CYPRESS CY7C106BN

CY7C106BN
256K x 4 Static RAM
Features
Functional Description
The CY7C106BN is a high performance CMOS static RAMs
organized as 262,144 words by 4 bits. Easy memory expansion
is provided by an active LOW Chip Enable (CE), an active LOW
Output Enable (OE), and tristate drivers. These devices have an
automatic power down feature that reduces power consumption
by more than 65% when the devices are deselected.
■
High speed
❐ tAA = 15 ns
■
CMOS for optimum speed/power
■
Low active power
❐ 495 mW
■
Low standby power
❐ 275 mW
■
2.0V data retention (optional)
■
Automatic power down when deselected
■
TTL-compatible inputs and outputs
Writing to the devices is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. Data on the four I/O
pins (I/O0 through I/O3) is then written into the location specified
on the address pins (A0 through A17).
Reading from the devices is accomplished by taking Chip Enable
(CE) and Output Enable (OE) LOW while forcing Write Enable
(WE) HIGH. Under these conditions, the contents of the memory
location specified by the address pins will appear on the four I/O
pins.
The four input/output pins (I/O0 through I/O3) are placed in a high
impedance state when the devices are deselected (CE HIGH),
the outputs are disabled (OE HIGH), or during a write operation
(CE and WE LOW).
The CY7C106BN is available in a standard 400-mil-wide SOJ.
Logic Block Diagram
SENSE AMPS
A1
A2
A3
A4
A5
A6
A7
A8
A9
ROW DECODER
INPUT BUFFER
512 x 512 x 4
ARRAY
POWER
DOWN
Cypress Semiconductor Corporation
Document #: 001-06429 Rev. *A
•
198 Champion Court
I/O2
I/O1
I/O0
CE
WE
17
16
15
13
14
12
11
10
A0
COLUMN
DECODER
I/O3
OE
•
San Jose, CA 95134-1709
•
408-943-2600
Revised March 15, 2010
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CY7C106BN
Pin Configuration
Figure 1. 28-pin SOJ (Top View)
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
CE
OE
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
A17
A16
A15
A14
A13
A12
A11
NC
I/O3
I/O2
I/O1
I/O0
WE
Selection Guide
Description
7C106BN-15
Maximum Access Time (ns)
15
Maximum Operating Current (mA)
80
Maximum Standby Current (mA)
30
Document #: 001-06429 Rev. *A
Page 2 of 9
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CY7C106BN
Maximum Ratings
Exceeding the maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage Temperature ................................ –65×C to +150×C
Ambient Temperature with
Power Applied ........................................... –55×C to +125×C
Supply Voltage on VCC Relative to GND[1] .....–0.5V to +7.0V
DC Voltage Applied to Outputs
in High Z State[1] .................................... –0.5V to VCC + 0.5V
DC Input Voltage[1] ................................ –0.5V to VCC + 0.5V
Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage ........................................... >2001V
(per MIL-STD-883, Method 3015)
Latch Up Current ..................................................... >200 mA
Operating Range
Ambient
Temperature[2]
0°C to +70°C
Range
Commercial
VCC
5V ± 10%
Electrical Characteristics Over the Operating Range
Parameter
Description
Test Conditions
7C106BN-15
Min
Max
Unit
0.4
V
VOH
Output HIGH Voltage
VCC = Min, IOH = –4.0 mA
VOL
Output LOW Voltage
VCC = Min, IOL = 8.0 mA
2.4
V
VIH
Input HIGH Voltage
2.2
VCC + 0.3
V
VIL
Input LOW Voltage[1]
–0.3
0.8
V
IIX
Input Leakage Current
GND < VI < VCC
–1
+1
mA
IOZ
Output Leakage Current
GND < VI < VCC, Output Disabled
–5
+5
mA
IOS
Output Short
Circuit Current[3]
VCC = Max, VOUT = GND
–300
mA
ICC
VCC Operating Supply Current
VCC = Max, IOUT = 0 mA,
f = fMAX = 1/tRC
80
mA
ISB1
Automatic CE Power Down Current Max VCC, CE > VIH, VIN > VIH or VIN <
—TTL Inputs
VIL, f = fMAX
30
mA
ISB2
Automatic CE Power Down Current Max VCC,
—CMOS Inputs
CE > VCC – 0.3V,
VIN > VCC – 0.3V
or VIN < 0.3V, f=0
10
mA
Commercial
Capacitance[4]
