Package Datasheet

FINE PITCH BALL GRID ARRAY PACKAGE
FUJITSU SEMICONDUCTOR
DATA SHEET
112 PIN PLASTIC
BGA-112P-M04
112-ball plastic PFBGA
Ball pitch
0.80 mm
Package width 
package length
10.00  10.00 mm
Lead shape
Soldering ball
Sealing method
Plastic mold
Ball size
0.45 mm
Mounting height
1.45 mm Max.
Weight
0.22 g
(BGA-112P-M04)
112-ball plastic PFBGA
(BGA-112P-M04)
10.00±0.10(.394±.004)
0.20(.008) S B
0.80(.031)
REF
B
11
0.80(.031)
REF
10
9
8
A
7
10.00±0.10
(.394±.004)
6
5
4
3
2
1
L K J
(INDEX AREA)
0.35±0.10
(.014±.004)
(Stand off)
0.20(.008) S A
1.25±0.20
(.049±.008)
(Seated height)
H G F E D C B A
INDEX
112-ø0.45±010
(112-ø0.18±.004)
ø0.08(.003)
M
S A B
S
0.10(.004) S
C
2003-2010 FUJITSU SEMICONDUCTOR LIMITED B112004S-c-2-3
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU SEMICONDUCTOR sales representatives before ordering.
FUJITSU SEMICONDUCTOR is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package
dimensions in this document.
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