MATERIAL DECLARATION SHEET Material Number CR2512 Series Product Line Thick Film Low Ohmic Chip Resistors Compliance Date 2014.Feb.5 RoHS Compliant Yes MSL 1 No. Construction Element (subpart) Homogeneous Material Material weight [g] 1 Ceramic Substrate Ceramic 0.03380 2 Conductor Layer Thick Film Conductor 0.00051 3 Resistive Element Thick Film Resistor 0.00049 4 Over Coating Epoxy 5 Marking Epoxy 0.00066 0.00004 End Terminal NI-CR 0.00001 Ni Plating Sn Plating Nickel Tin 0.00115 0.00102 0.03768 6 7 8 Total weight Homogeneous Material\Substances CASRN if applicable Materials Mass % Material Mass % of total unit wt. Aluminum oxide Silicon dioxide Silver Bismuth Barium Silicon Boron Ruthenium dioxide Silver Palladium Lead Epoxy 1344-28-1 14808-60-7 7440-22-4 7440-69-9 7440-39-3 7440-21-3 7440-42-8 12036-10-1 7440-22-4 7440-05-3 7439-92-1 29690-82-2 96% 4% 96% 1% 1% 1% 1% 25% 40% 15% 20% 100% 86.13 3.59 1.28 0.02 0.02 0.02 0.02 0.32 0.52 0.19 0.26 1.74 Epoxy Nickel Chromium Nickel Tin 25085-99-8 7440-02-0 7440-47-3 7440-02-0 7440-31-5 100% 80% 20% 100% 100% 0.11 0.02 0.01 3.04 2.71 Subpart mass of total wt. (%) 89.72 1.36 1.29 1.74 0.11 0.03 3.04 2.71 This Document was updated on: 2016-02-08 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. 2. Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1