DATA SHEET Part No. AN44065A Package Code No. HSOP042-P-0400D Publication date: October 2008 SDL00010BEB 1 AN44065A Contents Overview ……..……………………………………………………………………………………………………. 3 Features ……..……………………………………………………………………………………………………. 3 Applications Package Type ………………………………………………………………………………………………………. 3 …………………………………...………………………………………………………………………. 3 …………….………………………………………………………………………………………………… 3 Application Circuit Example (Block Diagram) ……….…………………………………………………………. 4 Pin Descriptions …………………..………………………………………………………………………………. 5 Absolute Maximum Ratings ……………………..……………..…………………………......………………… 6 Operating Supply Voltage Range …………………………………………..……………………………………. 6 Electrical Characteristics ………………….………………….…………………………………………………. 7 Electrical Characteristics (Reference values for design) Technical Data Usage Notes ……………………………………………………. 9 …………………………………….………….…………………………………………………. 10 ……….……………………….………………….…………………………………………………. 20 SDL00010BEB 2 AN44065A AN44065A Driver IC for Stepping Motor Overview AN44065A is a two channels H-bridge driver IC. Bipolar stepping motor can be controlled by a single driver IC. 2-phase,1-2 (type 2) phase, W1-2 phase can be selected. Features y 4-phase input (W 1- and 2-phase excitation enabled; exclusive OR function incorporated for simultaneous-ON prevention) y Built-in CR chopping (with frequency selected) y Built-in thermal protection and low voltage detection circuit y Built-in 5-V power supply Applications y IC for stepping motor drives Package y 28 pin plastic small outline package with heat sink (SOP type) Type y Silicon monolithic IC SDL00010BEB 3 AN44065A Application Circuit Example BC1 19 0.01 μF BC2 20 CHARGE PUMP 21 VPUMP 0.01 μF PHB1 2 ENABLEB 9 Gate Circuit IN3 6 12 BOUT2 SQ R IN2 5 13 RCSB 14 BOUT1 VREFB 24 22 VM2 TJMON 10 25 VCC PWMSW 28 0.1 μF 0.1 μF PWMSW TSD OSC BLANK VREFA 23 UVLO 47 μF 8 VM1 15 AOUT2 QS R 16 RCSA IN0 3 17 AOUT1 IN1 4 ENABLEA 7 Gate Circuit PHA1 1 S5 VOUT 27 VREF VM 26 GND 0.1 μF SDL00010BEB 4 AN44065A Pin Descriptions Pin No. Pin name Type Description 1 PHA1 Input Phase A phase selection input 2 PHB1 Input Phase B phase selection input 3 IN0 Input Phase A output torque control 1 4 IN1 Input Phase A output torque control 2 5 IN2 Input Phase B output torque control 1 6 IN3 Input Phase B output torque control 2 7 ENABLEA Input Phase A Enable/Disable CTL 8 VM1 9 ENABLEB 10 TJMON 11 N.C. 12 BOUT2 13 RCSB 14 BOUT1 Output Phase B motor drive output 1 15 AOUT2 Output Phase A motor drive output 2 16 RCSA 17 AOUT1 18 N.C ⎯ 19 BC1 Output Charge Pump capacitor connection 1 20 BC2 Output Charge Pump capacitor connection 2 21 VPUMP Output Charge Pump circuit output 22 VM2 23 VREFA Input Phase A torque reference voltage input 24 VREFB Input Phase B torque reference voltage input 25 VCC Power supply 26 GND Ground Signal ground 27 S5 VOUT Output Internal reference voltage (5-V output) 28 PWMSW Input PWM frequency selection input FIN earth ⎯ FIN Power supply Input Output ⎯ Output Input / Output Input / Output Output Power supply Motor power supply 1 Phase B Enable/Disable CTL VBE monitor use ⎯ Phase B motor drive output 2 Phase B current detection Phase A current detection Phase A motor drive output 1 ⎯ Motor power supply 2 Signal power supply SDL00010BEB 5 AN44065A Absolute Maximum Ratings A No. Parameter Symbol Rating Unit Note 1 Supply voltage1 (Pin 8, Pin 22) VM 30 V *1 2 Supply voltage2 (Pin 25) VCC – 0.3 to +6 V *1 3 Power dissipation PD 0.717 W *2 4 Operating ambient temperature Topr –20 to +70 °C *3 5 Storage temperature Tstg –55 to +150 °C *3 6 Output pin voltage (Pin 12, Pin 14, Pin 15, Pin 17) VOUT 30 V *1 7 Motor drive current (Pin 12, Pin 14, Pin 15, Pin 17) IOUT ±1.5 A *1 8 Flywheel diode current (Pin 12, Pin 14, Pin 15, Pin 17) If 1.5 A *1 Note) *1: Do not apply current or voltage from