GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling holes) with hardware. 42.23mm High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly A Ball guide prevents over compression of elastomer Easily removable swivel socket lid Top View 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. Recommended torque = 5 in lb. 4 4 Heat sink compression screw: Black anodized Aluminum. Hex socket = 5mm, fin height 10 mm, octagonal 5 Elastomer: Embedded Silver Ball Matrix Thickness = 0.5969mm - 0.6604mm 6 Ball Guide: Kapton polyimide. 7 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 12.7mm long. 8 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 9 Insulation Plate: FR4/G10, Thickness = 1.59mm. 10 Backing Plate: Black anodized Aluminum. Thickness = 6.35mm. 8 1 3 2 7 6 5 Side View (Section AA) 9 10 Customer's BGA IC SM-BGA-9000 Drawing © 2011 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Customer's Target PCB Status: Released Scale: - Rev: A Drawing: E Smolentseva Date: 4/12/11 File: SM-BGA-9000 Dwg.mcd Modified: All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View Orientation Mark 2.4625mm 0.8mm typ. 2.4625mm 2.54mm Ø 0.85mm±0.025mm (x2) Non Plated Alignment Hole 28.225mm±0.125mm sqr. Socket size Ø 0.43mm pad (x 521) 5.08mm 1.25mm±0.13mm Ø 1.7mm±0.1mm (x4) Non Plated Mounting Hole 1.25mm±0.13mm 25.725mm(x4) Target PCB Recommendations Total thickness: 2.4mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask 30.725mm sq. backing plate NOTE: Steel backing plate may be required based on end user's application SM-BGA-9000 Drawing © 2011 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Status: Released Scale: - Rev: A Drawing: E Smolentseva Date: 4/12/11 File: SM-BGA-9000 Dwg.mcd Modified: PAGE 2 of 4 Compatible BGA Spec D DETAIL 19.5mm X Y e 19.5mm E 3 Øb Ø0.15 Z X Y Ø0.08 TOP VIEW SIDE VIEW 0.20 BOTTOM VIEW 2.4mm (x4) DIM 5 DETAIL 0.15 Z A1 Z 4 SM-BGA-9000 Drawing © 2011 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com MAX A 1.8 2.06 0.30 0.50 1. Dimensions are in millimeters. A1 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. b 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. 1.17mm REF A MIN 0.15 Z Status: Released Scale: - 0.50 D 23.0 BSC E 23.0 BSC e 0.8 BSC Array: 27x27 Rev: A Drawing: E Smolentseva Date: 4/12/11 File: SM-BGA-9000 Dwg.mcd Modified: PAGE 3 of 4 30.725mm 2.5mm 1.27mm (x4) Top View 2.5mm 25.725mm (x4) 30.725mm 5mm 5.03mm Ø 1.61mm±0.05mm (x4) 10mm Sqr. Note: Backing plate holes are tapped to accept 0-80 screws. 16mm (x4) 20.06mm 1.59mm Insulation Plate Side View 6.35mm Backing Plate Description: Backing Plate with Insulation Plate SM-BGA-9000 Drawing © 2011 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: A Drawing: E Smolentseva Date: 4/12/11 File: SM-BGA-9000 Dwg.mcd Modified: All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 4 of 4