GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling holes) with hardware. Top View High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 28.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 1.5mm. 4 Compression screw: Black anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 20 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.5mm. 6 Elastomer Guide: Non-clad FR4. Thickness = 0.475mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, Alloy steel with black oxide finish, 0-80 fine thread , 15.875mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Insulation Plate: FR4/G10, Thickness = 1.59mm. 11 Backing Plate: Black anodized Aluminum. Thickness = 6.35mm. 28.225mm Side View (Section AA) Recommended torque = 3 in lbs. 4 1 9 3 Assembled 8.25mm + IC thickness 2 8 7 10 6 Customer's BGA IC 11 5 Customer's Target PCB Scale: - SG-BGA-8007 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Suite 400, Burnsville MN Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 7/30/07 File: SG-BGA-8007 Dwg Modified: 7/6/09, AE Rev: B All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View Orientation Mark *Note: BGA pattern is not symmetrical with respect to the mounting holes. 1.25mm±0.13mm(x4) 2.61mm* 1.25mm±0.13mm(x4) 1mm typ. 2.54mm Socket Body Size 2.36mm Ø 0.85mm±0.025mm (x2) Alignment Hole Ø 0.51mmPAD 5.08mm Ø 1.75mm±0.05mm (x4) 25.725mm(x4) Mounting Hole 28.225mm±0.125mm (x4) 30.725mm sq. backing plate Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Scale: - SG-BGA-8007 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Suite 400, Burnsville MN Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 7/30/07 File: SG-BGA-8007 Dwg Modified: 7/6/09, AE Rev: B PAGE 2 of 3 Compatible BGA Spec DETAIL TOP VIEW D X Y SIDE VIEW A2 5 DETAIL 0.20 Z A E Z A1 0.2 Z 4 A3 0.20 13.4mm Sqr. DIM e 3 Øb Ø0.25 Z X Y Ø0.10 MIN MAX 1.7 1. Dimensions are in millimeters. A 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. A1 0.3 A2 0.25 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. A3 0.15 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. b 0.50 4 5 Parallelism measurement shall exclude any effect of mark on top surface of package. 1.10 0.70 D 23.00 BSC E 23.00 BSC e 1.0 BSC Array 22x22 BOTTOM VIEW Scale: - SG-BGA-8007 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Suite 400, Burnsville MN Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 7/30/07 File: SG-BGA-8007 Dwg Modified: 7/6/09, AE Rev: B PAGE 3 of 4 2.5mm 1.27mm (x4) Top View 2.5mm 30.725mm 25.725mm (x4) 5mm 5.03mm Ø 1.61mm±0.05mm (x4) 10mm Sqr. Note: Backing plate holes are tapped to accept 0-80 screws. 16mm (x4) 20.06mm 1.59mm Insulation Plate Side View 6.35mm Backing Plate Description: Backing Plate with Insulation Plate Scale: - SG-BGA-8007 Drawing Status: Released © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Suite 400, Burnsville MN Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 7/30/07 File: SG-BGA-8007 Dwg Modified: 7/6/09, AE Rev: B PAGE 4 of 4