outside to any pin not listed above. In the circuit current, (+) means the current flowing into IC and (–) means the current flowing out of IC. *2: The power dissipation shown is the value in free-air for the independent IC package. When using this IC, refer to the y PD – Ta diagram in the Technical Data and use under the condition not exceeding the allowable value. *3: Except for the storage temperature, operating ambient temperature, and power dissipation all ratings are for Ta = 25°C. Operating Supply Voltage Range Parameter Symbol Range Unit Note Operating supply voltage range1 VM 18.0 to 28.0 V ⎯ Operating supply voltage range2 VCC 4.5 to 5.5 V ⎯ Note) The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. SDL00010BEB 6 AN44065A Electrical Characteristics at VM = 24 V, VCC = 5 V Note) Ta = 25°C±2°C unless otherwise specified. B No. Parameter Symbol Conditions Limits Min Typ Max Unit Not e Output Drivers 1 High-level output saturation voltage VOH I = –1.0 A VM – 0.75 VM – 0.5 — V — 2 Low-level output saturation voltage VOL I = 1.0 A — 0.55 0.825 V — 3 Flywheel diode forward voltage VDI I = 1.0 A 0.5 1.0 1.5 V — 4 Output leakage current 1 VOUT = 30 V, VRCS = 0 V — 10 50 μA — 5 Supply current (with two circuits turned off) IM ENABLEA = ENABLEB = 5 V — 3.7 5.7 mA — ICC ENABLEA = ENABLEB = 5 V — 1.4 2.2 mA — ILEAK1 I/O Block 6 Supply current 7 High-level IN input voltage VINH — 2.2 — VCC V — 8 Low-level IN input voltage VINL — GND — 0.6 V — 9 High-level IN input current IINH IN0 = IN1 = IN2 = IN3 = 5 V − 10 — 10 μA — 10 Low-level IN input current IINL IN0 = IN1 = IN2 = IN3 = 0 V − 15 — 15 μA — 11 High-level PHA1/PHB1 input voltage VPHAH VPHBH — 2.2 — VCC V — 12 Low-level PHA1/PHB1 input voltage VPHAL VPHBL — GND — 0.6 V — 13 High-level PHA1/PHB1 input current IPHAH IPHBH PHA1 = PHB1 = 5 V 25 50 100 μA — 14 Low-level PHA1/PHB1 input current IPHAL IPHBL PHA1 = PHB1 = 0 V − 15 — 15 μA — 15 High-level ENABLEA/ENABLEB input voltage VENABLEAH VENABLEBH — 2.2 — VCC V — 16 Low-level ENABLEA/ENABLEB input voltage VENABLEAL VENABLEBL — GND — 0.6 V — 17 High-level ENABLEA/ENABLEB input current IENABLEAH ENABLEA = NABLEB = 5 V IENABLEBH − 10 — 10 μA — 18 Low-level ENABLEA/ENABLEB input current IENABLEAL ENABLEA = ENABLEB = 0 V IENABLEBL − 15 — 15 μA 19 High-level PWMSW input voltage VPWMSWH — 2.2 — VCC V — 20 Low-level PWMSW input voltage VPWMSWL — GND — 0.6 V — 21 High-level PWMSW input current IPWMSWH PWMSW = 5 V 25 50 100 μA — 22 Low-level PWMSW input current IPWMSWL PWMSW = 0 V − 15 — 15 μA — SDL00010BEB 214406500705100 — 7 AN44065A Electrical Characteristics at VM = 24 V, VCC = 5 V (continued) Note) Ta = 25°C±2°C unless otherwise specified. B No. Parameter Symbol Conditions Limits Min Typ Max Unit Note Torque Control Block 23 Input bias current IREFA IREFB VREFA = VREFB = 5 V 70 99.5 130 μA — 24 PWM frequency 1 fPWM1 PWMSW = 0 V 38 58 78 kHz — 25 PWM frequency 2 fPWM2 PWMSW = 5 V 19 29 39 kHz — 26 Pulse blanking time TB VREFA = VREFB = 0 V 0.6 1.2 1.8 μs — 27 Cmp threshold H (100%) VTH IN0 = IN1 = 0 V IN2 = IN3 = 0 V 479 503 528 mV — 28 Cmp threshold C (67%) VTC IN0 = 5 V, IN1 = 0 V IN2 = 5 V, IN3 = 0 V 308 333 359 mV — 29 Cmp threshold L (33%) VTL IN0 = 0 V, IN1 = 5 V IN2 = 0 V, IN3 = 5 V 151 167 184 mV — Reference Voltage Block 30 Reference voltage VS5 VOUT VM = 24 V, IS5 VOUT = −2.5 mA 4.5 5.0 5.5 V — 31 Output impedance ZS5 VOUT VM = 24 V, IS5 VOUT = −5 mA — 14 21 Ω — SDL00010BEB 8 AN44065A Electrical Characteristics (Reference values for design) at VM = 24 V, VCC = 5 V Note) Ta = 25°C±2°C unless otherwise specified. B No. Parameter Symbol Test circuits Conditions Reference Min Typ Max Unit Note Output Drivers 32 Output slew rate 1 VTr — Rising edge — 240 — V/μs — 33 Output slew rate 2 VTf — Falling edge — 240 — V/μs — 34 Dead time