Data Sheet

MMST5401
160V PNP SMALL SIGNAL TRANSISTOR IN SOT323
Features
Mechanical Data
•
Epitaxial Planar Die Construction
•
•
Ultra-Small Surface Mount Package
•
•
Complementary PNP Type: MMST5551
Case: SOT323
Case Material: Molded Plastic. “Green” Molding Compound.
UL Flammability Rating 94V-0
•
Ideal for Low Power Amplification and Switching
•
Moisture Sensitivity: Level 1 per J-STD-020
•
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
•
•
Halogen and Antimony Free. “Green” Device (Note 3)
Terminals: Finish - Matte Tin Plated Leads, Solderable per
MIL-STD-202, Method 208 e3
•
Qualified to AEC-Q101 Standards for High Reliability
•
Weight: 0.006 grams (approximate)
•
PPAP Capable (Note 4)
C
SOT323
B
E
Top View
Top View
Pin-Out
Device Symbol
Ordering Information (Notes 4 & 5)
Compliance
AEC-Q101
AEC-Q101
Automotive
Device
MMST5401-7-F
MMST5401-13-F
MMST5401Q-7-F
Notes:
Marking
K4M
K4M
K4M
Reel Size (inches)
7
13
7
Tape Width (mm)
8
8
8
Quantity per reel
3,000
10,000
3,000
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Automotive, AEC-Q101 and standard products are electrically and thermally
the same, except where specified. For more information, please refer to http://www.diodes.com/quality/product_compliance_definitions/.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
xxx
K4M
Date Code Key
Year
Code
Month
Code
2010
X
Jan
1
2011
Y
Feb
2
MMST5401
Document number: DS30170 Rev. 10 - 2
Mar
3
YM
Marking Information
K4M = Product Type Marking Code
YM = Date Code Marking
Y or Y = Year (ex: A = 2013)
M or M = Month (ex: 9 = September)
2012
Z
Apr
4
2013
A
May
5
Jun
6
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2014
B
Jul
7
2015
C
Aug
8
Sep
9
2016
D
Oct
O
2017
E
Nov
N
Dec
D
May 2014
© Diodes Incorporated
MMST5401
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Symbol
VCBO
VCEO
VEBO
IC
Value
-160
-150
-5.0
-200
Unit
V
V
V
mA
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Power Dissipation
(Note 6)
Thermal Resistance, Junction to Ambient
(Note 6)
Operating and Storage Temperature Range
Symbol
PD
Value
200
Unit
mW
RθJA
625
°C/W
TJ,TSTG
-55 to +150
°C
ESD Ratings (Note 7)
Characteristic
Electrostatic Discharge - Human Body Model
Electrostatic Discharge - Machine Model
Symbol
ESD HBM
ESD MM
Value
4,000
400
Unit
V
V
JEDEC Class
3A
C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 8)
Collector-Base Breakdown Voltage
Symbol
Min
Max
Unit
Test Condition
VCBO
-160
⎯
V
IC = -100μA, IE = 0
Collector-Emitter Breakdown Voltage
VCEO
-150
⎯
V
IC = -1.0mA, IB = 0
Emitter-Base Breakdown Voltage
VEBO
-5.0
⎯
V
IE = -10μA, IC = 0
VCB = -120V, IE = 0
VCB = -120V, IE = 0, TA = +100°C
VEB = -3.0V, IC = 0
Collector Cutoff Current
ICBO
⎯
-50
nA
µA
Emitter Cutoff Current
ON CHARACTERISTICS (Note 8)
IEBO
⎯
-50
nA
DC Current Gain
hFE
50
60
50
Collector-Emitter Saturation Voltage
VCE(SAT)
⎯
⎯
240
⎯
-0.2
-0.5
Base-Emitter Saturation Voltage
VBE(SAT)
⎯
-1.0
V
Cobo
⎯
6.0
pF
VCB = -10V, f = 1.0MHz, IE = 0
Small Signal Current Gain
hfe
40
200
⎯
Current Gain-Bandwidth Product
fT
100
300
MHz
NF
⎯
8.0
dB
VCE = -10V, IC = -1.0mA,
f = 1.0kHz
VCE = -10V, IC = -10mA,
f = 100MHz
VCE = -5.0V, IC = -200µA,
RS =10Ω, f = 1.0kHz
SMALL SIGNAL CHARACTERISTICS
Output Capacitance
Noise Figure
Notes:
⎯
V
IC =
IC =
IC =
IC =
IC =
IC =
IC =
-1.0mA , VCE = -5.0V
-10mA, VCE = -5.0V
-50mA, VCE = -5.0V
-10mA, IB = -1.0mA
-50mA, IB = -5.0mA
-10mA, IB = -1.0mA
-50mA, IB = -5.0mA
6. For a device mounted on minimum recommended pad layout 1oz copper that is on a single-sided FR4 PCB; device is measured under still air
conditions whilst operating in a steady-state.
7. Refer to JEDEC specification JESD22-A114 and JESD22-A115.
8. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%.
MMST5401
Document number: DS30170 Rev. 10 - 2
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MMST5401
Typical Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
200
10.0
VCE(SAT), COLLECTOR TO EMITTER
SATURATION VOLTAGE (V)
PD, POWER DISSIPATION (mW)
Note 1
150
100
50
0
0
25
50
75 100 125 150 175
TA, AMBIENT TEMPERATURE (°C)
Fig. 1, Max Power Dissipation vs.
Ambient Temperature
10
100
1,000
IC, COLLECTOR CURRENT (mA)
Fig. 2, Collector Emitter Saturation Voltage
vs. Collector Current
1.0
VBE(ON), BASE EMITTER VOLTAGE (V)
VCE = 5V
hFE, DC CURRENT GAIN
0.1
0.01
1
200
10,000
1,000
T A = 150°C
100
TA = 25°C
TA = -50°C
10
1
1
1.0
10
100
1,000
IC, COLLECTOR CURRENT (mA)
Fig. 3, DC Current Gain vs. Collector Current
0.9
VCE = 5V
TA = -50°C
0.8
0.7
0.6
T A = 25°C
0.5
0.4
TA = 150°C
0.3
0.2
0.1
0.1
1.0
10
100
IC, COLLECTOR CURRENT (mA)
Fig. 4, Base Emitter Voltage vs. Collector Current
1,000
ft, GAIN BANDWIDTH PRODUCT (MHz)
VCE = 10V
100
10
1
10
100
IC, COLLECTOR CURRENT (mA)
Fig. 5, Gain Bandwidth Product vs. Collector Current
1
MMST5401
Document number: DS30170 Rev. 10 - 2
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MMST5401
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
A
SOT323
Dim
Min
Max
Typ
A
0.25
0.40
0.30
B
1.15
1.35
1.30
C
2.00
2.20
2.10
D
0.65
G
1.20
1.40
1.30
H
1.80
2.20
2.15
J
0.0
0.10
0.05
K
0.90
1.00
1.00
L
0.25
0.40
0.30
M
0.10
0.18
0.11
0°
8°
α
All Dimensions in mm
B C
G
H
K
M
J
L
D
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
Y
Z
C
X
Note:
Dimensions Value (in mm)
Z
2.8
X
0.7
Y
0.9
C
1.9
E
1.0
E
For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances between
device Terminals and PCB tracking.
MMST5401
Document number: DS30170 Rev. 10 - 2
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MMST5401
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
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MMST5401
Document number: DS30170 Rev. 10 - 2
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