Parameter
CIN: Addresses
Description
Input Capacitance
CIN: Controls
COUT
Test Conditions
TA = 25×C, f = 1 MHz,
VCC = 5.0V
Output Capacitance
Max
Unit
7
pF
10
pF
10
pF
Notes
1. VIL (min.) = –2.0V for pulse durations of less than 20 ns.
2. TA is the “instant on” case temperature.
3. Not more than 1 output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.
4. Tested initially and after any design or process changes that may affect these parameters.
Document #: 001-06429 Rev. *A
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CY7C106BN
Figure 2. AC Test Loads and Waveforms
R1 480Ω
5V
R1 480Ω
5V
OUTPUT
ALL INPUT PULSES
3.0V
90%
OUTPUT
R2
255Ω
30 pF
R2
GND
255Ω
5 pF
INCLUDING
JIG AND
SCOPE
INCLUDING
JIG AND
SCOPE
(a)
Equivalent to:
90%
10%
10%
Rise Time < 1V/ns
Fall Time < 1V/ns
(b)
THÉVENIN EQUIVALENT
OUTPUT
167Ω
1.73V
Switching Characteristics Over the Operating Range[5]
Parameter
Description
7C106B-15
Min
Max
Unit
READ CYCLE
tRC
Read Cycle Time
tAA
Address to Data Valid
15
tOHA
Data Hold from Address Change
tACE
CE LOW to Data Valid
15
ns
tDOE
OE LOW to Data Valid
7
ns
tLZOE
OE LOW to Low Z
OE HIGH to High
tLZCE
CE LOW to Low Z[7]
CE HIGH to High
tPU
CE LOW to Power Up
WRITE CYCLE
ns
7
3
ns
ns
7
0
CE HIGH to Power Down
ns
ns
0
Z[6, 7]
tHZCE
tPD
3
Z[6, 7]
tHZOE
ns
15
ns
ns
15
ns
[8, 9]
tWC
Write Cycle Time
15
ns
tSCE
CE LOW to Write End
12
ns
tAW
Address Setup to Write End
12
ns
tHA
Address Hold from Write End
0
ns
tSA
Address Setup to Write Start
0
ns
tPWE
WE Pulse Width
12
ns
tSD
Data Setup to Write End
8
ns
tHD
Data Hold from Write End
0
ns
tLZWE
WE HIGH to Low Z[7]
3
ns
tHZWE
WE LOW to High
Z[6, 7]
7
ns
Notes
5. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified
IOL/IOH and 30 pF load capacitance.
6. tHZOE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady state voltage.
7. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.
8. The internal write time of the memory is defined by the overlap of CE and WE LOW. CE and WE must be LOW to initiate a write, and the transition of either of
these signals can terminate the write. The input data setup and hold timing should be referenced to the leading edge of the signal that terminates the write.
9. The minimum write cycle time for Write Cycle No. 3 (WE controlled, OE LOW) is the sum of tHZWE and tSD.
Document #: 001-06429 Rev. *A
Page 4 of 9
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CY7C106BN
Data Retention Characteristics Over the Operating Range
Parameter
Conditions[10]
Description
VDR
VCC for Data Retention
ICCDR
Data Retention Current
tCDR[4]
Chip Deselect to Data Retention Time
tR
[4]
Min
Max
Unit
250
μA
2.0
VCC = VDR = 2.0V,
CE > VCC – 0.3V,
VIN > VCC – 0.3V or
VIN < 0.3V
Operation Recovery Time
V
0
ns
200
ms
Figure 3. Data Retention Waveform
DATA RETENTION MODE
4.5V
VCC
4.5V
VDR > 2V
tR
tCDR
CE
Switching Waveforms
Figure 4. Read Cycle No.1[11, 12]
1
tRC
ADDRESS
tOHA
DATA OUT
tAA
PREVIOUS DATA VALID
DATA VALID
Figure 5. Read Cycle No. 2 (OE Controlled)[12, 13]