TD — — — 2.2 — μs — Thermal Protection 35 Thermal protection operating temperature TSDon — — — 155 — °C — 36 Thermal protection hysteresis width ΔTSD — — — 45 — °C — Note) The above characteristics are reference values for design of the IC and are not guaranteed by inspection. If a problem does occur related to these characteristics, Panasonic will respond in good faith to user concerns. SDL00010BEB 9 AN44065A Technical Data y I/O block circuit diagrams and pin function descriptions Note) The characteristics listed below are reference values based on the IC design and are not guaranteed. Pin No. Waveform and voltage Internal circuit Impedance Description Pin 1 PHA1 2 PHB1 28 PWMSW 1 2 28 — 1 100k Pin1: Phase A phase selection input 2: Phase B phase selection input 28: PWM frequency selection input 100k 3 4 5 6 7 9 Pin 3 IN0 4 IN1 5 IN2 6 IN3 7 ENABLEA 9 ENABLEB — ― Pin3: Phase A output torque control 1 4: Phase A output torque control 2 5: Phase B output torque control 1 6: Phase B output torque control 2 7: Phase A Enable/Disable CTL 9: Phase B Enable/Disable CTL 0.6 Pin12: Phase B motor drive output 2 13: Phase B current detection 14: Phase B motor drive output 1 3 Pin 12 BOUT2 14 BOUT1 12 13 14 12 — RCSB 13 SDL00010BEB 10 AN44065A Technical Data (continued) y I/O block circuit diagrams and pin function descriptions (continued) Note) The characteristics listed below are reference values based on the IC design and are not guaranteed. Pin No. Waveform and voltage Internal circuit Impedance Description 0.6 Pin15: Phase A motor drive output 2 16: Phase A current detection 17: Phase A motor drive output 1 Pin 15 AOUT2 17 AOUT1 15 16 17 15 — RCSA 16 19 20 21 BC1 — — 19 ― BC2 VPUMP 20 21 SDL00010BEB ― Pin19: Charge Pump capacitor connection 1 Pin20: Charge Pump capacitor connection 2 21: Charge Pump circuit output 11 AN44065A Technical Data (continued) y I/O block circuit diagrams and pin function descriptions (continued) Note) The characteristics listed below are reference values based on the IC design and are not guaranteed. Pin No. Waveform and voltage Internal circuit Impedance Description Pin 23 VREFA 23 23 24 10 24 VREFB Pin23: Phase A torque reference voltage input — 50.25k 24: Phase B torque reference voltage input — TJMON ― Pin10: VBE monitor use 14 Pin27: Internal reference voltage (5-V output) 10 27 — 27 S5 VOUT SDL00010BEB 12 AN44065A Technical Data (continued) y I/O block circuit diagrams and pin function descriptions (continued) Note) The characteristics listed below are reference values based on the IC design and are not guaranteed. Pin No. Waveform and voltage Internal circuit Impedance Description — — VCC (Pin 25) VM(Pin 8, Pin 22) Symbols — Diode Zener diode Ground (FIN) SDL00010BEB 13 AN44065A Technical Data (continued) y Control mode 1. Truth table ENABLEA/ENABLEB PHA1/PHB1 AOUT1/BOUT1 AOUT2/BOUT2 "L" "H" "H" "L" "L" "L" "L" "H" "H" — OFF OFF IN0/IN2 IN1/IN3 Output Current "L" "L" (VREF / 10) × (1 / Rs *) = IOUT "H" "L" (VREF / 10) × (1 / Rs *) × (2 / 3) = IOUT "L" "H" (VREF / 10) × (1 / Rs *) × (1 / 3) = IOUT "H" "H" 0 Note) 1. ENABLEA/ENABLEB = "H“ or, IN0 = IN1 = "H"/IN2 = IN3 = "H" , output = OFF 2.*: Rs: current detection region SDL00010BEB 14 AN44065A Technical Data (continued) y Control mode (continued) 2. drive of full step (4steps sequence) (IN0 to IN3 = const.) 1 2 3 4 1 VPHB1 VPHB1 B-ch. Motor current flow-in B-ch. Motor current FWD flow-in flow-out flow-out flow-in A-ch. Motor current 4 flow-in A-ch. Motor current 3 flow-out VPHA1 flow-out VPHA1 2 REV SDL00010BEB 15 AN44065A Technical Data (continued) y Control mode (continued) 3. drive of half step (8 steps sequence) (Ex.) 