1) Space appliance (such as artificial satellite, and rocket)
(2) Traffic control equipment (such as for automobile, airplane, train, and ship)
(3) Medical equipment for life support
(4) Submarine transponder
(5) Control equipment for power plant
(6) Disaster prevention and security device
(7) Weapon
(8) Others : Applications of which reliability equivalent to (1) to (7) is required
2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might
smoke or ignite.
3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In
addition, refer to the Pin Description for the pin configuration.
4. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as a solderbridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because
the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during
transportation.
5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pinVM short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short) .
And, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and
smoke emission will depend on the current capability of the power supply.
Pay special attention to the following pins so that they are not short-circuited with the VM pin, ground pin, other output pin, or
current detection pin.
(1) AOUT1 (Pin 13), AOUT2 (Pin 9), BOUT1 (Pin 7), BOUT2 (Pin 3)
(2) BC2 (Pin 17), VPUMP (Pin 16)
(3) VM1 (Pin 1), VM2 (Pin 15), S5VOUT(Pin 21)
(4) RCSA (Pin 11), RCSB (Pin 5)
The higher the current capacity of power supply is, the higher the possibility of the above destruction or smoke generation.
Therefore, it is recommended to take safety countermeasures, such as the use of a fuse.
6. When using the LSI for new models, verify the safety including the long-term reliability for each product.
7. When the application system is designed by using this LSI, be sure to confirm notes in this book.
Be sure to read the notes to descriptions and the usage notes in the book.
SDL00014AEB
22
AN44066A
„ Usage Notes (continued)
y Notes of Power LSI
1. Perform thermal design work with consideration of a sufficient margin to keep the power dissipation based on supply voltage,
load, and ambient temperature conditions.
(The IC is recommended that junctions are designed below 70% to 80% of Absolute Maximum Rating.)
2. The protection circuit is incorporated for the purpose of securing safety if the IC malfunctions.
Therefore, design the protection circuit so that the protection circuit will not operate under normal operating conditions. The
temperature protection circuit, in particular, may be destructed before the temperature protection circuit operates if the area of
safety operation of the device or the maximum rating is exceeded instantaneously due to the short-circuiting between the output
pin and VM pin or a ground fault caused by the output pin and ground pin.
3. Unless specified in the product specifications, make sure that negative voltage or excessive voltage are not applied to the pins
because the device might be damaged, which could happen due to negative voltage or excessive voltage generated during the ON
and OFF timing when the inductive load of a motor coil or actuator coils of optical pick-up is being driven.
4. The product which has specified ASO (Area of Safe Operation) should be operated in ASO.
5. Verify the risks which might be caused by the malfunctions of external components.
6. Set the value of the capacitor between the VPUMP and GND pins so that the voltage on the VPUMP (Pin 16) will not exceed
43 V in any case regardless of whether it is a transient phenomenon or not while the motor standing by is started.
7. This IC employs a PWM drive method that switches the high-current output of the output transistor. Therefore, the IC is apt to
generate noise that may cause the IC to malfunction or have fatal damage. To prevent these problems, the power supply must be
stable enough. Therefore, the capacitance between the S5VOUT and GND pins must be 0.1 μF and the one for power supply
stabilization between the VM and GND pins must be a minimum of 47 μF (recommendation) and as close as possible to the IC so
that PWM noise will not cause the IC to malfunction or have fatal damage.
SDL00014AEB
23
AN44066A
„ Usage Notes (continued)
8. Pulse blanking time
In order to prevent mistakes in current detection resulting noise, this IC is provided with a pulse blanking time of 0.75 μs (typ.).
The motor current will not be less than the current determined by the pulse blanking time. Pay utmost attention at the time of
minute current control.
Fig.1 shows the relationship between the pulse blanking time and minimum current value.
The increase or decrease in the motor current is determined by a load and a resistance of a internal winding in the motor, induced
voltage, and PWM on-duty.
Set current
Normal operation
Minimum current
Set current
The set current is
less than the
minimum current.
