Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 22.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 22.225mm 4 Side View (Section AA) Compression screw: Black anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. Recommended torque = 3 - 4 in lbs. 5 4 1 3 Assembled 8.25mm + IC thickness 9 2 8 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Non-clad FR4. Thickness = 0.725mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 9.525mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Socket base nut: 18-8 Stainless steel, 0-80 fine thread. 7 6 10 5 11 Customer's BGA IC SG-BGA-6064 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com 11 Customer's Target PCB Status: Released Scale: - Rev: C Drawing: H. Hansen Date: 8/29/02 File: SG-BGA-6064 Dwg.mcd Modified: 7/6/09, AE Nylon washer: 1.73mm ID; 4.78mm OD 0.64mm thickness. All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 3 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. Orientation Mark 1.25mm±0.13mm(x4) 1mm typ. 1.25mm±0.13mm(x4) Socket Body Size 2.74mm* 2.36mm 2.54mm 0mm (x2) -0.025mm Alignment Hole Ø 0.85mm Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. Ø 0.51mmPAD 5.08mm 0mm (x4) -0.025mm Mounting Hole 19.725mm (x4) Ø 1.61mm 22.225mm±0.125mm (x4) Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application SG-BGA-6064 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Status: Released Scale: 3:1 Rev: C Drawing: H. Hansen Date: 8/29/02 File: SG-BGA-6064 Dwg.mcd Modified: 7/6/09, AE PAGE 2 of 3 Compatible BGA Spec TOP VIEW SIDE VIEW DETAIL Y X D 5 DETAIL 0.20 Z A E Z A1 0.2 Z 4 0.20 e 1. Dimensions are in millimeters. DIM 2. Interpret dimensions and toleraces per ASME Y14.5M-1994. 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plame Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. Øb Ø0.25 Z X Y Ø0.10 MAX 2.02 A A1 3 MIN 0.5 0.3 b 0.6 D 17.00 BSC E 17.00 BSC e 1.0 BSC Array 16x16 BOTTOM VIEW SG-BGA-6064 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: C Drawing: H. Hansen Date: 8/29/02 File: SG-BGA-6064 Dwg.mcd Modified: 7/6/09, AE PAGE 3 of 3