ADDRESS
tRC
CE
tACE
OE
tHZOE
tDOE
DATA OUT
VCC
SUPPLY
CURRENT
tLZOE
HIGH IMPEDANCE
tLZCE
tHZCE
HIGH
IMPEDANCE
DATA VALID
tPD
tPU
50%
50%
ICC
ISB
Notes
10. No input may exceed VCC +0.5V.
11. Device is continuously selected, OE and CE = VIL.
12. WE is HIGH for read cycle.
13. Address valid prior to or coincident with CE transition LOW.
Document #: 001-06429 Rev. *A
Page 5 of 9
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CY7C106BN
Switching Waveforms (continued)
Figure 6. Write Cycle No. 1 (CE Controlled)[14, 15]
tWC
ADDRESS
tSCE
CE
tSA
tAW
tHA
tPWE
WE
tSD
DATA I/O
tHD
DATA VALID
Figure 7. Write Cycle No. 2 (WE Controlled, OE HIGH During Write)[14, 15]
tWC
ADDRESS
tSCE
CE
tAW
tSA
tHA
tPWE
WE
OE
tSD
DATA I/O
tHD
DATA VALID
tHZOE
Notes
14. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high impedance state.
15. Data I/O is high impedance if OE = VIH.
Document #: 001-06429 Rev. *A
Page 6 of 9
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CY7C106BN
Switching Waveforms (continued)
Figure 8. Write Cycle No. 3 (WE Controlled, OE LOW)[9, 15]
tWC
ADDRESS
tSCE
CE
tAW
tSA
tHA
tPWE
WE
tSD
DATA I/O
tHD
DATA VALID
tLZWE
tHZWE
Truth Table
CE
OE
WE
Input/Output
Mode
Power
H
X
X
High Z
Power Down
Standby (ISB)
L
L
H
Data Out
Read
Active (ICC)
L
X
L
Data In
Write
Active (ICC)
L
H
H
High Z
Selected, Outputs Disabled
Active (ICC)
Ordering Information
Speed
(ns)
15
Ordering Code
CY7C106BN-15VC
Package
Diagram
51-85032
Package Type
28-Pin (400-Mil) Molded SOJ
Operating
Range
Commercial
Contact your local sales representative regarding availability of these parts.
Document #: 001-06429 Rev. *A
Page 7 of 9
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CY7C106BN
Package Diagram
Figure 9. 28-Pin (400 Mil) Molded SOJ
PIN 1 I.D
14
1
.435
.445
.395
.405
15
DIMENSIONS IN INCHES
MIN.
MAX.
28
.720
.730
SEATING PLANE
NO CHAMFER
.128
.148
.026
.032
.050
TYP.
.015
.020
0.004
.025 MIN.
.007
.013
.360
.380
51-85032-*B
NOTES :
1. PACKAGE WEIGHT : 1.24g
2. JEDEC REFERENCE : MS-027
Document #: 001-06429 Rev. *A
51-85032.*D
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CY7C106BN
Document History Page
Document Title: CY7C106BN 256K x 4 Static RAM
Document Number: 001-06429
REV.
ECN NO.
Submission
Date
Orig. of
Change
Description of Change
**
423847
See ECN
NXR
New Data sheet
*A
2891262
03/12/2010
VKN
Removed CY7C1006BN part from the data sheet
Removed Industrial grade
Removed 20ns speed bin
Removed 28-pin (300-Mil) Molded SOJ package
Updated POD for 28-pin (400-Mil) Molded SOJ package
Updated Ordering information table
Updated URLs in Sales, Solutions, and Legal Information
Sales, Solutions, and Legal Information
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© Cypress Semiconductor Corporation, 2006-2010. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
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and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
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Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document #: 001-06429 Rev. *A
Revised March 15, 2010
Page 9 of 9
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