PT5040 Series 1-A Positive Step-up Integrated Switching Regulator SLTS026B (Revised 12/19/2001) Standard Application +Vin 1 PT5040 2 C1 +Vout 3 C2 C3 100µF COM Features Description • Wide Input Voltage Range • 85% Efficiency • Internal Over-Temperature Protection • Laser-trimmed Output Voltage • Soft Start • 5-Pin Mount Option (Suffixes L & M) The PT5040 is a series of 3-pin boost-voltage Integrated Switching Regulators (ISRs). These ISRs are designed for use with +5V bus systems that require an additional regulated +8V to +20V with up to 1A of output current. These ISRs are packaged in the 3-pin, single in-line pin (SIP) package configuration. Pin-Out Information Ordering Information PT Series Suffix (PT1234x ) Pin PT5041o = +12 Volts PT5042o = +15 Volts PT5044o = +8 Volts PT5045o = +9 Volts PT5046o = +10 Volts PT5047o = +18 Volts PT5048o = +12.6 Volts PT5049o = +20 Volts Case/Pin Configuration Function 1 Vin 2 GND 3 Vout + COM Package Code * N A C M L (EAD) (EAA) (EAC) (EAM) (EAL) Vertical Horizontal SMD Horizontal, 2-pin Tab SMD, 2-Pin Tab * Previously known as package styles 100/110. (Reference the applicable package code drawing for the dimensions and PC board layout) C 1 = Optional ceramic (1-5µF) C 2 = Optional ceramic (1-5µF) C 3 = Required Electrolytic (100µF) Specifications Order Suffix NOTE: Boost Topology ISRs are not Short-Circuit Protected. (Unless otherwise stated, T a =25°C, Vin =5V, I o =Iomax, C3 =100µF) PT5040 SERIES Characteristics Symbol Conditions Output Current Io Over Vin range Min PT5049 PT5047 PT5041/48 PT5042 PT5044 PT5045/46 Typ Max Units 0.1 (1) 0.1 (1) 0.1 (1) 0.1 (1) 0.1 (1) 0.1 (1) — — — — — — 0.5 0.6 1.0 0.75 1.5 1.2 A 4.75 4.75 — — (Vo–1) 14 V Input Voltage Range Vin Over Io range Output Voltage Tolerance ∆Vo Over Vin Range Ta= -20°C to SOA derating limit (3) — ±1.5 ±3.0 %Vo Line Regulation Regline Over Vin range — ±0.5 ±1.0 %Vo Load Regulation Regload Iomin ≤ Io ≤ Iomax — ±0.5 ±1.0 %Vo Efficiency η Io=0.5A — 85 — % Vo Ripple (pk-pk) Vr 20MHz bandwidth — ±2 ±5 %Vo Transient Response ttr Vos 25% load change Vo over/undershoot — — 500 3.0 — 5.0 µSec %Vo Current Limit Inrush Current Ilim Iir tir On start up — — — 150 (2) 5.5 (3) 1 — — — %Iomax A mSec Switching Frequency ƒs Over Vin and Io ranges 500 650 650 800 800 950 Operating Temperature Range Ta — -20 — +85 Thermal Resistance θja Free Air Convection (40-60LFM) — 40 — °C/W Storage Temperature Ts -40 — +125 °C PT5047/5049 Vo<15V Vo>15V kHz (4) °C Mechanical Shock Per Mil-STD-883D, Method 2002.3 1 msec, Half Sine, mounted to a fixture 500 — G’s Mechanical Vibration Per Mil-STD-883D, 20-2000 Hz Suffixes N, A, & C Suffixes L & M — — 5 20 (5) — — G’s Weight Suffixes N, A, & C Suffixes L & M — — 4.5 6.5 — — grams Notes: (1) (2) (3) (4) (5) — The ISR will operate at no load with reduced specifications. Boost topology ISRs are not short circuit protected. The inrush current stated is above the normal input current for the associated output load. See Safe Operating Area curves or consult the factory for the appropriate derating The tab pins on the 5-pin mount package types (suffixes L & M) must be soldered. For more information see the applicable package outline drawing. For technical support and more information, see inside back cover or visit www.ti.com Typical Characteristics PT5040 Series 1-A Positive Step-up Integrated Switching Regulator PT5041, +12.0 VDC PT5042, +15.0 VDC (See Note A) Efficiency vs Output Current Efficiency vs Output Current 100 10 0 90 Efficiency - % Efficiency - % 90 V in 80 11.0V 8.0V 70 6.0V 60 80 V in 14.0V 12.0V 10.0V 8.0V 6.0V 5.0V 70 60 5.0V 50 50 40 40 0 0 .2 0 .4 0 .6 0 .8 0 1 0.1 5 Ripple