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 VPHA1 VPHB1 VPHB1 VIN0 VIN0 VIN1 VIN1 VIN2 VIN2 VIN3 VIN3 flow-out flow-out VPHA1 A-ch. Motor current flow-out flow-out flow-in flow-in A-ch. Motor current B-ch. Motor current flow-in flow-in B-ch. Motor current FWD REV SDL00010BEB 16 AN44065A Technical Data (continued) y Control mode (continued) 4. 1-2 phase excitation (8 steps sequence) (Ex.) 1 2 3 4 5 6 7 8 1 VPHA1 VPHB1 VPHB1 VIN0 VIN0 VIN1 VIN1 VIN2 VIN2 VIN3 VIN3 3 4 5 6 7 8 flow-out flow-out VPHA1 2 A-ch. Motor current flow-out flow-out flow-in flow-in A-ch. Motor current B-ch. Motor current flow-in flow-in B-ch. Motor current REV FWD SDL00010BEB 17 AN44065A Technical Data (continued) y Control mode (continued) 5. W1-2 phase excitation (16 steps sequence) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 VPHA1 VPHB1 VPHB1 VIN0 VIN0 VIN1 VIN1 VIN2 VIN2 VIN3 VIN3 flow-out flow-out VPHA1 A-ch. Motor current flow-out flow-out flow-in flow-in A-ch. Motor current B-ch. Motor current flow-in flow-in B-ch. Motor current FWD REV SDL00010BEB 18 AN44065A Technical Data (continued) y PD — Ta diagram SDL00010BEB 19 AN44065A Usage Notes 1. Perform thermal design work with consideration of a sufficient margin to keep the power dissipation based on supply voltage, load, and ambient temperature conditions. (The IC is recommended that junctions are designed below 70% to 80% of Absolute Maximum Rating.) 2. The protection circuit is incorporated for the purpose of securing safety if the IC malfunctions. Therefore, design the protection circuit so that the protection circuit will not operate under normal operating conditions. The temperature protection circuit, in particular, may be destructed before the temperature protection circuit operates if the area of safety operation of the device or the maximum rating is exceeded instantaneously due to the short-circuiting between the output pin and VM pin or a ground fault caused by the output pin and ground pin. 3. Pay utmost attention to the pattern layout in order to prevent the IC from destruction resulting from the short-circuiting of pins. See Pin Descriptions for allocations of the pins of the IC. 4. When driving a motor coil or transformer (L) load, the device may be destructed as a result of a negative or excessive voltage generated at the time of turning the load on and off. Unless otherwise provided in the specifications, do not apply any negative or excessive voltage. 5. Do not make mistakes in the PCB mounting direction. If power is supplied with the pins mounted in the wrong direction, the IC may be destructed. 6. The IC may be destructed by the solder bridge between the pins of semiconductor devices. Fully make a visual check on the PCB before supplying power. Furthermore, the IC may be destructed if conductive foreign matters like solder chips are stuck to the IC during transportation after PCB mounting. Therefore, conduct full technical verification of the mounting quality of the IC. 7. The IC is destructed under an abnormal condition, such as the short-circuiting between the output and VM pins, output and ground pins, or output pins (i.e., load short-circuiting), in which case smoke may be generated. Pay utmost attention to the use of the IC. Pay special attention to the following pins so that they are not short-circuited with the VM pin, ground pin, other output pin, or current detection pin. (1) AOUT1 (pin 17), AOUT2 (pin 15), BOUT1 (pin 14), BOUT2 (pin 12) (2) BC2 (pin 20), VPUMP (pin 21) (3) VM1 (pin 8), VM2 (pin 22), VREG (pin 25) (4) RCSA (pin 16), RCSB (pin 13) The higher the current capacity of power supply is, the higher the possibility of the above destruction or smoke generation. Therefore, it is recommended to take safety countermeasures, such as the use of a fuse. 8. When using the IC for model expansion or new sets, be sure to make full safety checks including a long-term reliability check on each set. 9. Set the value of the capacitor between the VPUMP and GND pins so that the voltage on the VPUMP pin (pin 21) will not exceed 40 V in any case regardless of whether it is a transient phenomenon or not while the motor standing by is started. 