RENESAS HD74HC393P

HD74HC393
Dual 4-bit Binary Counters
REJ03D0625-0200
(Previous ADE-205-504)
Rev.2.00
Mar 30, 2006
Description
The HD74HC393 contain two 4-bit ripple carry binary counters, which can be cascaded to create a single divide-by-256
counter.
The HD74HC393 is incremented on the high to low transition (negative edge) of the clock input, and each has an
independent clear input. When clear is set high all four bits of each counter are set to a low level. This enables count
truncation and allows the implementation of divide-by-N counter configurations.
Features
• High Speed Operation: tpd (A to QA) = 16 ns typ (CL = 50 pF)
• High Output Current: Fanout of 10 LSTTL Loads
• Wide Operating Voltage: VCC = 2 to 6 V
• Low Input Current: 1 µA max
• Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
• Ordering Information
Part Name
Package Type
HD74HC393P
DILP-14 pin
HD74HC393FPEL
SOP-14 pin (JEITA)
Package Code
(Previous Code)
PRDP0014AB-B
(DP-14AV)
PRSP0014DF-B
(FP-14DAV)
Package
Abbreviation
Taping Abbreviation
(Quantity)
P
—
FP
EL (2,000 pcs/reel)
Note: Please consult the sales office for the above package availability.
Function Table
Note:
Clock
Clear
Outputs
X
H
H
L
L
No change
L
L
L
No change
No change
L
Advance to next state
1. H; High level, L; Low level, X; Irrelevant
Rev.2.00 Mar 30, 2006 page 1 of 6
HD74HC393
1A
1
14
VCC
1Clear
2
13
2A
1QA
3
CLR
QA
12
2Clear
1QB
4
QB
CLR
QA
11
2QA
1QC
5
QC
QB
10
2QB
1QD
6
QD
A
QC
9
2QC
GND
7
QD
8
2QD
A
Outputs
Outputs
Pin Arrangement
(Top view)
Logic Diagram
Clock
C
D
C
D
C
D
C
D
Clear
Rev.2.00 Mar 30, 2006 page 2 of 6
Q
QA
Q
Q
QB
Q
Q
QC
Q
Q
Q
QD
HD74HC393
Absolute Maximum Ratings
Item
Symbol
Ratings
Unit
Supply voltage range
Input / Output voltage
VCC
VIN, VOUT
–0.5 to 7.0
–0.5 to VCC +0.5
V
V
IIK, IOK
IOUT
±20
±25
mA
mA
ICC or IGND
PT
±50
500
mA
mW
Input / Output diode current
Output current
VCC, GND current
Power dissipation
Storage temperature
Tstg
–65 to +150
°C
Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of
which may be realized at the same time.
Recommended Operating Conditions
Item
Supply voltage
Symbol
VCC
Ratings
2 to 6
Unit
V
Input / Output voltage
Operating temperature
VIN, VOUT
Ta
0 to VCC
–40 to 85
V
°C
tr , tf
0 to 1000
0 to 500
Input rise / fall time
Note:
*1
ns
0 to 400
1. This item guarantees maximum limit when one input switches.
Waveform: Refer to test circuit of switching characteristics.
Conditions
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
Electrical Characteristics
Item
Input voltage
Symbol VCC (V)
VIH
VIL
Output voltage
VOH
VOL
Input current
Quiescent supply
current
Iin
ICC
Min
Ta = 25°C
Typ Max
Ta = –40 to+85°C
Unit
Min
Max
2.0
4.5
1.5
3.15
—
—
—
—
1.5
3.15
—
—
6.0
2.0
4.2
—
—
—
—
0.5
4.2
—
—
0.5
4.5
6.0
—
—
—
—
1.35
1.8
—
—
1.35
1.8
2.0
4.5
1.9
4.4
2.0
4.5
—
—
1.9
4.4
—
—
6.0
4.5
5.9
4.18
6.0
—
—
—
5.9
4.13
—
—
6.0
2.0
5.68
—
—
0.0
—
0.1
5.63
—
—
0.1
4.5
6.0
—
—
0.0
0.0
0.1
0.1
—
—
0.1
0.1
4.5
6.0
—
—
—
—
0.26
0.26
—
—
0.33
0.33
6.0
6.0
—
—
—
—
±0.1
4.0
—
—
±1.0
40
Rev.2.00 Mar 30, 2006 page 3 of 6
Test Conditions
V
V
V
Vin = VIH or VIL IOH = –20 µA
IOH = –4 mA
V
IOH = –5.2 mA
Vin = VIH or VIL IOL = 20 µA
IOH = 4 mA
IOH = 5.2 mA
µA Vin = VCC or GND
µA Vin = VCC or GND, Iout = 0 µA
HD74HC393
Switching Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = 25°C
Item
Symbol VCC (V)
Maximum clock
frequency
fmax
Propagation delay
time
tPLH
tPHL
tPLH
tPHL
tPLH
tPHL
tPLH
tPHL
tPHL
Pulse width
tw
Removal time
th
Output rise/fall
time
tTLH
tTHL
Input capacitance
Cin
Ta = –40 to +85°C
2.0
Min
—
Typ
—
Max
5
Min
—
Max
4
4.5
6.0
—
—
—
—
25
29
—
—
20
24
2.0
4.5
—
—
—
16
120
24
—
—
150
30
6.0
2.0
—
—
—
—
20
185
—
—
26
230
4.5
6.0
—
—
20
—
37
31
—
—
46
39
2.0
4.5
—
—
—
24
220
44
—
—
275
55
6.0
2.0
—
—
—
—
37
260
—
—
47
325
4.5
6.0
—
—
28
—
52
44
—
—
65
55
2.0
4.5
—
—
—
21
150
30
—
—
190
38
6.0
2.0
—
80
—
—
28
—
—
100
33
—
4.5
6.0
16
14
—
—
—
—
20
17
—
—
2.0
4.5
50
10
—
—
—
—
65
13
—
—
6.0
2.0
9
—
—
—
—
75
11
—
—
95
4.5
6.0
—
—
5
—
15
13
—
—
19
16
—
—
5
10
—
10
Unit
Test Conditions
MHz
ns
Clock to QA
ns
Clock to QB
ns
Clock to QC
ns
Clock to QD
ns
Clear to QA, QB, QC, QD
ns
Clock, clear
ns
Clear to clock
ns
pF
Test Circuit
VCC
VCC
Output
Pulse Generator
Zout = 50 Ω
Input
Pulse Generator
Zout = 50 Ω
QA
See Function Table
Input
A
QB
QC
Clear
Output
Output
Output
CL = 50 pF
CL = 50 pF
CL = 50 pF
QD
CL = 50 pF
Note : 1. CL includes probe and jig capacitance.
Rev.2.00 Mar 30, 2006 page 4 of 6
HD74HC393
Waveforms
• Waveform – 1
tr
tf
VCC
Clock
50%
50%
tw
50%
50%
0V
tw
tPHL (Measure at tn+2)
tPLH (Measure at tn+1)
90%
50%
10%
QA
90%
50%
10%
tTHL
tPHL (Measure at tn+4)
90%
50%
10%
tTHL
tPHL (Measure at tn+8)
VOH
VOL
tTLH
tPLH (Measure at tn+4)
90%
90%
50%
10%
50%
10%
QC
VOL
tTLH
tPLH (Measure at tn+2)
90%
50%
10%
QB
VOH
VOH
VOL
tTHL
tTLH
tPHL (Measure at tn+16)
tPLH (Measure at tn+8)
90%
90%
50%
10%
QD
tTHL
50%
10%
VOH
VOL
tTLH
Notes: 1. Input waveform: PRR ≤ 1 MHz, Zo = 50 Ω, tr ≤ 6 ns, tf ≤ 6 ns
2. tn is bit time with all outputs at low.
• Waveform – 2
tr
tf
VCC
90 %
50 % 50 %
Clear
10 %
10 %
t w(clear)
0V
t PHL
VOH
90%
QA to QD
50 %
10%
VOL
tTHL
Notes: 1. Input waveform: PRR ≤ 1 MHz, Zo = 50 Ω, tr ≤ 6 ns, tf ≤ 6 ns
2. The output are measured one at a time with one transition per measurement.
Rev.2.00 Mar 30, 2006 page 5 of 6
HD74HC393
Package Dimensions
JEITA Package Code
P-DIP14-6.3x19.2-2.54
RENESAS Code
PRDP0014AB-B
Previous Code
DP-14AV
MASS[Typ.]
0.97g
D
8
E
14
7
1
b3
A
Z
A1
Reference
Symbol
L
e1
D
E
A
A1
bp
b3
c
θ
e
Z
L
θ
bp
e
c
e1
( Ni/Pd/Au plating )
JEITA Package Code
P-SOP14-5.5x10.06-1.27
RENESAS Code
PRSP0014DF-B
*1
Previous Code
FP-14DAV
Dimension in Millimeters
Min
Nom Max
7.62
19.2 20.32
6.3 7.4
5.06
0.51
0.40 0.48 0.56
1.30
0.19 0.25 0.31
0°
15°
2.29 2.54 2.79
2.39
2.54
MASS[Typ.]
0.23g
D
F
14
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
8
c
HE
*2
E
bp
Index mark
Terminal cross section
( Ni/Pd/Au plating )
1
Z
7
e
*3
bp
x
Reference
Symbol
M
A
L1
A1
θ
y
L
Detail F
Rev.2.00 Mar 30, 2006 page 6 of 6
D
E
A2
A1
A
bp
b1
c
c1
θ
HE
e
x
y
Z
L
L1
Dimension in Millimeters
Min Nom Max
10.06 10.5
5.50
0.00 0.10 0.20
2.20
0.34 0.40 0.46
0.15 0.20 0.25
0°
8°
7.50 7.80 8.00
1.27
0.12
0.15
1.42
0.50 0.70 0.90
1.15
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
http://www.renesas.com
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology (Shanghai) Co., Ltd.
Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120
Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
Renesas Technology Malaysia Sdn. Bhd
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
© 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .6.0