Voltage vs Output Current 0 .6 0.7 5 Ripple Voltage vs Output Current 20 0 Ripple-(mV) Ripple-(mV) 0.4 5 250 25 0 V in 5.0V 15 0 6.0V 8.0V 10 0 200 V in 5.0V 6.0V 8.0V 10.0V 12.0V 14.0V 150 100 11.0V 50 50 0 0 0 0 .2 0 .4 0 .6 0 .8 1 0 0.15 Iout-(Amps) 0 .3 0.45 0 .6 0.75 Iout-(Amps) Power Dissipation vs Output Current Power Dissipation vs Output Current 2.5 3 2.5 2 PD-(Watts) PD-(Watts) 0 .3 Iout-(Amps) Iout-(Amps) Vin 1.5 5.0V 6.0V 1 Vin 2 5.0V 6.0V 8.0V 10.0V 12.0V 14.0V 1.5 8.0V 1 11.0V 0.5 0.5 0 0 0 0.2 0.4 0.6 0.8 1 0 Iout-(Amps) 0.15 0.3 0.45 0.6 0.75 Iout-(Amps) Safe Operating Area (VIN=5V) (See Note B) Safe Operating Area (VIN=5V) (See Note B) 90 90 80 70 60 Airflow 50 0 LFM 60 LFM 40 90 LFM 30 Ambient Temperature - (C°) Ambient Temperature - (C°) (See Note A) 80 70 60 Airflow 50 0 LFM 60 LFM 40 90 LFM 30 20 0 0.2 0.4 0.6 0.8 Maximum Output Current - (Amps) 1 20 0.00 0.25 0.50 0.75 Maximum Output Current - (Amps) Note A: Characteristic data has been developed from actual products tested at 25°C. This data is considered typical data for the Converter. Note B: Thermal derating graphs are developed in free-air convection cooling, which corresponds to approximately 40–60LFM of airflow. For technical support and more information, see inside back cover or visit www.ti.com PACKAGE OPTION ADDENDUM www.ti.com 10-Jan-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish MSL Peak Temp Samples (3) (Requires Login) (2) PT5041A LIFEBUY SIP MODULE EAA 3 35 Pb-Free (RoHS) Call TI N / A for Pkg Type PT5041C LIFEBUY SIP MODULE EAC 3 35 Pb-Free (RoHS) Call TI Level-1-215C-UNLIM PT5041J OBSOLETE SIP MODULE EAJ 3 TBD Call TI Call TI PT5041L LIFEBUY SIP MODULE EAL 3 35 Pb-Free (RoHS) Call TI Level-1-215C-UNLIM PT5041M LIFEBUY SIP MODULE EAM 3 35 Pb-Free (RoHS) Call TI N / A for Pkg Type PT5041N LIFEBUY SIP MODULE EAD 3 35 Pb-Free (RoHS) Call TI N / A for Pkg Type PT5042A LIFEBUY SIP MODULE EAA 3 35 Pb-Free (RoHS) Call TI N / A for Pkg Type PT5042L LIFEBUY SIP MODULE EAL 3 35 Pb-Free (RoHS) Call TI Level-1-215C-UNLIM PT5042M LIFEBUY SIP MODULE EAM 3 35 Pb-Free (RoHS) Call TI N / A for Pkg Type PT5042N LIFEBUY SIP MODULE EAD 3 35 Pb-Free (RoHS) Call TI N / A for Pkg Type PT5044A LIFEBUY SIP MODULE EAA 3 35 Pb-Free (RoHS) Call TI N / A for Pkg Type PT5044C LIFEBUY SIP MODULE EAC 3 35 Pb-Free (RoHS) Call TI Level-1-215C-UNLIM PT5044L OBSOLETE SIP MODULE EAL 3 TBD Call TI Call TI PT5044M LIFEBUY SIP MODULE EAM 3 35 Pb-Free (RoHS) Call TI N / A for Pkg Type PT5044N LIFEBUY SIP MODULE EAD 3 35 Pb-Free (RoHS) Call TI N / A for Pkg Type PT5045A LIFEBUY SIP MODULE EAA 3 35 Pb-Free (RoHS) Call TI N / A for Pkg Type PT5045C OBSOLETE SIP MODULE EAC 3 TBD Call TI Call TI PT5046A OBSOLETE SIP MODULE EAA 3 TBD Call TI Call TI PT5046M LIFEBUY SIP MODULE EAM 3 Pb-Free (RoHS) Call TI N / A for Pkg Type Addendum-Page 1 35 PACKAGE OPTION ADDENDUM www.ti.com 10-Jan-2013 Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish MSL Peak Temp Samples (3) (Requires Login) (2) PT5046N LIFEBUY SIP MODULE EAD 3 35 Pb-Free (RoHS) Call TI N / A for Pkg Type PT5047C LIFEBUY SIP MODULE EAC 3 35 Pb-Free (RoHS) Call TI Level-1-215C-UNLIM PT5047H LIFEBUY SIP MODULE EAH 3 16 Pb-Free (RoHS) Call TI N / A for Pkg Type PT5048A LIFEBUY SIP MODULE EAA 3 35 Pb-Free (RoHS) Call TI N / A for Pkg Type PT5048C OBSOLETE SIP MODULE EAC 3 TBD Call TI Call TI PT5049A LIFEBUY SIP MODULE EAA 3 35 Pb-Free (RoHS) Call TI N / A for Pkg Type PT5049C OBSOLETE SIP MODULE EAC 3 TBD Call TI Call TI PT5049N LIFEBUY SIP MODULE EAD 3 35 Pb-Free (RoHS) Call TI N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 10-Jan-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated