GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 40.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A 1 A 2 Socket base: Black anodized Aluminum. Thickness = 6.5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 40.225mm Side View (Section AA) Recommended torque = 18 in lbs. 5 4 1 9 3 Assembled 8.25mm + IC thickness 2 10 6 11 SG-BGA-6069 Drawing © 2002 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Customer's BGA IC Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Cirlex or equivalent. Thickness = 0.75mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, 18-8 Stainless steel, 0-80 fine thread , 19.05mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Insulation Plate: FR4/G10, Thickness = 1.59mm. 11 Backing Plate: Black anodized Aluminum. Thickness = 6.35mm. 8 7 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 5 Status: Released Drawing: H. Hansen File: SG-BGA-6069 Dwg.mcd Customer's Target PCB Scale: - Rev: C All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. Date: 12/27/02 Modified: 5/19/08 PAGE 1 of 4 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. 1.25mm±0.13mm(x4) Orientation Mark 2.73mm 1.27mm typ. 1.25mm±0.13mm(x4) 2.35mm 2.54mm Ø 0.85mm±0.025mm(x2) Non plated alignment hole 40.225mm±0.125mm(x4) Socket size Ø 0.635mmxPAD 5.08mm 2.5mm±0.13mm 2.5mm±0.13mm Ø 1.61mm±0.05mm(x8) Non plated mounting hole 18.8625mm(x8) 42.725mm±0.125mm (x4) Backing plate size Target PCB Recommendations Total thickness: 2.4mm minimum Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application SG-BGA-6069 Drawing © 2002 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Drawing: H. Hansen File: SG-BGA-6069 Dwg.mcd Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Scale: 2:1 Rev: C Date: 12/27/02 Modified: 5/19/09 PAGE 2 of 4 Compatible BGA Spec DETAIL Y D X e E 3 Øb Ø0.25 Z X Y Ø0.10 0.20 SIDE VIEW 5 DETAIL 1. Dimensions are in millimeters. 2. Interpret dimensions and toleraces per ASME Y14.5M-1994. 0.20 Z 3 A 4 A1 Z Array 27x27 BOTTOM VIEW TOP VIEW 4 SG-BGA-6069 Drawing © 2002 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com 0.2 Z 5 Status: Released DIM Dimension b is measured at the maximum solder ball diameter, parallel to datum plame Z. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. Parallelism measurement shall exclude any effect of mark on top surface of package. Scale: - MIN MAX 3.5 A A1 0.55 0.35 b 0.90 D 35.0 BSC E 35.0 BSC e 1.27 BSC Rev: C Drawing: H. Hansen Date: 12/27/02 File: SG-BGA-6069 Dwg.mcd Modified: 5/19/09 PAGE 3 of 4 2.5mm 2.5mm 1.27mm (x4) 18.863mm±0.025mm(x8) Top View 42.725mm Ø 1.61mm±0.05mm (x8) 10mm Sqr. 20mm (x4) Note: Backing plate holes are tapped to accept 0-80 screws. 42.725mm 1.59mm Insulation Plate Side View Backing Plate 6.35mm Description: Insulation Plate and Backing Plate SG-BGA-6069 Drawing © 2002 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Scale: - Rev: C Drawing: H. Hansen Date: 12/27/02 File: SG-BGA-6069 Dwg.mcd Modified: 5/19/09 PAGE 4 of 4