FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 192 PIN PLASTIC BGA-192P-M06 192-ball plastic FBGA Ball pitch 0.80 mm Package width package length 12.00 mm 12.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 1.45 mm Max. Weight 0.34 g (BGA-192P-M06) 192-ball plastic FBGA (BGA-192P-M06) 10.40(.409)REF 12.00±0.10(.472±.004) 0.20(.008) S B B 0.80(.031) REF 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0.80(.031) REF A 12.00±0.10 (.472±.004) (INDEX AREA) 10.40(.409) REF 0.20(.008) S A 0.35±0.10 (.014±.004) (Stand off) 1.25±0.20 (.049±.008) (Seated height) P N M L K J H G F E D C B A INDEX 192-ø0.45±0.10 (192-ø.018±.004) ø0.08(.003) M S A B S 0.10(.004) S C 2008-2010 FUJITSU SEMICONDUCTOR LIMITED B192006S-c-1-3 Dimensions in mm (inches). Note: The values in parentheses are reference values. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU SEMICONDUCTOR sales representatives before ordering. FUJITSU SEMICONDUCTOR is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. 0801