SG-BGA-7051 Ironwood Electronics

GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable swivel socket lid
A
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
5
Elastomer: 20 micron dia gold plated brass
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.5mm.
6
Elastomer Guide: Non-clad FR4.
Thickness = 0.475mm.
7
Ball Guide: Kapton polyimide.
8
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 9.525mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
A
Top View
Recommended torque = 0.5 in lbs./
8 in oz.
4
1
9
3
Assembled
8.25mm +
IC thickness
2
8
12
6
7
10
Side View
(Section AA)
10
11
Customer's
BGA IC
SG-BGA-7051 Drawing
© 2005 IRONWOOD ELECTRONICS, INC.
Tele: (952) 229-8200
www.ironwoodelectronics.com
5
Insulation Plate: FR4/G10, Thickness = 1.59mm.
11
Backing Plate: Black anodized Aluminum.
Thickness = 6.35mm.
12
IC Guide: Torlon
Customer's Target PCB
Status: Released
Scale: -
Rev: C
Drawing: H. Hansen
Date: 5/10/05
File: SG-BGA-7051 Dwg
Modified: 07/16/14, DH
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 4
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
Recommended PCB Layout
Top View
Note: Full BGA pattern shown.
Please adjust pattern according
to individual requirements.
Orientation Mark
1.25mm±0.13mm (x4)
*4.36mm
1.25mm±0.13mm (x4)
Socket Body
Size
0.5mm typ.
2.54mm
4.11mm
Ø 0.85mm±0.025mm (x2)
Non plated alignment hole
4.5mm
5.08mm
Ø 0.28mm pad
Ø 1.61mm±0.05mm (x4)
Non plated mounting hole
4.5mm
12.725mm (x4)
15.225mm±0.125mm (x4)
17.73mm sqr.
backing plate outline
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
SG-BGA-7051 Drawing
© 2005 IRONWOOD ELECTRONICS, INC.
Tele: (952) 229-8200
www.ironwoodelectronics.com
All dimensions are in mm unless stated otherwise
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
Status: Released
Scale: 4:1
Rev: C
Drawing: H. Hansen
Date: 5/10/05
File: SG-BGA-7051 Dwg
Modified:
07/16/14, DH
PAGE 2 of 4
Compatible BGA Spec.
X
D
Detail
Y
5
DETAIL
0.10 Z
A
E
A1
Z
0.1 Z
4
0.10
Top View
Side View
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per
ASME Y14.5M-1994.
e
3
3
Øb
Ø0.05 Z X Y
Ø0.05 Z
Bottom View
Dimension b is measured at the
maximum solder ball diameter, parallel
to datum plane Z.
4
Datum Z (seating plane) is defined
by the spherical crowns of the solder balls.
5
Parallelism measurement shall exclude
any effect of mark on top surface of
package.
Scale: 1:0.2
SG-BGA-7051 Drawing
Status: Released
© 2005 IRONWOOD ELECTRONICS, INC.
Tele: (952) 229-8200
www.ironwoodelectronics.com
Drawing: H. Hansen
Date: 5/10/05
File: SG-BGA-7051 Dwg
Modified: 07/16/14, DH
DIM
MIN
MAX
1.35
A
A1
0.15
0.25
b
0.35
D
6.0 BSC
E
6.0 BSC
e
0.5 BSC
10 x 10 array
Rev: C
PAGE 3 of 4
17.73mm
2.5mm
2.5mm
Top View
1.27mm (x4)
12.725mm±0.025mm (x4)
17.73mm
2mm
4mm
Note: Backing plate holes are tapped to accept 0-80 screws.
Ø 1.61mm±0.05mm (x4)
4mm sqr.
7.94mm
1.59mm
Side View
Insulation Plate
Backing Plate
6.35mm
Description: Insulation Plate and Backing Plate
SG-BGA-7051 Drawing
© 2005 IRONWOOD ELECTRONICS, INC.
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Scale: 3:1
Rev: C
Drawing: H. Hansen
Date: 5/10/05
File: SG-BGA-7051 Dwg
Modified: 07/16/14, DH
All dimensions are in mm.
All tolerences are +/- 0.125mm.
(Unless stated otherwise)
PAGE 4 of 4