Taping Opto . 4 Taping Specification Semiconductor Dimensions P2 P P P2 0~15° d F H H1 L L W1 Wo W2 Ho W1 Wo W P W P F F Po Po Unit : mm Item Symbol Forming Type Straight Type F3 Product Height Lead clinch height Product pitch Feed hole pitch Feed hole position(1) Lead diameter Lead to lead distance Base tape width Top film width Feed hole position(2) Top film position Base tape thickness Feed hole diameter H / H1 23.35±0.5 H2 - H0 P P0 P2 d F W W0 W1 W2 t D0 12.7±1.2 12.7±0.5 6.35±1.2 0.4±0.1 0.5±0.1 2.5±1.0 18±0.5 13±0.7 9±0.7 0~0.5 0.7±0.5 φ4±0.5 20.5±0.8 4.5 ±0.3 F4 F9 21.5±0.8 24.0±0.8 27.1±0.8 5.5 8.0 11.1 ±0.3 ±0.3 ±0.3 16±0.5 12.7±1.2 12.7±0.5 6.35±1.2 0.4±0.1 0.5±0.1 5±1.0 18±0.5 13±0.7 9±0.7 0~0.5 0.7±0.5 φ4±0.5 LED type Quantity / Box φ3 φ5 3000 pcs 2000 pcs KSD-2097-000 F6 1