10. This IC employs a PWM drive method that switches the high-current output of the output transistor. Therefore, the IC is apt to generate noise that may cause the IC to malfunction or have fatal damage. To prevent these problems, the power supply must be stable enough. Therefore, the capacitance between the VCC and GND pins must be a minimum of 0.1 μF and the one between the VM and GND pins must be a minimum of 47 μF and as close as possible to the IC so that PWM noise will not cause the IC to malfunction or have fatal damage. SDL00010BEB 20 AN44065A Usage Notes (continued) 11. In order to prevent mistakes in current detection resulting noise, this IC is provided with a pulse blanking time of 1.2 μs (typ.). The motor current will not be less than the current determined by blanking time. Pay utmost attention at the time of minute current control. The graph on the right-hand side shows the relationship between the pulse blanking time and minute current value. The increase or decrease in the motor current is determined by the resistance of the internal winding of the motor. RCS current waveform while in normal operation Set current RCS current waveform when the set current is less than the minimum current Minimum current Set current TB fPWM: PWM frequency (See No. 24,25 of Electrical Characteristics.) 1 TB: Pulse blanking time (See No. 26 of Electrical Characteristics.) fPWM 12. A high current flows into the IC. Therefore, the common impedance of the PCB pattern cannot be ignored. Take the following points into consideration and design the PCB pattern of the motor. A high current flows into the line between the VM1 (pin 8) and VM2 (pin 22) pins. Therefore, noise is generated with ease at the time of switching due to the inductance (L) of the line, which may result in the malfunctioning or destruction of the IC (see the circuit diagram on the left-hand side). As shown in the circuit diagram on the right-hand side, the escape way of the noise is secured by connecting a capacitor to the connector close to the VM pin of the IC. This makes it possible to suppress the direct VM pin voltage of the IC. Make the settings as shown in the circuit diagram on the right-hand side as much as possible. Noise is generated with ease Low spike amplitude due to the capacitance between the VM pin and ground pin Recommended PCB GND L VM IC GND IC C RCS C RCS VM L GND VM VM GND SDL00010BEB 21 AN44065A Usage Notes (continued) 13. In the case of measuring the chip temperature of the IC,measure the voltage of TJMON (pin 10) and presume chip temperature from following data. Use the following data as reference data. Before applying the IC to a product, conduct a sufficient reliability test of the IC along with the evaluation of the product with the IC incorporated. The temperature characteristic of TJMON VBE[V] ΔVBE/Δtemp = –1.85 [mV/°C] Temp [°C] 0 150 14. Power Supply Sequence ･ If two types of power supply are used Rise: This IC is recommended rise of 5 V power supply before rise of 24 V power supply. Fall : Although there is no particular rule, check that VM fall time is about 1sec. When recommended sequence is difficult, take the diagram below indicates into consideration and design. Also, rise slew rate design VM: below 0.1 V/μs, VCC: below 0.1 V/μs Power Supply VM VCC 1 sec Delay: below 100 msec time ･ If one type of power supply is used Rise slew rate design VM: below 0.1 V/μs 15. Check the risk that is caused by the failure of external components. SDL00010BEB 22 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805