FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 112 PIN PLASTIC BGA-112P-M05 112-ball plastic FBGA Ball pitch 0.50 mm Package width package length 7.00 mm 7.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 1.35 mm Max. Weight 0.10 g (BGA-112P-M05) 112-ball plastic FBGA (BGA-112P-M05) 6.00(.236)REF 7.00±0.10(.276±.004) 0.20(.008) S B B 0.50(.020) TYP 13 12 11 10 9 A 7.00±0.10 (.276±.004) 8 6.00(.236) REF 7 6 5 4 0.50(.020) TYP 3 2 1 N M L K J H G F E D C B A (INDEX AREA) S 0.10(.004) S C INDEX (NO BALL) 0.20(.008) S A 0.25±0.10 (.010±.004) (Stand off) 2008-2010 FUJITSU SEMICONDUCTOR LIMITED B112005S-c-2-3 112-ø0.30±0.10 (112-ø.012±.004) ø0.05(.002) M S A B 1.15±0.20 (.045±.008) (Seated height) Dimensions in mm (inches). Note: The values in parentheses are reference values. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU SEMICONDUCTOR sales representatives before ordering. FUJITSU SEMICONDUCTOR is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. 0801