(800) 531-5782 For assistance or to order, call 78ST200 Series 2 AMP POSITIVE STEP-DOWN INTEGRATED SWITCHING REGULATOR • • • • • • High Efficiency > 82% Wide Input Range Self-Contained Inductor Short-Circuit Protection Over-Temperature Protection Fast Transient Response Pin-Out Information The 78ST200 is a series of wide input voltage, 3 terminal Integrated Switching Regulators (ISRs). Employing a ceramic substrate, these ISRs have a maximum output current of 2A. The output voltage is laser trimmed for high accuracy. The 78ST200 series regulators have internal short-circuit and overtemperature protection and may be used in a wide variety of applications. Ordering Information 78ST2 XX Pin No. Function Standard Application Vin 1 78ST200 C1 2 C2 GND Y C 1 Vin 2 GND Output Voltage Package Suffix 3 Vout 33 = 3.3 Volts 35 = 3.45 Volts 05 = 5.0 Volts V = Vertical Mount S = Surface Mount H = Horizontal Mount Vout 3 Revised 6/30/98 + GND (For dimensions and PC board layout see Package Style 500.) C1 = Optional 1µF ceramic C2 = Required 100µF electrolytic Specifications 78ST200 SERIES Characteristics (Ta = 25°C unless noted) Symbols Conditions Min Typ Max Units Output Current Io Over Vin range 0.1* — 2.0 A Input Voltage Range Vin Io = 0.1 to 3.0A 7 8 — — 15 20 V V Output Voltage Tolerance ∆V o — ±1.0 ±2.0 %Vo %Vo Vo < 3.5V Vo = 5.0V Over Vin range, Io = 2.0A Ta = 0°C to +60°C Line Regulation Regline Over Vin range — ±0.4 ±0.8 Load Regulation Regload 0.1 ≤ Io ≤ 2.0A — ±0.2 ±0.4 %Vo Ripple/Noise Vn Vin = Vin min, Io = 2.0A — 1 — %Vo Transient Response (with 100µF output cap) ttr 50% load change Vo over/undershoot — 100 5.0 — µSec %Vo Efficiency η Vin = 9V, Io = 2.0A, Vo = 5V — 82 — % Switching Frequency ƒo Over Vin and Io ranges 0.95 1.0 1.05 MHz Absolute Maximum Operating Temperature Range Ta — -40 — +85 °C Recommended Operating Temperature Range Ta Free Air Convection, (40-60LFM) Over Vin and Io ranges -40 — Thermal Resistance θja Free Air Convection, (40-60LFM) — 38 — °C/W Storage Temperature Ts — -40 — +125 °C Mechanical Shock — Per Mil-STD-883D, Method 2002.3 — 500 — G’s Mechanical Vibration — Per Mil-STD-883D, Method 2007.2, 20-2000 Hz, soldered in a PC board — 5 — G’s Weight — — — 7 — Grams +85** * ISR will operate down to no load with reduced specifications. ** See Thermal Derating chart. Note: The 78ST200 Series requires a 100µF electrolytic or tantalum output capacitor for proper operation in all applications. Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.powertrends.com °C For assistance or to order, call (800) 531-5782 78ST200 CHARACTERISTIC DATA 78ST233_ 3.3 VDC 78ST205_ 5.0 VDC (See Note 1) (See Note 1) Efficiency vs Output Current Efficiency vs Output Current 100 100 90 Vin 80 7.0V 8.0V 10.0V 70 12.0V 15.0V 60 Efficiency (%) Efficiency (%) 90 50 Vin 80 7.5V 9.0V 70 12.0V 15.0V 20.0V 60 50 40 40 0.0 0.5 1.0 1.5 0.0 2.0 0.5 1.0 Iout (A) 1.5 2.0 Iout (A) Ripple vs Output Current Ripple vs Output Current 30 30 25 25 Vin 20 7.0V 8.0V 10.0V 12.0V 15.0V 15 10 Ripple (mV) Ripple (mV) Series 5 Vin 20 7.5V 9.0V 12.0V 15.0V 20.0V 15 10 5 0 0 0.0 0.5 1.0 1.5 0.0 2.0 0.5 1.0 Iout (A) Thermal Derating (Ta) 1.5 2.0 Iout (A) Thermal Derating (Ta) (See Note 2) (See Note 2) 2.0 2.0 70°C No Derating @ 85°C 85°C 1.5 Iout (A) Iout (A) 1.5 1.0 0.5 1.0 0.5 0.0 0.0 7 9 11 13 15 8 10 12 Vin (Volts) 16 18 20 Vin (Volts) Power Dissipation vs Output Current Power Dissipation vs Output Current 2.0 2.0 1.5 1.5 Vin 7.0V 8.0V 10.0V 12.0V 15.0V 1.0 Vin PD Watts) PD (Watts) 14 7.5V 9.0V 12.0V 1.0 15.0V 20.0V 0.5 0.5 0.0 0.0 0.0 0.5 1.0 Iout (A) 1.5 2.0 0.0 0.5 1.0 1.5 2.0 Iout (A) Note 1: All data listed in the above graphs, except for derating data, has been developed from actual products tested at 25°C. This data is considered typical data for the ISR. Note 2: Thermal derating graphs are developed in free air convection cooling of 40-60 LFM. (See Thermal Application Note) Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.powertrends.com PACKAGE OPTION ADDENDUM www.ti.com 13-May-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing 78ST205HC NRND SIP MOD ULE EFA 3 25 TBD Call TI Level-1-215C-UNLIM 78ST205SC NRND SIP MOD ULE EFC 3 25 TBD Call TI Level-1-215C-UNLIM OBSOLETE SIP MOD ULE EFC 3 TBD Call TI Call TI 78ST205SCT Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 78ST205VC NRND SIP MOD ULE EFD 3 25 TBD Call TI Level-1-215C-UNLIM 78ST233HC NRND SIP MOD ULE EFA 3 25 TBD Call TI Level-1-215C-UNLIM 78ST233SC NRND SIP MOD ULE EFC 3 25 TBD Call TI Level-1-215C-UNLIM 78ST233VC NRND SIP MOD ULE EFD 3 25 TBD Call TI Level-1-215C-UNLIM 78ST235HC NRND SIP MOD ULE EFA 3 TBD Call TI Call TI 78ST235SC OBSOLETE SIP MOD ULE EFC 3 TBD Call TI Call TI 78ST235VC OBSOLETE SIP MOD ULE EFD 3 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2005, Texas Instruments Incorporated