AP2281 Green SINGLE SLEW RATE CONTROLLED LOAD SWITCH Description Pin Assignments The AP2281 slew rate controlled load switch is a single P-channel MOSFET power switch designed for high-side load-switching applications. The MOSFET has a typical RDS(ON) of 80m at 5V, ( Top View ) allowing increased load current handling capacity with a low forward voltage drop. The turn-on slew rate of the device is controlled internally. The AP2281 load switch is designed to operate from 1.5V to 6V, making it ideal for 1.8V, 2.5V, 3.3V, and 5V systems. The typical quiescent supply current is only 0.01µA. IN 1 IN 2 EN 3 7 Wide input voltage range: 1.5V – 6V Low RDS(ON): 80mΩ typical @ 5V Turn-on slew rate controlled AP2281-1: 1ms turn-on rise time AP2281-3: 100µs turn-on rise time with internal discharge Very low turn-on quiescent current: << 1µA Fast load discharge option Temperature range -40°C to +85°C Lead-Free Finish; RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Smart Phones PDA Cell Phones GPS Navigators PMP/MP4 Notebook and Pocket PC Notes: 5 OUT 4 GND (Top View) OUT 1 6 IN 5 GND GND 2 EN 3 4 IN SOT26 Applications OUT U-DFN2018-6 Features 6 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Typical Applications Circuit VIN VOUT IN 1uF OUT 0.1uF Enable EN GND AP2281 Document number: DS31359 Rev. 7 - 2 1 of 11 www.diodes.com November 2013 © Diodes Incorporated AP2281 Pin Descriptions Pin Name SOT26 Pin Number U-DFN2018-6 OUT 1 5, 6 GND EN 2, 5 3 4 3 IN 4, 6 1, 2 PAD 7 Function Voltage output pin. This is the pin to the P-channel MOSFET drain connection. Bypass to ground through a 0.1uF capacitor. Ground. Enable input, active high Voltage input pin. This is the pin to the P-channel MOSFET source. Bypass to ground through a 1µF capacitor. Thermal pad. Suggest connecting to ground plane to get better heat dissipation. Options Part Number AP2281-1 AP2281-3 Slew Rate (typ) 1ms 100µs Active Pull Down No Yes Enable Active High Active High Functional Block Diagram AP2281 Document number: DS31359 Rev. 7 - 2 2 of 11 www.diodes.com November 2013 © Diodes Incorporated AP2281 Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol ESD HBM Parameter Human Body Model ESD Protection ESD MM Machine Model ESD Protection Ratings 5 Unit KV 500 450 V V SOT26 U-DFN2018-6 6.5 V VOUT Output Voltage VIN +0.3 V VEN Enable Voltage 6.5 V Iload Maximum Continuous Load Current 2 A °C VIN Input Voltage TJ Operating Junction Temperature Range -40 to +125 TST Storage Temperature Range -65 to +150 °C 720 1410 mW mW PD Notes: SOT26 (Note 4, 5, 6) U-DFN2018-6 (Note 4, 5, 7) Power Dissipation 4. TJ, max = +125°C. 5. Ratings apply to ambient temperature at +25°C. Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter VIN Input voltage IOUT Output Current TA Operating Ambient Temperature Min Max Unit 1.5 6.0 V 0 2.0 A -40 +85 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Symbol Min Typ Max Unit IQ Input Quiescent Current VEN = VIN, IOUT = 0 — 0.01 1 μA ISHDN Input Shutdown Current VEN = 0V, OUT open — 0.01 1 μA ILEAK Input Leakage Current VEN = 0V, OUT grounded — 0.01 1 μA VIN = 5.0V — 80 100 mΩ VIN = 3.3V — 95 120 mΩ VIN = 1.8V — 160 210 mΩ VIN = 1.5V — 210 280 mΩ VIN = 1.5V to 6V — — 0.4 V — V V RDS(ON) Parameters Switch on-resistance EN Input Logic Low Voltage VIL EN Input Logic High Voltage VIH ISINK TD(ON) TON EN Input leakage Output turn-on delay time Output turn-on rise time Test Conditions 1.5V ≤ VIN ≤ 2.7V 1.4 — 2.7V < VIN < 5.25V 1.6 — — VIN ≥ 5.25V 1.7 — — V VEN = 5V — — 1 μA RLOAD = 10Ω — 1 — μS AP2281-1, RLOAD = 10Ω — 1000 1500 μS AP2281-3, RLOAD = 10Ω — 100 150 μS TD(OFF) Output turn-off delay time RLOAD = 10Ω — 0.5 1 μS RDISCH Discharge FET on-resistance For AP2281-3 only, VEN = GND — 65 100 Ω SOT26 (Note 6) — 153 — U-DFN2018-6 (Note 7) — 78 — SOT26 (Note 6) — 29 — U-DFN2018-6 (Note 7) — 19 — θJA Thermal Resistance Junction-to-Ambient θJC Thermal Resistance Junction-to-case Notes: °C/W °C/W 6. Test condition for SOT26: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. 