GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid A 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 20 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.5mm. 6 Elastomer Guide: Non-clad FR4. Thickness = 0.475mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 12.7mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. A Top View Recommended torque = 6 in oz 4 1 9 3 Assembled 8.55mm + IC thickness 2 8 6 12 7 10 Side View (Section AA) 10 11 Customer's BGA IC SG-BGA-7048 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com 5 11 Backing Plate: Black anodized Aluminum. Thickness = 6.35mm. 12 IC Guide: FR4/G10 Customer's Target PCB Status: Released Scale: - Insulation Plate: FR4/G10, Thickness = 1.59mm. Rev: C Drawing: H. Hansen Date: 6/20/05 File: SG-BGA-7048 Dwg Modified: 2/24/10, MAF All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. Orientation Mark Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. 1.25mm±0.125mm(x4) 3.11mm 0.5mm typ. 1.25mm±0.125mm(x4) Socket Body Size 2mm 2.86mm Ø 0.85mm±0.025mm (x2) Non plated alignment hole 4mm 3mm Ø 0.28mm pad Ø 1.61mm±0.05mm (x4) Non plated mounting hole 4mm 9.725mm (x4) 12.225mm (x4) 14.73mm sqr. backing plate outline Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask All dimensions are in mm unless stated otherwise Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. SG-BGA-7048 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: 4:1 Rev: C Drawing: H. Hansen Date: 6/20/05 File: SG-BGA-7048 Dwg Modified: 2/24/10, MAF PAGE 2 of 4 Compatible BGA Spec X D Y e E 3 Øb Ø0.05 X Y Ø0.05 Bottom View Top View DIM 5 1. Dimensions are in millimeters. A 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. A1 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. MIN MAX 1.0 0.11 0.21 b 0.10 Z A 0.08 Z 4 Z A1 End View 0.35 D 5.0 BSC E 5.0 BSC e 0.5 BSC 9 x 9 array All dimensions are in mm unless stated otherwise SG-BGA-7048 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: 1:0.125 Rev: C Drawing: H. Hansen Date: 6/20/05 File: SG-BGA-7048 Dwg Modified: 2/24/10, MAF PAGE 3 of 4 14.73mm 2.5mm 1.27mm (x4) 2.5mm 1.5mm Top View 14.73mm 9.725mm±0.025mm (x4) 3.5mm Ø 1.61mm±0.05mm (x4) 3mm sqr. 5.94mm Note: Backing plate holes are tapped to accept 0-80 screws. 1.59mm Insulation Plate Side View Backing Plate 6.35mm Description: Insulation Plate and Backing Plate SG-BGA-7048 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: C Drawing: H. Hansen Date: 6/20/05 File: SG-BGA-7048 Dwg Modified: 2/24/10, MAF All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise) PAGE 4 of 4