FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 385 PIN PLASTIC BGA-385P-M03 385-ball plastic FBGA Ball pitch 0.50 mm Package width × package length 12.00 mm × 12.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 1.30 mm Max. Weight 0.31 g (BGA-385P-M03) 385-ball plastic FBGA (BGA-385P-M03) 12.00±0.075(.472±.003) 11.00(.433)REF 0.50(.020) (ZE2) 0.10(.004) S B 0.50(.020) (ZD2) B 0.50(.020) (ZE1) 050(.020) TYP 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0.50(.020) TYP A 12.00±0.075 (.472±.003) 11.00(.433) REF 0.50(.020) (ZD1) (INDEX AREA) Y WV U T R P N M L K J H G F E D C B A AB AC AA 1.15±0.15 (.045±.006) (Seated height) S INDEX 4.00(.157) REF 0.10(.004) S A 0.25±0.10 (.010±.004) (Stand off) 4.00(.157) REF 385-ø0.32±0.05 (385-ø.013±.002) ø0.05(.002) M S A B Notes. 1. Overhang:|(ZD1-ZD2)/2|≤0.05, |(ZE1-ZE2)/2|≤0.05 0.10(.004) S C 2008-2010 FUJITSU SEMICONDUCTOR LIMITED B385003S-c-2-2 Dimensions in mm (inches). Note: The values in parentheses are reference values. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU SEMICONDUCTOR sales representatives before ordering. FUJITSU SEMICONDUCTOR is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. 0801