For assistance or to order, call (800) 531-5782 78ST100 Series 1.5 AMP POSITIVE STEP-DOWN INTEGRATED SWITCHING REGULATOR • • • • • • • Very Small Footprint High Efficiency > 85% Self-Contained Inductor Internal Short-Circuit Protection Over-Temperature Protection Fast Transient Response Wide Input Range Pin-Out Information Standard Application Vin 1 78ST100 C1 2 GND Function 1 Vin 2 GND 3 Vout The 78ST100 is a series of wide input voltage, 3-terminal Integrated Switching Regulators (ISRs). These ISRs have a maximum output current of 1.5A and an output voltage that is laser trimmed to a variety of industry standard voltages. These 78 series regulators have excellent line and load regulation with internal shortcircuit and over-temperature protection, are very flexible, and may be used in a wide variety of applications. Ordering Information 78ST1 XX Vout 3 C2 Pin Revised 6/30/98 + GND Y C Output Voltage Package Suffix 33 = 3.3 Volts 36 = 3.6 Volts 05 = 5.0 Volts 51 = 5.1 Volts 65 = 6.5 Volts 07 = 7.0 Volts 08 = 8.0 Volts 09 = 9.0 Volts 12 = 12.0 Volts V = Vertical Mount S = Surface Mount H = Horizontal Mount C1 = Optional 1µF ceramic C2 = Required 100µF electrolytic Pkg Style 500 Specifications 78ST100 SERIES Characteristics (Ta = 25°C unless noted) Symbols Conditions Min Typ Max Units Output Current Io Over Vin range 0.1* — 1.5 A Short Circuit Current Isc Vin = Vin min — 3.5 — Apk Input Voltage Range Vin 0.1 ≤ Io ≤ 1.5A 7 7 14.5 — — — 26 30 30 V V V Output Voltage Tolerance ∆Vo Over Vin range, Io=1.5A — ±1.0 ±2.0 %Vo Line Regulation Regline Over Vin range — ±0.2 ±0.4 %Vo Load Regulation Regload 0.1 ≤ Io ≤ 1.5A — ±0.1 ±0.2 %Vo Vo Ripple/Noise Vn Vin= 9V, Io= 1.5A Vin= 16V, Io= 1.5A — 65 90 — mVpp mVpp Transient Response (with 100µF output cap) ttr 50% load change Vo over/undershoot — — 100 5 — — µSec %Vo Efficiency η Vin= 10V, Io= 1A Vin= 10V, Io= 1A Vin= 17V, Io= 1A — — — 80 85 90 — — — % % % Switching Frequency ƒo Over Vin range, Io=1.5A 600 650 700 kHz Absolute Maximum Operating Temperature Range Ta — -40 — +85 °C Recommended Operating Temperature Range Ta Free Air Convection, (40-60LFM) At Vin= 24V, Io=1.0A -40 — +80** °C Thermal Resistance θja Free Air Convection, (40-60LFM) — 45 — °C/W Vo= 3.3V Vo= 5V Vo= 12V Ta = 0°C to +60°C Vo= 5V Vo= 12V Vo= 3.3V Vo= 5V Vo= 12V Storage Temperature Ts — -40 — +125 °C Mechanical Shock — Per Mil-STD-883D, Method 2002.3 — 500 — G’s Mechanical Vibration — Per Mil-STD-883D, Method 2007.2, 20-2000 Hz, soldered in a PC board — 5 — G’s Weight — — — 6.5 — grams *ISR will operate down to no load with reduced specifications. **See Thermal Derating chart. Note: The 78ST100 Series requires a 100µF electrolytic or tantalum output capacitor for proper operation in all applications. 2 Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.powertrends.com (800) 531-5782 For assistance or to order, call 78ST100 CHARACTERISTIC 78ST105_ 5.0 VDC (See Note 1) Efficiency vs Output Current Efficiency vs Output Current 90 Efficiency vs Output Current 90 70 60 Vin 80 70 50 40 40 1.0 20.0V 25.0V 30.0V 60 50 0.5 7.0V 10.0V 15.0V 1.5 Efficiency (%) 7.0V 10.0V 15.0V 20.0V 25.0V 30.0V Efficiency (%) 80 60 1.0 0.0 1.5 0.5 1.0 Iout (A) Ripple vs Output Current Ripple vs Output Current Ripple vs Output Current 140 70 Vin 7.0V 10.0V 15.0V 20.0V 25.0V 30.0V 30 20 Ripple (mV) 40 120 60 Vin 7.0V 10.0V 15.0V 20.0V 25.0V 50 40 30 30.0V 100 Ripple (mV) 50 1.5 60 0 0 1.0 14.0V 20.0V 25.0V 30.0V 35.0V 20 10 0 Vin 80 40 20 10 0.0 0.5 Iout (A) 1.0 0.0 1.5 0.5 1.0 Iout (A) Thermal Derating (Ta) 1.5 Iout (A) Thermal Derating (Ta) (See Note 2) 1.6 1.5 Iout (A) 80 0.5 14.0V 20.0V 25.0V 30.0V 35.0V 70 40 0.5 Iout (A) 0.0 Vin 80 50 0.0 60 (See Note 1) 100 90 Vin 0.0 Ripple (mV) 78ST112_ 12.0 VDC (See Note 1) 100 100 Efficiency (%) DATA DATA SHEETS 78ST133_ 3.3 VDC Series Thermal Derating (Ta) (See Note 2) (See Note 2) 1.6 1.6 60°C 1.4 60°C 85°C Iout (A) 70°C 1 0.8 70°C 1 85°C 0.8 1 85°C 0.8 0.6 0.6 0.6 0.4 0.4 0.4 0.2 0.2 0.2 0 0 9 13 17 21 0 9 25 12 15 18 Vin (Volts) 21 24 27 30 33 36 16 39 19 22 25 Vin (Volts) Power Dissipation vs Output Current 31 34 37 40 Power Dissipation vs Output Current 1.8 2.5 1.6 1.4 7.0V 10.0V 15.0V 20.0V 25.0V 30.0V 1.0 0.8 0.6 Pd (Watts) 1.2 Vin 1.2 7.0V 10.0V 15.0V 20.0V 25.0V 30.0V 1.0 0.8 0.6 0.4 0.4 0.2 0.2 0.0 2.0 1.4 Vin 0.5 1.0 Iout (A) 1.5 14.0V 20.0V 25.0V 30.0V 35.0V 1.5 1.0 0.5 0.0 0.0 0.0 Vin Pd (Watts) 1.6 28 Vin (Volts) Power Dissipation vs Output Current 1.8 Pd (Watts) 60°C 1.2 1.2 Iout (A) 1.2 Iout (A) 1.4 1.4 70°C 0.0 0.5 1.0 1.5 0.0 0.5 Iout (A) 1.0 1.5 Iout (A) Note 1: All data listed in the above graphs, except for derating data, has been developed from actual products tested at 25°C. This data is considered typical data for the ISR. Note 2: Thermal derating graphs are developed in free air convection cooling of 40-60 LFM. (See Thermal Application Notes.) Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.powertrends.com 3 PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp NRND SIP MODULE EFA 3 25 Pb-Free (RoHS) Call TI N / A for Pkg Type 78ST105SC NRND SIP MODULE EFC 3 25 Pb-Free (RoHS) Call TI Level-1-215C-UNLIM OBSOLETE SIP MODULE TBD Call TI Call TI 25 Pb-Free (RoHS) Call TI N / A for Pkg Type EFC 3 SIP MODULE EFD 3 78ST107HC OBSOLETE SIP MODULE EFA 3 TBD Call TI Call TI 78ST105VC NRND 78ST107SC OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST107SCT OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST107VC OBSOLETE SIP MODULE EFD 3 TBD Call TI Call TI 78ST108HC OBSOLETE SIP MODULE EFA 3 TBD Call TI Call TI 78ST108SC OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST108SCT OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST108VC OBSOLETE SIP MODULE EFD 3 TBD Call TI Call TI SIP MODULE EFC 3 TBD Call TI Call TI 78ST109SCT OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST109TC OBSOLETE SIP MODULE EFT 3 TBD Call TI Call TI 78ST109SC NRND 78ST112HC NRND SIP MODULE EFA 3 25 Pb-Free (RoHS) Call TI N / A for Pkg Type 78ST112SC NRND SIP MODULE EFC 3 25 Pb-Free (RoHS) Call TI Level-1-215C-UNLIM 78ST112SCT OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST112TC OBSOLETE SIP MODULE EFT 3 TBD Call TI Call TI 78ST112VC NRND SIP MODULE EFD 3 25 Pb-Free (RoHS) Call TI N / A for Pkg Type 78ST133HC NRND SIP MODULE EFA 3 25 Pb-Free (RoHS) Call TI N / A for Pkg Type NRND SIP MODULE EFC 3 25 Pb-Free (RoHS) Call TI Level-1-215C-UNLIM OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST133SC 78ST133SCT 78ST133VC NRND 25 SIP MODULE EFD 3 Pb-Free (RoHS) Call TI N / A for Pkg Type 78ST136SC OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST136SCT OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST136VC OBSOLETE SIP MODULE EFD 3 TBD Call TI Call TI 78ST151HC OBSOLETE SIP MODULE EFA 3 TBD Call TI Call TI 78ST151SC OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST151SCT OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI Addendum-Page 1 Samples (Requires Login) 78ST105HC 78ST105SCT (3) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 78ST151VC 23-Aug-2012 Status (1) Package Type Package Drawing OBSOLETE SIP MODULE Pins EFD 3 Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp TBD Call TI Call TI NRND SIP MODULE EFA 3 25 Pb-Free (RoHS) Call TI N / A for Pkg Type 78ST165SC NRND SIP MODULE EFC 3 25 Pb-Free (RoHS) Call TI Level-1-215C-UNLIM OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI EFD 3 TBD Call TI Call TI 78ST165VC NRND SIP MODULE Samples (Requires Login) 78ST165HC 78ST165SCT (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated