TI PT5062C

PT5060 Series
9-W +5V-Input Dual-Output
Integrated Switching Regulator
SLTS027B
(Revised 12/19/2001)
Features
Description
• Single Device: +5V Input
• Complimentary Dual Output:
±12V, ±15V
• Wide Input Voltage Range
• 85% Efficiency
• Adjustable Output Voltage
• Laser-trimmed
The PT5060 series of dual-output
Integrated Switching Regulators (ISRs)
provide a complimentary ±12V or ±15V
from a single +5V input. Applications
include systems that require power for
analog interface circuitry, such as D/A
and A/D converters, and Op Amps. The
output voltage can be adjusted with an
external resistor. These ISRs are made
available in a 12-pin single in-line pin
(SIP) package. Note that these modules
are are not short-circuit protected.
Pin-Out Information
Standard Application
V o adj
11
V in
3,4,5
PT5060
–Vo 2
2
GND
3
Vin
PT Series Suffix (PT1234 x )
4
Vin
Case/Pin
Configuration
5
Vin
8,9,10
+Vo 1
6
GND
7
GND
8
+Vo1
9
+Vo1
10
+
COM
COM
C1 = Required 100µF electrolytic
Specifications
1
–V o 2
C1
100 µF
PT5061¨ = ±12 Volts
PT5062¨ = ±15 Volts
Function
1
2,6,7
Ordering Information
Pin
Order
Suffix
Package
Code *
N
A
C
R
G
B
(ECD)
(ECA)
(ECC)
(ECE)
(ECG)
(ECK)
+Vo1
Vertical
Horizontal
SMD
Vertical, Side Tabs
Horizontal, Side Tabs
SMD, Side Tabs
11
Vo Adj
* Previously known as package style 300.
12
Do Not Connect
(Reference the applicable package code drawing
for the dimensions and PC board layout)
(Unless otherwise stated, Ta =25°C, Vin =+5V, I o =Io max, C1 =100µF)
PT5060 SERIES
Characteristics
Symbol
Conditions
Output Current
Io
Over Vin range
Current Limit
Ilim
Inrush Current
On start up
Input Voltage Range
Iir
ttr
Vin
Output Voltage Tolerance
∆Vo
Over Vin and Io ranges
Ta= 0°C to SOA limit (3)
Line Regulation
Regline
Over Vin range
Load Regulation
Regload
0.1 ≤ Io ≤ Iomax
Vo Ripple (pk-pk)
Vn
20MHz bandwidth
Transient Response
ttr
Vos
25% load change
Vo over/undershoot
Min
Typ
Max
Units
Vo1 = +12V
Vo2 = –12V
0.05
0.05 (1)
—
—
0.50
0.25
A
Vo1 = +15V
Vo2 = –15V
0.05
0.05 (1)
—
—
0.40
0.20
A
—
%Iomax
—
—
+Vo –1
A
mSec
V
Over Io range
+Vo1
–Vo2
+Vo1
–Vo2
—
150
(2)
—
—
4.75
5.5
2
—
(3)
—
—
±1.5
±5
±3.0
±10
%Vo
—
±0.5
±1.0
%Vo
—
±0.5
±1.0
%Vo
—
—
±1.5
±2
±3
±3
%Vo
—
—
100
3
—
5
µSec
%Vo
Efficiency
η
Io=0.2A each output
—
85
—
%
Switching Frequency
ƒs
Over Vin and Io ranges
—
650
—
kHz
Operating Temperature Range
Ta
—
0
—
+85 (4)
°C
Storage Temperature
Ts
–40
—
+125
°C
G’s
Mechanical Shock
Per Mil-STD-883D, Method 2002.3,
1 msec, Half Sine, mounted to a fixture
—
500
—
Mechanical Vibration
Per Mil-STD-883D, Method 2007.2
20-2000 Hz, Soldered in a PC board
—
15
—
G’s
—
6.5
—
Weight
Notes: (1)
(2)
(3)
(4)
Do not operate thes negative output rail of these ISRs below the minimum load.
ISRs based on a boost topology are not short-circuit protected.
The inrush current stated is above the normal input current for the associated output load.
See Safe Operating Area curves or consult the factory for the appropriate derating.
For technical support and more information, see inside back cover or visit www.ti.com
grams
Typical Characteristics
PT5060 Series
9-W +5V-Input Dual-Output
Integrated Switching Regulator
PT5061 +/- 12VDC
PT5062 +/- 15V
(See Note A)
Efficiency vs Output Current
(See Note A)
Efficiency vs Output Current
100
100
90
90
Vin
11.0V
70
8.0V
7.0V
60
5.0V
-12V load=0.2Adc
+12Vout 0-0.5Adc
50
Efficiency - %
Efficiency - %
Vin
80
4.75V
80
14.0V
12.0V
10.0V
7.0V
5.0V
4.75V
70
60
-15V load=0.2Adc
+15Vout 0-0.4Adc
50
40
40
0
0.1
0.2
0.3
0.4
0.5
0
0.1
Ripple Voltage vs Output Current
0.3
0.4
Ripple Voltage vs Output Current
300
100
-12V load=0.2Adc
+12Vout 0-0.5Adc
-15V load= 0.2Adc
+15Vout 0-0.4Adc
250
80
Vin
4. 75V
60
5.0V
7.0V
8.0V
40
11.0V
Ripple-(mV)
Ripple-(mV)
0.2
Iout-(Amps)
Iout-(Amps)
Vin
200
4.75V
5.0V
7.0V
10.0V
12.0V
14.0V
150
100
20
50
0
0
0
0. 1
0. 2
0. 3
0. 4
0. 5
0
0.1
Iout-(Amps)
0.2
0.3
0.4
Iout-(Amps)
Power Dissipation vs Output Current
Power Dissipation vs Output Current
2
2
-15V load=0.2Adc
+15Vout 0-0.4Adc
-12V load=0.2Adc
+12Vout 0-0.5Adc
1.6
1.6
Vin
Vin
1.2
5.0V
7.0V
8.0V
0.8
11.0V
PD-(Watts)
PD-(Watts)
4.75V
0.4
4.75V
5.0V
7.0V
10.0V
12.0V
14.0V
1.2
0.8
0.4
0
0
0
0.1
0.2
0.3
0.4
0.5
0
0.1
Iout-(Amps)
80
80
70
Airflow
60
100 LFM
60 LFM
0 LFM
50
40
30
20
0.1
0.2
0.3
0.4
Safe Operating Area Vin = 5.0V, lo2 = 0.2A (See Note B)
90
0.3
0.4
Maximum Positive Output Current (A)
0.5
Ambient Temperature (°C)
Ambient Temperature (°C)
Safe Operating Area, Vin =5.0V; lo2 = 0.25A (See Note B)
90
0.0
0.2
Iout-(Amps)
70
Airflow
60
100 LFM
60 LFM
50
0 LFM
40
30
20
0.0
0.1
0.2
0.3
0.4
Maximum Positive Output Current (A)
Note A: Characteristic data has been developed from actual products tested at 25°C. This data is considered typical data for the Converter.
Note B: Thermal derating graphs are developed in free-air convection cooling, which corresponds to approximately 40–60LFM of airflow.
For technical support and more information, see inside back cover or visit www.ti.com
Application Notes
PT5060 Series
Adjusting the Output Voltage of the PT5060
Dual-Output Boost Converter Series
The values of (R1) [adjust down], and R2 [adjust up], can
also be calculated using the following formulas.
The dual output voltage of the PT5060 series modules
can be adjusted higher or lower than the factory pre-set
voltage with the addition of a single external resistor.
Table 1 gives the applicable adjustment range for each
model in the series as Va (min) and Va (max).
(R1)
=
3.65 (Va – 2.5 )
- 0.1
(Vo – Va)
kΩ
Adjust Up: An increase in the output voltage is obtained
by adding a resistor R2, between pin 11 (Vo adj) and pins
2, 6, or 7 (GND).
R2
=
9.125
Va - Vo
kΩ
Adjust Down: Add a resistor (R1), between pin 11 (Vo adj)
and pins 8, 9 or 10 (Vo1).
Refer to Figure 1 and Table 2 for both the placement and value
of the required resistor, either (R1) or R2 as appropriate.
Notes:
1. Both the positive and negative voltage outputs from the
ISR are adjusted simultaneously.
