GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 28.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 28.225mm Side View (Section AA) 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 1.5mm. 4 Compression screw: Black anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Non-clad FR4. Thickness = 0.725mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, Alloy steel with black oxide finish, 0-80 fine thread , 12.7mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Insulation Plate: FR4/G10, Thickness = 1.59mm. 11 Backing Plate: Black anodized Aluminum. Thickness = 6.35mm. Recommended torque = 3 in lbs. 4 1 3 Assembled 8.25mm + IC thickness 9 2 8 7 10 6 Customer's BGA IC SG-BGA-6067 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com 11 5 Customer's Target PCB Status: Released Scale: - Rev: C Drawing: H. Hansen Date: 9/12/02 File: SG-BGA-6067 Dwg.mcd Modified: 7/6/09, AE All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View Orientation Mark *Note: BGA pattern is not symmetrical with respect to the mounting holes. 1.25mm±0.13mm(x4) 2.74mm* 1.25mm±0.13mm(x4) 1mm typ. 2.54mm Socket Body Size 2.36mm Ø 0.85mm±0.025mm (x2) Alignment Hole Ø 0.51mmPAD 5.08mm Ø 1.61mm±0.05mm(x4) 25.725mm(x4) Mounting Hole 28.225mm±0.125mm (x4) 30.725mm sq. backing plate Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application SG-BGA-6067 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Scale: 3:1 Rev: C Drawing: H. Hansen Date: 9/12/02 File: SG-BGA-6067 Dwg.mcd Modified: 7/6/09, AE PAGE 2 of 3 Compatible BGA Spec DETAIL TOP VIEW D X Y SIDE VIEW 5 DETAIL 0.20 Z A E Z A1 0.2 Z 4 0.20 e DIM 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Øb Parallelism measurement shall exclude any effect of mark on top surface of package. MAX 3.5 A A1 3 MIN 0.5 0.3 b 0.70 D 23.00 BSC E 23.00 BSC e 1.0 BSC Array 22x22 Ø0.25 Z X Y Ø0.10 BOTTOM VIEW SG-BGA-6067 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: C Drawing: H. Hansen Date: 9/12/02 File: SG-BGA-6067 Dwg.mcd Modified: 7/6/09, AE PAGE 3 of 4 2.5mm 1.27mm (x4) Top View 2.5mm 30.725mm 25.725mm (x4) 5mm 5.03mm Ø 1.61mm±0.05mm (x4) 10mm Sqr. Note: Backing plate holes are tapped to accept 0-80 screws. 16mm (x4) 20.06mm 1.59mm Insulation Plate Side View 6.35mm Backing Plate Description: Backing Plate with Insulation Plate SG-BGA-6067 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: C Drawing: H. Hansen Date: 9/12/02 File: SG-BGA-6067 Dwg.mcd Modified: 7/6/09, AE PAGE 4 of 4