GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling holes) with hardware. Top View High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 36.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 6.5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Cirlex or equivalent. Thickness = 0.75mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 9.525mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Insulation Plate: FR4/G10, Thickness = 1.59mm. 11 Backing Plate: Black anodized Aluminum. Thickness = 6.35mm. 36.225mm Recommended torque = 18 in lbs. 4 1 Side View (Section AA) 9 3 Assembled 8.25mm + IC thickness 2 8 7 10 6 11 Customer's BGA IC 5 Customer's Target PCB Scale: - SG-BGA-6198 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 10/27/06 File: SG-BGA-6198 Dwg.mcd Modified: 7/21/09, AE Rev: B All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View 1.25mm±0.13mm(x4) Orientation Mark *Note: BGA pattern is not symmetrical with respect to the mounting holes. 2.74mm* 1mm typ. 1.25mm±0.13mm(x4) 2.36mm 2.54mm Ø 0.85mm±0.025mm(x2) Non plated alignment hole 36.225mm±0.125mm (x4) Socket size Ø 0.51mmxPAD 5.08mm 2.5mm±0.13mm 2.5mm±0.13mm Ø 1.61mm±0.05mm(x8) Non plated mounting hole 16.8625mm (x8) 38.725mm±0.125mm (x4) Backing plate size Target PCB Recommendations Total thickness: 2.4mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Scale: 2:1 SG-BGA-6198 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 10/27/06 File: SG-BGA-6198 Dwg.mcd Modified: 7/21/09, AE Rev: B PAGE 2 of 4 Compatible BGA Spec Y DETAIL D X e E 3 Øb Ø0.30 Z X Y Ø0.10 0.20 BOTTOM VIEW TOP VIEW SIDE VIEW 5 DETAIL 0.35 Z DIM 1 Dimensions are in millimeters. 2 Interpret dimensions and tolerances per ASME Y14.5M-1994. 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. A Z 4 0.2 Z MAX 3.4 A A1 A1 MIN 0.5 0.3 b 0.7 D 31.00 BSC E 31.00 BSC e 1.0 BSC Array 30x30 Scale: - SG-BGA-6198 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 10/27/06 File: SG-BGA-6198 Dwg.mcd Modified: 7/21/09, AE Rev: B PAGE 3 of 4 2.5mm 1.27mm (x4) 2.5mm 16.863mm±0.025mm (x8) 38.725mm Ø 1.61mm±0.05mm (x8) Top View Note: Backing plate holes are tapped to accept 0-80 screws. 10mm Sqr. 17mm (x4) 38.725mm 1.59mm Insulation Plate Side View 6.35mm Backing Plate Description: Insulation Plate and Backing Plate Scale: - SG-BGA-6198 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 10/27/06 File: SG-BGA-6198 Dwg.mcd Modified: 7/21/09, AE Rev: B PAGE 4 of 4