LOW PROFILE QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC FPT-80P-M37 80-pin plastic LQFP Lead pitch 0.50 mm Package width package length 12.00 mm 12.00 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold Mounting height 1.70 mm MAX Weight 0.47 g (FPT-80P-M37) 80-pin plastic LQFP (FPT-80P-M37) Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. 14.00±0.20(.551±.008)SQ *12.00±0.10(.472±.004)SQ 60 0.145±0.055 (.006±.002) 41 Details of "A" part 61 40 +0.20 1.50 –0.10 (Mounting height) +.008 .059 –.004 0.25(.010) 0~8° 0.08(.003) INDEX 80 0.50±0.20 (.020±.008) 0.60±0.15 (.024±.006) 0.10±0.05 (.004±.002) (Stand off) 21 "A" 1 20 0.50(.020) C 0.22±0.05 (.009±.002) 2009-2010 FUJITSU SEMICONDUCTOR LIMITED F80037S-c-1-2 0.08(.003) M Dimensions in mm (inches). Note: The values in parentheses are reference values. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU SEMICONDUCTOR sales representatives before ordering. FUJITSU SEMICONDUCTOR is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. 0911