Package Datasheet

PLASTIC BALL GRID ARRAY PACKAGE
FUJITSU SEMICONDUCTOR
DATA SHEET
900 PIN PLASTIC
BGA-900P-M09
900-pin plastic PBGA
Lead pitch
1.00 mm
Package width ×
package length
35.00 mm × 35.00 mm
Lead shape
Ball
Sealing method
Plastic mold
Mounting height
2.40 mm MAX
Weight
5.00 g
(BGA-900P-M09)
900-pin plastic PBGA
(BGA-900P-M09)
35.00(1.378)
B
33.00(1.299)
32.50±.0.10(1.280±.004)
1.00(.039)
REF
A
0.50(.020)
1.00(.039)
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
1.00(.039)
35.00
(1.378)
33.00
(1.299)
32.50±.0.10
(1.280±.004)
0.50(.020)
INDEX
1.00(.039)
REF
0.20(.008) (4X)
AN AL AJ AG AE AC AA W U R N L J G E C A
AP AM AK AH AF AD AB Y V T P M K H F D B
ø0.60±0.10(.024±.004)
ø0.25(.010) M C AB
ø0.10(.004) M C
C
C
0.20(.008) C
2008-2010 FUJITSU SEMICONDUCTOR LIMITED BGA900009Sc-2-2
1.70±.0.10
(.067±.004)
2.40(.094)
Max.
0.30(.012)
Min.
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU SEMICONDUCTOR sales representatives before ordering.
FUJITSU SEMICONDUCTOR is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package
dimensions in this document.
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