Package Datasheet

FINE PITCH BALL GRID ARRAY PACKAGE
FUJITSU SEMICONDUCTOR
DATA SHEET
192 PIN PLASTIC
BGA-192P-M06
192-ball plastic FBGA
Ball pitch
0.80 mm
Package width 
package length
12.00 mm  12.00 mm
Lead shape
Ball
Sealing method
Plastic mold
Mounting height
1.45 mm Max.
Weight
0.34 g
(BGA-192P-M06)
192-ball plastic FBGA
(BGA-192P-M06)
10.40(.409)REF
12.00±0.10(.472±.004)
0.20(.008) S B
B
0.80(.031)
REF
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0.80(.031)
REF
A
12.00±0.10
(.472±.004)
(INDEX AREA)
10.40(.409)
REF
0.20(.008) S A
0.35±0.10
(.014±.004)
(Stand off)
1.25±0.20
(.049±.008)
(Seated height)
P N M L K J H G F E D C B A
INDEX
192-ø0.45±0.10
(192-ø.018±.004)
ø0.08(.003)
M
S A B
S
0.10(.004) S
C
2008-2010 FUJITSU SEMICONDUCTOR LIMITED B192006S-c-1-3
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU SEMICONDUCTOR sales representatives before ordering.
FUJITSU SEMICONDUCTOR is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package
dimensions in this document.
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