SUD50P06-15L Datasheet

SUD50P06-15L
Vishay Siliconix
P-Channel 60 V (D-S), 175 °C MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
- 60
RDS(on) ()
ID (A)
0.015 at VGS = - 10 V
- 50d
0.020 at VGS = - 4.5 V
- 50
• TrenchFET® Power MOSFET
• 175 °C Junction Temperature
• Compliant to RoHS Directive 2002/95/EC
RoHS
COMPLIANT
S
TO-252
G
Drain Connected to Tab
G
D
S
Top View
D
P-Channel MOSFET
Ordering Information: SUD50P06-15L-E3 (Lead-(Pb)-free)
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
- 60
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 175 °C)
TC = 25 °C
TC = 125 °C
Pulsed Drain Current
Avalanche Current
a
Repetitive Avalanche Energy
Power Dissipation
L = 0.1 mH
TC = 25 °C
TA = 25 °C
V
- 50d
ID
- 39
IDM
- 80
IAR
- 50
EAR
125
A
mJ
c
136
PD
W
3b, c
TJ, Tstg
Operating Junction and Storage Temperature Range
Unit
- 55 to 175
°C
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambientb
Junction-to-Case
Symbol
t  10 s
Steady State
RthJA
RthJC
Typical
Maximum
15
18
40
50
0.82
1.1
Unit
°C/W
Notes:
a. Duty cycle  1 %.
b. When mounted on 1" square PCB (FR-4 material).
c. See SOA curve for voltage derating.
d. Package limited.
Document Number: 72250
S10-2545-Rev. C, 08-Nov-10
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SUD50P06-15L
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min.
VDS
VGS = 0 V, ID = - 250 µA
- 60
VGS(th)
VDS = VGS, ID = - 250 µA
-1
IGSS
VDS = 0 V, VGS = ± 20 V
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
IDSS
-1
VDS = - 48 V, VGS = 0 V, TJ = 125 °C
- 50
VDS = - 48 V, VGS = 0 V, TJ = 175 °C
- 150
ID(on)
Forward
Transconductancea
RDS(on)
± 100
VDS = - 48 V, VGS = 0 V
VDS = -5 V, VGS = - 10 V
VGS = - 10 V, ID = - 17 A
Drain-Source On-State Resistancea
-3
- 50
µA
0.015
0.025
VGS = - 10 V, ID = - 50 A, TJ = 175 °C
0.030
VGS = - 4.5 V, ID = - 14 A
0.020
VDS = - 15 V, ID = - 17 A
nA
A
0.012
VGS = - 10 V, ID = - 50 A, TJ = 125 °C
gfs
V
61

S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
c
4950
VGS = 0 V, VDS = - 25 V, f = 1 MHz
480
pF
405
110
VDS = - 30 V, VGS = - 10 V, ID = - 50 A
165
nC
19
Gate-Drain Charge
Qgd
28
Turn-On Delay Timec
td(on)
15
23
70
105
175
260
175
260
Rise
Timec
Turn-Off Delay Timec
Fall Timec
tr
td(off)
VDD = - 30 V, RL = 0.6 
ID  - 50 A, VGEN = - 10 V, RG = 6 
tf
Source-Drain Diode Ratings and Characteristics (TC = 25
ns
°C)b
IS
- 50
Pulsed Current
ISM
- 80
Forward Voltagea
VSD
IF = - 50 A, VGS = 0 V
1.0
1.6
V
trr
IF = - 50 A, dI/dt = 100 A/µs
45
70
ns
Continuous Current
Reverse Recovery Time
A
Notes:
a. Pulse test; pulse width  300 µs, duty cycle  2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 72250
S10-2545-Rev. C, 08-Nov-10
SUD50P06-15L
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
80
80
VGS = 10 V thru 4 V
70
70
60
I D - Drain Current (A)
I D - Drain Current (A)
60
50
40
30
3V
20
50
40
30
TC = 125 ° C
20
25 ° C
10
10
- 55 °C
0
0.0
0
0
1
2
3
4
5
0.5
Output Characteristics
2.0
2.5
3.0
3.5
4.0
70
80
0.025
R DS(on) - On-Resistance ()
25 °C
TC = - 55 °C
80
125 °C
60
40
20
0
0.020
VGS = 4.5 V
0.015
VGS = 10 V
0.010
0.005
0.000
0
10
20
30
40
50
60
0
10
20
VGS - Gate-to-Source Voltage (V)
30
40
50
60
ID - Drain Current (A)
Transconductance
On-Resistance vs. Drain Current
10
8000
VGS - Gate-to-Source Voltage (V)
7000
6000
C - Capacitance (pF)
1.5
Transfer Characteristics
100
g fs - Transconductance (S)
1.0
VGS - Gate-to-Source Voltage (V)
VDS - Drain-to-Source Voltage (V)
Ciss
5000
4000
3000
2000
VDS = 30 V
ID = 50 A
8
6
4
2
Coss
1000
Crss
0
0
0
10
20
30
40
VDS - Drain-to-Source Voltage (V)
Capacitance
Document Number: 72250
S10-2545-Rev. C, 08-Nov-10
50
60
0
20
40
60
80
100
120
Qg - Total Gate Charge (nC)
Gate Charge
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SUD50P06-15L
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
100
2.0
VGS = 10 V
ID = 17 A
I S - Source Current (A)
1.6
(Normalized)
R DS(on) - On-Resistance
1.8
1.4
1.2
1.0
TJ = 150 °C
TJ = 25 °C
10
0.8
0.6
- 50
1
- 25
0
25
50
75
100
125
150
0.0
175
0.3
0.6
0.9
1.2
VSD - Source-to-Drain Voltage (V)
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
1.5
Source-Drain Diode Forward Voltage
THERMAL RATINGS
100
60
IDM Limited
Limited by R DS(on)*
50
I D - Drain Current (A)
I D - Drain Current (A)
P(t) = 0.0001
40
30
20
ID(on)
Limited
10
P(t) = 0.001
TC = 25 °C
Single Pulse
P(t) = 0.01
10
1
0.1
0
0
25
50
75
100
125
150
TC - Case Temperature (°C)
175
P(t) = 0.1
BVDSS Limited
P(t) = 1
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area
Maximum Avalanche and Drain Current
vs. Case Temperature
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
Square Wave Pulse Duration (s)
10 -1
1
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?72250.
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Document Number: 72250
S10-2545-Rev. C, 08-Nov-10
Legal Disclaimer Notice
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Revision: 02-Oct-12
1
Document Number: 91000