TB
1/fPWM
Fig. 1
RCS current waveform
fPWM : PWM frequency
TB
: Pulse blanking time
(Refer to No. 28 to No. 30 of
Electrical Characteristics)
9. VREF voltage
When VREF voltage is set to lower, an error detection of motor current might be caused by noise because Comp threshold voltage
(No.31, 32, 33 in the “Electrical Characteristics” / P.10) becomes low. Use this IC after confirming there is no error detection
when VREF voltage is less than the set value.
10. Notes on the interface
Absolute maximum ratings of Pin 19, 20, 22 and Pin 24 to Pin31 are –0.3 V to 6 V. When the current setting for a motor is large
and the lead line of GND is long, the potential of GND in this LSI will rise. Take notice that there is a possibility that potential of
the interface pin is negative compared with that of GND in this LSI even if 0 V is applied to the interface pin. At that time, pay
attention so that the input voltage of these pins might not exceed the values which are set in the allowable voltage range.
SDL00014AEB
24
AN44066A
„ Usage Notes (continued)
11. Notes at the clear of standby mode / the rise of VM supply
In this LSI, all phases are forced OFF for about 300 μs (typ.) after the clear of standby mode or the rise of VM supply. (See the
following figure.) This is why the operation mode can be started after the charge pump circuit voltage boosts efficiently at shift to
operation mode from standby mode / VM supply = OFF, when the charge pump operation stops. Therefore, the excitation patterns
input after the forced all phase OFF period are effect.
When the charge pump circuit rises slowly owing to that the capacitance value between VPUMP-GND is made large etc. and the
booster voltage cannot rise efficiently for the forced all phase OFF, the IC might overheat. In this case, clear the standby mode at
ENABLE = High or restart after VM supply is turned ON, the booster voltage rises efficiently, and ENABLE is shifted to Low.
The thermal protection is same operation as that at VM supply OFF.
[In case that standby mode is cleared]
STBY
Standby
Motor output
High
Standby
All phase OFF
Low
Standby mode clear
Forced all phase OFF
Start-up (at ENABLE = Low)
All phase OFF (at ENABLE = High)
About 300 μs(typ)
[In case that VM supply rises]
After VM supply exceeds threshold VM = 8.8 V(typ), all phases are forced OFF for about 300 μs(typ).
VM
Motor output
Low
High
All phase OFF
Forced all phase OFF
(Low voltage protection)
Start-up (at ENABLE = Low)
All phase OFF (at ENABLE = High)
About 300 μs(typ)
SDL00014AEB
25
AN44066A
„ Usage Notes (continued)
PHA1/PHB1
current [μA]
PHA1/PHB1電流[uA]
12. PWMSW, PHA1, PHB1 pins
Under conditions where VM power supply is shutdown in standby mode (STBY pin = High level), when applying approx. 0.7 V
(TYP) or more to PWMSW (Pin 24), PHA1 (Pin 25), PHB1 (Pin 26), the current flows into above-mentioned pins owing to
parasitic elements in the LSI and the current flowing into the above-mentioned pins varies from the current determined by pull
down resistance. In addition, the current flowing into PHA1/PHA2 is 341.4 μA (impedance = approx. 9.1 kΩ) at 3.3 V, while that
into PWMSW is 323.2 μA (impedance = approx. 9.7 kΩ) at 3.3 V. There is no problem that the voltage up to rating is applied to
the above-mentioned pins. However, it is recommended to set the voltage applied to the above-mentioned to 0.7 V or less at
shutdown of VM power supply in standby mode.
Also, in case of the voltage of above-mentioned pins > S5VOUT(Pin 21) – 0.2 V at power on to VM power supply, the current
flows owing to parasitic elements in the LSI, and the current flowing into the above-mentioned pins varies (refer to Fig. 2, 3).
As the same as at standby, there is no problem that the voltage up to rating is applied to the above-mentioned pins. However, it is
recommended to set the voltage applied to the above-mentioned pins to 4.3 V or less.
