cesdlc3v0l4

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD
SOT-553 Plastic-Encapsulate Diodes
SOT-553
CESDLC3V0L4
SOT-553
Low Capacitance Quad Array for ESD Protection
DESCRIPTION
The CESDLC3V0L4 is designed to protect voltage sensitive components from
5
4
ESD. Excellent clamping capability, low leakage, and fast response time provide
best in class protection on designs that are exposed to ESD. Because of its
small size, it is suited for use in cellular phones, MP3 players, digital cameras
1
2
3
and many other portable applications where board space is at a premium.
FEATURES
z
Four Separate Unidirectional Configurations for Protection
z
Low Leakage Current <1μA @ 3 Volts
z
Small Package
z
Low Capacitance
z
Complies to USB 1.1 Low Speed & Full Speed Specifications
z
These are Pb-Free Devices
BENEFITS
z
Protects Four Lines Against Transient Voltage Conditions
z
Minimize Power Consumption of the System
z
Minimize PCB Board Space
TYPICAL APPLICATIONS
z
Instrumentation Equipment
z
Serial and Parallel Ports
z
Microprocessor Based Equipment
z
Notebooks, Desktops, Servers
z
Cellular and Portable Equipment
A,May,2011
ELECTRICAL CHARACTERISTICS (Ta= 25℃ unless otherwise noted)
Parameter
Symbol
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM
IR
VBR
IT
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @ VRWM
Breakdown Voltage @ IT
Test Current
Maximum Ratings (Ta=25℃ unless otherwise noted)
Parameter
Symbol
Limit
Unit
Peak Power Dissipation @ 8 X 20 μs @Ta= 25°C (Note 1)
Ppk
20
W
Steady State Power -- 1 Diode (Note 2)
PD
150
mW
RΘJA
833
℃/W
Maximum Junction Temperature
Tjmax
150
℃
Operating Junction and Storage Temperature Range
Tj, Tstg
Thermal Resistance Junction−to−Ambient
Above 25 °C, Derate
Lead Solder Temperature (10 Seconds Duration)
-55 ~ +150
TL
260
℃
℃
Stresses exceeding maximum ratings may damage the device. Maximum ratings are stress
ratings only. Functional operation above the recommended. Operating conditions is not implied.
Extended exposure to stresses above the recommended operating conditions may affect device
reliability.
ELECTRICAL CHARACTERISTICS (Ta= 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10mA for all types)
Device
CESDLC3V0L4
Device
Marking
5P
Breakdown
voltage
VBR @ 1mA(Volts)
Leakage
current
IRM @ VRM
VC
Max @IPP
Capacitance
@0V Bias
(pF)
(Note 3)
Capacitance
@3V Bias
(pF)
(Note 3)
Min
Mon
Max
VRWM
IRWM
(μA)
VC
(V)
IPP
(A)
Max
Max
5.3
5.6
5.9
3.0
1.0
10
1.6
13
9
1. Non-repetitive current per Figure 1.
2. Only 1 diode under power. For all 4 diodes under power, PD will be 25%. Mounted on FR-4 board with min pad.
3. Capacitance of one diode at f = 1MHz, VR = 0 V, Ta = 25°C
A,May,2011