7. Test condition for U-DFN2018-6: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom layer 1.0"x1.4" ground plane. AP2281 Document number: DS31359 Rev. 7 - 2 3 of 11 www.diodes.com November 2013 © Diodes Incorporated AP2281 Typical Performance Characteristics Quiescent Current vs. Input Voltage Quiescent Current vs. Temperature 0.010 Q u ie s c e n t C u rre n t ( A ) Quiescent C urren t ( A ) 0.01 0.008 0.006 0.004 0.002 0 1.0 2.0 3.0 4.0 5.0 6.0 VIN=1.8V VIN=3.3V 0.008 VIN=5.0V 0.006 0.004 0.002 0.000 -50 Input Voltage (V) -25 25 50 75 100 125 Temperature (°C) RDS(ON) vs. Input Voltage RDS(ON) vs. Temperature 300.00 200.00 I=100mA 180.00 I=500mA 250.00 160.00 I=1A I=2A R DS(O N) (m ) R DS(O N) (m ) 0 200.00 150.00 140.00 120.00 100.00 100.00 2 2.5 3 3.5 4 4.5 5 5.5 60.00 VIN =1.8V 40.00 VIN =3.3V 20.00 VIN =5V 0.00 -50 50.00 1.5 80.00 6 -25 0 25 50 75 100 Temperature (°C) Input Voltage (V) ENABLE Threshold vs. Input Voltage Input Shutdown Current vs. Temperature 0.010 1.6 0.008 1.4 IS H D N ( A ) O N /O F F T h re s h o ld (V ) 1.8 1.2 1.0 0.8 VIH (V) 0.000 0.4 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.004 0.002 VIL (V) 0.6 0.006 6.0 Input Voltage (V) AP2281 Document number: DS31359 Rev. 7 - 2 4 of 11 www.diodes.com -50 -25 0 25 50 75 100 125 Temperature (°C) November 2013 © Diodes Incorporated AP2281 Typical Performance Characteristics (cont.) AP2281-1 Turn-Off (VIN = 3.3V, RL = 7Ω) AP2281-1 Turn-On (VIN = 3.3V, RL = 7Ω) VEN (5V/div) VEN (5V/div) VOUT (2V/div) VOUT (2V/div) IIN (500mA/div) IIN (500mA/div) Time (500μs/div) Time (50μs/div) AP2281-1 Turn-On (VIN = 5V, RL = 10Ω) AP2281-1 Turn-Off (VIN = 5V, RL = 10Ω) VEN (5V/div) VEN (5V/div) VOUT (2V/div) VOUT (2V/div) IIN (500mA/div) IIN (500mA/div) Time (500μs/div) Time (50μs/div) AP2281-3 Turn-On (VIN = 3.3V, RL = 7Ω) AP2281-3 Turn-Off (VIN = 3.3V, RL= 7Ω) VEN (5V/div) VEN (5V/div) VOUT (2V/div) VOUT (2V/div) IIN (500mA/div) IIN (500mA/div) Time (50μs/div) AP2281 Document number: DS31359 Rev. 7 - 2 Time (50μs/div) 5 of 11 www.diodes.com November 2013 © Diodes Incorporated AP2281 Typical Performance Characteristics (cont.) AP2281-3 Turn-Off (VIN = 5V, RL=10Ω) AP2281-3 Turn-On (VIN = 5V, RL = 10Ω) VEN (5V/div) VEN (5V/div) VOUT (2V/div) VOUT (2V/div) IIN (500mA/div) IIN (500mA/div) Time (50μs/div) Time (50μs/div) Application Notes Input Capacitor A 1μF capacitor is recommended to connect between IN and GND pins to decouple input power supply glitch and noise. The input capacitor has no specific type or ESR (Equivalent Series Resistance) requirement. However, for higher current application, ceramic capacitors are recommended due to their capability to withstand input current surges from low impedance sources, such as batteries in portable applications. This input capacitor must be located as close as possible to the device to assure input stability and less noise. For PCB layout, a wide copper trace is required for both IN and GND. Output Capacitor A 0.1μF capacitor is recommended to connect between OUT and GND pins to stabilize and accommodate load transient condition. The output capacitor has no specific type or ESR requirement. The amount of the capacitance may be increased without limit. For PCB layout, the output capacitor must be placed as close as possible to OUT and GND pins, and keep the traces as short as possible. ENABLE/SHUTDOWN Operation The AP2281 is turned on by setting the EN pin high, and is turned off by pulling it low. To ensure proper operation, the signal source used to drive the EN pin must be able to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics section under VIL and VIH. DISCHARGE Operation The AP2281-3 offers discharge option that helps to discharge the output charge when disabled. Power Dissipation The device power dissipation and proper sizing of the thermal plane is critical to avoid thermal shutdown and ensure reliable operation. Power dissipation of the device depends on input voltage and load conditions and can be calculated by: PD IOUT 2 xRDSON (1) However, the maximum power dissipation that can be handled by the device depends on the maximum junction to ambient thermal resistance, maximum ambient temperature, and maximum device junction temperature, which can be approximated by the equation below: PD (max@ TA ) ( 125C TA ) JA (2) For example at VIN = 5V, the typical RDSON = 80mΩ. For IOUT = 2A, the maximum power dissipation calculated using equation (1) is PD = 0.32W. Based on SOT26 θJA = 153°C/W and equation (2), the calculated junction temperature rise from ambient is approximately 49°C. Since the maximum junction temperature is 125°C, the operating ambient temperature must be kept below 76°C to safely operate the device. AP2281 Document number: DS31359 Rev. 7 - 2 6 of 11 www.diodes.com November 2013 © Diodes Incorporated AP2281 Application Notes (cont.) On the other hand, at TA = +85°C and VIN = 5V, the calculated maximum power dissipation from equation (2) is approximately PD(MAX) = 0.26W. Hence the safe operating maximum continuous current is 1.81A. For other application conditions, the users should recalculate the device maximum power dissipation based on the operating conditions. Ordering Information AP2281 - X XX G - 7 Turn-on rise time Package Green 1 : 1ms 3 : 100us W : SOT26 FM : U-DFN2018-6 G : Green Part Number Package Code Packaging AP2281-1WG-7 AP2281-3WG-7 AP2281-1FMG-7 AP2281-3FMG-7 W W FM FM SOT26 SOT26 U-DFN2018-6 U-DFN2018-6 Quantity Packing 7 : Tape & Reel 7” Tape and Reel Part Number Suffix 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel -7 -7 -7 -7 Marking Information (1) SOT26 ( Top View ) 4 7 5 6 XX Y W X 1 2 3 Device AP2281-1W AP2281-3W (2) XX : Identification code Y : Year 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Green Package Type SOT26 SOT26 Identification Code U2 U3 U-DFN2018-6 ( Top View ) . XX YWX Device AP2281-1FM AP2281-3FM AP2281 Document number: DS31359 Rev. 7 - 2 XX : Identification code Y : Year 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Green Package Type U-DFN2018-6 U-DFN2018-6 7 of 11 www.diodes.com Identification Code UE UF November 2013 © Diodes Incorporated AP2281 Package Outline Dimensions (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. (1) SOT26 A B C H K J M D SOT26 Dim Min Max Typ A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D 0.95 H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 0° 8° All Dimensions in mm L (2) U-DFN2018-6 U-DFN2018-6 Dim Min Max Typ A 0.545 0.605 0.575 A1 0 0.05 0.02 A3 0.13 b 0.15 0.25 0.20 D 1.750 1.875 1.80 D2 1.30 1.50 1.40 e 0.50 E 1.95 2.075 2.00 E2 0.90 1.10 1.00 L 0.20 0.30 0.25 z 0.30 All Dimensions in mm AP2281 Document number: DS31359 Rev. 7 - 2 8 of 11 www.diodes.com November 2013 © Diodes Incorporated AP2281 Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. C2 (1) SOT26 Z C2 C1 G Dimensions Value (in mm) Z 3.20 G 1.60 X 0.55 Y 0.80 C1 C2 Y 2.40 0.95 X (2) U-DFN2018-6 X C Y Dimensions C G X X1 Y Y1 Y1 G Value (in mm) 0.50 0.20 0.25 1.60 0.35 1.20 X1 AP2281 Document number: DS31359 Rev. 7 - 2 9 of 11 www.diodes.com November 2013 © Diodes Incorporated AP2281 Taping Orientation Note: 8. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf AP2281 Document number: DS31359 Rev. 7 - 2 10 of 11 www.diodes.com November 2013 © Diodes Incorporated AP2281 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 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