2. Use only a single 1% resistor in either the (R1) or R2
location. Place the resistor as close to the ISR as possible.
3. Never connect capacitors from Vo adj to either GND or
Vo. Any capacitance added to the Vo adjust pin will affect
the stability of the ISR.
4. An increase in the output voltage must be accompanied by
a corresponding reduction in the specified maximum
current at each output. For Vo1 and –Vo2, the revised
maximum output current must be reduced to the
equivalent of 6 watts and 3 watts respectively. i.e.
6
Io1 (max)
=
Adc
Va
and
Io2 (max)
=
3
Adc,
Va
where Va is the adjusted output voltage.
5. Adjustments to the output voltage will also limit the
maximum input voltage that can be applied to the ISR.
The maximum input voltage that may be applied is limited
to (Vo – 1)Vdc or 14Vdc, whichever is less.
Figure 1
–Vo 2
V in
3,4,5
V in
PT5060
GND
2,6,7
V o(adj)
11
+ V o1
1
–V o 2
8,9,10
+Vo 1
( R 1)
Adj Down
C out
1 0 0 µF
+
R2
Adjust Up
COM
COM
Where:
- 0.1
Vo = Original output voltage
Va = Adjusted output voltage
Table 1
PT5060 ADJUSTMENT AND FORMULA PARAMETERS
Series Pt #
PT5061
Vo (nom)
Va (min)
±12.0V
PT5062
± 7.5V
± 7.5V
Va (max)
±14.0V
±20.0V
±15.0V
Table 2
PT5060 ADJUSTMENT RESISTOR VALUES
Series Pt #
Current
Vo(nom)
Va(req’d)
7.0
7.5
8.0
8.5
9.0
9.5
10.0
10.5
11.0
11.5
12.0
12.5
13.0
13.5
14.0
14.5
15.0
15.5
16.0
16.5
17.0
17.5
18.0
18.5
19.0
19.5
20.0
R1 = (Blue)
For technical support and more information, see inside back cover or visit www.ti.com
PT5061
0.5/0.25Adc
±12.0Vdc
PT5062
0.4/0.2Adc
±15.0Vdc
(4.0)kΩ
(4.9)kΩ
(6.2)kΩ
(7.8)kΩ
(10.1)kΩ
(13.6)kΩ
(19.4)kΩ
(30.9)kΩ
(65.6)kΩ
(2.3)kΩ
(2.8)kΩ
(3.3)kΩ
(3.9)kΩ
(4.6)kΩ
(5.4)kΩ
(6.4)kΩ
(7.7)kΩ
(9.3)kΩ
(11.5)kΩ
(14.5)kΩ
(19.1)kΩ
(26.7)kΩ
(41.9)kΩ
(87.5)kΩ
18.2kΩ
9.0kΩ
6.0kΩ
4.5kΩ
18.2kΩ
9.0kΩ
6.0kΩ
4.5kΩ
3.6kΩ
2.9kΩ
2.5kΩ
2.2kΩ
1.9kΩ
1.7kΩ
R2 = Black
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jan-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Samples
(3)
(Requires Login)
PT5061A
LIFEBUY SIP MODULE
ECA
12
12
Pb-Free
(RoHS)
Call TI
N / A for Pkg Type
PT5061C
LIFEBUY SIP MODULE
ECC
12
12
Pb-Free
(RoHS)
Call TI
Level-1-215C-UNLIM
PT5061N
LIFEBUY SIP MODULE
ECD
12
12
Pb-Free
(RoHS)
Call TI
N / A for Pkg Type
PT5061R
LIFEBUY SIP MODULE
ECE
12
12
Pb-Free
(RoHS)
Call TI
N / A for Pkg Type
PT5062A
LIFEBUY SIP MODULE
ECA
12
12
Pb-Free
(RoHS)
Call TI
N / A for Pkg Type
PT5062C
LIFEBUY SIP MODULE
ECC
12
12
Pb-Free
(RoHS)
Call TI
Level-1-215C-UNLIM
PT5062G
LIFEBUY SIP MODULE
ECG
12
12
Pb-Free
(RoHS)
Call TI
N / A for Pkg Type
PT5062N
LIFEBUY SIP MODULE
ECD
12
12
Pb-Free
(RoHS)
Call TI
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jan-2013
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated