SG-BGA-6007 Ironwood Electronics

GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
Top View
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
28.225mm
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
A
28.225mm
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
5
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
6
Elastomer Guide: Non-clad FR4.
Thickness = 0.725mm.
7
Ball Guide: Kapton polyimide.
8
Socket base screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 12.7mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10
Insulation Plate: FR4/G10, Thickness = 1.59mm.
11
Backing Plate: Black anodized Aluminum.
Thickness = 6.35mm.
Recommended torque = 3 in lbs.
4
1
Side View
(Section AA)
3
Assembled
8.25mm +
IC thickness
9
2
8
7
10
6
Customer's
BGA IC
SG-BGA-6007 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
11
5
Customer's Target PCB
Status: Released
Scale: -
Rev: G
Drawing: Meghann Fedde
Date: 8/16/01
File: SG-BGA-6007 Dwg.mcd
Modified: 7/6/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 4
Recommended PCB Layout
Top View
Orientation Mark
1.25mm±0.13mm(x4)
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
2.74mm*
1.25mm±0.13mm(x4)
1mm typ.
2.54mm
Socket
Body Size
2.36mm
Ø 0.85mm±0.025mm (x2)
Alignment Hole
Ø 0.51mmPAD
5.08mm
Ø 1.61mm±0.05mm(x4)
Mounting Hole
25.725mm(x4)
28.225mm±0.125mm (x4)
30.725mm sq. backing plate
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
NOTE: Steel backing plate may be required based on end user's application
SG-BGA-6007 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
Status: Released
Scale: 3:1
Rev: G
Drawing: Meghann Fedde
Date: 8/16/01
File: SG-BGA-6007 Dwg.mcd
Modified: 7/6/09, AE
PAGE 2 of 4
Compatible BGA Spec
DETAIL
TOP VIEW
D
X
Y
SIDE VIEW
5
DETAIL
0.20 Z
A
E
Z
A1
0.2 Z
4
0.20
1
Dimensions are in millimeters.
2
Interpret dimensions and tolerances per ASME
Y14.5M-1994.
3
Dimension b is measured at the maximum
solder ball diameter, parallel to datum plane Z.
4
Datum Z (seating plane) is defined by the
spherical crowns of the solder balls.
5
Parallelism measurement shall exclude any
effect of mark on top surface of package.
e
DIM
Ø0.25 Z X Y
Ø0.10
MAX
2.5
A
A1
3 Øb
MIN
0.6
0.4
b
0.70
D
23.00 BSC
E
23.00 BSC
e
1.0 BSC
Array 22x22
BOTTOM VIEW
SG-BGA-6007 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev: G
Drawing: Meghann Fedde
Date: 8/16/01
File: SG-BGA-6007 Dwg.mcd
Modified: 7/6/09, AE
PAGE 3 of 4
2.5mm
1.27mm (x4)
Top View
2.5mm
30.725mm
25.725mm (x4)
5mm
5.03mm
Ø 1.61mm±0.05mm (x4)
10mm Sqr.
Note: Backing plate holes are tapped to accept 0-80 screws.
16mm (x4)
20.06mm
1.59mm
Insulation Plate
Side View
6.35mm
Backing Plate
Description: Backing Plate with Insulation Plate
SG-BGA-6007 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev: G
Drawing: Meghann Fedde
Date: 8/16/01
File: SG-BGA-6007 Dwg.mcd
Modified: 7/6/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 4 of 4