S5VOUT = 4.5 V
400
300
S5VOUT = 5.0 V
200
S5VOUT = 5.5 V
100
Z = 200 kΩ
0
0
1
2
3
4
5
6
ZZ=≅約4.7
kΩ
4.7 kΩ
PHA1/PHB1=4.3V
_____
PHA1/PHB1 voltage [V]
PWMSW
current [μA]
PWMSW電流[uA]
Fig. 2
Input impedance of PHA1/PHB1 at VM power supply power on
400
350
S5VOUT = 4.5 V
300
250
S5VOUT = 5.0 V
200
150
100
S5VOUT = 5.5 V
Z = 200 kΩ
50
0
0
Fig. 3
1
2
3
4
5
PWMSW=4.3V
PWMSW電圧[V]
PWMSW
voltage [V]
6
Z
kΩ
Z=≅約4.7
4.7 kΩ
Input impedance of PWMSW at VM power supply power on
SDL00014AEB
26
AN44066A
„ Usage Notes (continued)
13. In the case of measuring the chip temperature of the IC, measure the voltage of TJMON (Pin 32) and presume chip temperature
from following data. Use the following data as reference data. Before applying the IC to a product, conduct a sufficient reliability
test of the IC along with the evaluation of the product with the IC incorporated.
The temperature characteristic of TJMON
VBE[V]
ΔVBE / Δtemp = –1.82 [mV / °C]
Temp[°C]
0
150
14. Power supply start up speed and shutdown speed
Set the rising speed to 0.1 V/μs or less for VM voltage at power on to VM (Pin 1, 15).
It is recommended that the falling speed of VM voltage is set to 0.1 V/μs or less on condition of STBY = High or ENABLE = High
at shutdown. In case of shutdown at motor drive (STBY = Low and ENABLE = Low), the motor current might flow back to the
power supply and supply voltage might not fall stably.
If the rising or falling speed of power supply is too high, which might cause malfunctions or destruction on the IC. In this case,
perform the long-term reliability test and confirm the sufficient evaluation for products.
Power Supply
VM
Falling edge every 0.1 V/μs or less
Rising edge every 0.1 V/μs or less
time
SDL00014AEB
27
AN44066A
„ Usage Notes (continued)
15. RCS line
Take consideration in the following figure and the points and design PCB pattern.
(1) Point 1
Design so that the wiring to the current detection pins of this IC (RCSA, RCSB) should be thick and short in order to lower
the impedance. This is why the current cannot be detected correctly owing to the wiring impedance, and the current might
not be supplied to a motor sufficiently.
(2) Point 2
Design so that the wiring between the current detection resistor and the connector GND (Point 2 in the following figure)
should be thick and short in order to lower the impedance. As the same as Point 1, a sufficient current might not be supplied
due to the wiring impedance.
In addition, if there is a common impedance between GND and RCSA or RCSB, a peak detection may be detected by
mistake. Therefore, connect the wiring between GND and RCSA or RCSB independently.
(3) Point 3
Connect the GND of this IC to the connector on PCB independently. Separate the wiring which is a large current line
(Point 2) from that of GND, and make these wirings with one-point shorted at the connector as the following figure. That
can minimize the fluctuation of GND.
Current limit
detection resister
Point 2
Point 1
(A)
Connector GND
RCSA/RCSB
Motor
IC
Point 3
GND
16. A high current flows into this IC. Therefore, the common impedance of the PCB pattern cannot be ignored. Take the following
points into consideration and design the PCB pattern of the motor.
A high current flows into the line between the VM1 (Pin 1) and VM2 (Pin 15) pins. Therefore, noise is generated with ease at the
time of switching due to the inductance (L) of the line, which may result in the malfunctioning or destruction of the IC. (Fig. 4)
As shown in the circuit diagram on the right-hand side, the escape way of the noise is secured by connecting a capacitor to the
connector close to the VM pin of the IC. This makes it possible to suppress the direct VM pin voltage of the IC. Make the settings
as shown in the circuit diagram on Fig. 5 as much as possible.
Low spike amplitude due to
the capacitance between
the VM pin and ground pin
VM
VM
L
L
VM
VM
GND
IC
GND
IC
C
C
RCS
RCS
GND
GND
Fig. 4
Deprecated PCB
Fig. 5
SDL00014AEB
Recommended PCB
28
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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