RENESAS HD74LS74AP

HD74LS74A
Dual D-type Positive Edge-triggered Flip-Flops
(with Preset and Clear)
REJ03D0415–0300
Rev.3.00
Jul.22.2005
Features
• Ordering Information
Package Code
(Previous Code)
PRDP0014AB-B
(DP-14AV)
Part Name
Package Type
HD74LS74AP
DILP-14 pin
HD74LS74AFPEL
SOP-14 pin (JEITA)
HD74LS74ARPEL
SOP-14 pin (JEDEC)
PRSP0014DF-B
(FP-14DAV)
PRSP0014DE-A
(FP-14DNV)
Package
Abbreviation
Taping Abbreviation
(Quantity)
P
—
FP
EL (2,000 pcs/reel)
RP
EL (2,500 pcs/reel)
Note: Please consult the sales office for the above package availability.
Pin Arrangement
1CLR
1
1D
2
1CK
3
1PR
4
1Q
5
D
1Q
6
CLR
Q
GND
7
CK D
PR CLR
Q
Q
CK
PR
Q
(Top view)
Rev.3.00, Jul.22.2005, page 1 of 7
14
VCC
13
2CLR
12
2D
11
2CK
10
2PR
9
2Q
8
2Q
HD74LS74A
Function Table
Input
Output
Preset
L
Clear
H
Clock
X
D
X
Q
H
Q
L
H
L
L
L
X
X
X
X
L
H*
H
H*
H
H
H
H
↑
↑
H
L
H
L
L
H
H
H
L
X
Q0
Q0
H; high level, L; low level, X; irrelevant, ↑; transition from low to high level,
Q0; level of Q before the indicated steady-state input conditions were established.
Q0; complement of Q0 or level of Q before the indicated steady-state input conditions were established.
*;This configuration is nonstable, that is, it will not persist when preset and clear inputs return to their inactive (high) level.
Absolute Maximum Ratings
Item
Supply voltage
Symbol
VCC
Ratings
7
Unit
V
VIN
PT
7
400
V
mW
Tstg
–65 to +150
°C
Input voltage
Power dissipation
Storage temperature
Note: Voltage value, unless otherwise noted, are with respect to network ground terminal.
Recommended Operating Conditions
Item
Supply voltage
Output current
Operating temperature
Clock frequency
Symbol
VCC
Min
4.75
Typ
5.00
Max
5.25
Unit
V
IOH
IOL
—
—
—
—
–400
8
µA
mA
Topr
fclock
–20
0
25
—
75
25
°C
MHz
Pulse width
Clock High
Clear Preset
tw
tw
25
25
—
—
—
—
ns
Setup time
“H” Data
“L” Data
tsu
tsu
20↑
20↑
—
—
—
—
ns
th
5↑
—
—
ns
Hold time
Note: ↑; The arrow indicates the rising edge.
Rev.3.00, Jul.22.2005, page 2 of 7
HD74LS74A
Electrical Characteristics
(Ta = –20 to +75 °C)
Item
Input voltage
Symbol
VIH
min.
2.0
typ.*
—
max.
—
Unit
V
VIL
—
—
0.8
V
VOH
2.7
—
—
V
VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V,
IOH = –400 µA
VOL
—
—
—
—
0.5
0.4
V
IOL = 8 mA
IOL = 4 mA
—
—
—
—
20
40
—
—
—
—
40
20
µA
VCC = 5.25 V, VI = 2.7 V
—
—
—
—
–0.4
–0.8
—
—
—
—
–0.8
–0.4
mA
VCC = 5.25 V, VI = 0.4 V
—
—
—
—
0.1
0.2
—
—
—
—
0.2
0.1
mA
VCC = 5.25 V, VI = 7 V
IOS
–20
—
–100
mA
VCC = 5.25 V
ICC**
—
4
8
mA
VCC = 5.25 V
Output voltage
D
Clear
Preset
Clock
Input
current
D
Clear
Preset
Clock
D
Clear
Preset
Clock
Short-circuit output
current
Supply current
IIH
IIL
II
Condition
VCC = 4.75 V, VIL = 0.8 V,
VIH = 2 V
Input clamp voltage
VIR
—
—
–1.5
V
VCC = 4.75 V, IIN = –18 mA
Notes: * VCC = 5 V, Ta = 25°C
** With all output open, ICC is measured with the Q and Q outputs high in turn. At the time of measurement, the
clock input is grounded.
Switching Characteristics
(VCC = 5 V, Ta = 25°C)
Item
Maximum clock frequency
Propagation delay time
Symbol
fmax
Inputs
Outputs
min.
25
typ.
33
max.
Unit
MHz
tPLH
tPHL
Clear, Clock
or Preset
Q, Q
—
—
13
25
25
40
ns
ns
Condition
CL = 15 pF,
RL = 2 kΩ
Timing Definition
tw
3V
1.3 V
1.3 V
1.3 V
Clock
tsu
th
tsu
0V
th
3V
1.3 V
1.3 V
1.3 V
Data
0V
"H" Data
Rev.3.00, Jul.22.2005, page 3 of 7
"L" Data
HD74LS74A
Testing Method
Test Circuit
1. ƒmax, tPLH, tPHL (Clock→Q, Q)
4.5V VCC
Output Q
Input
RL
PR
P.G.
Zout = 50Ω
D
Q
Input
CL
Output Q
P.G.
Zout = 50Ω
Notes:
Load circuit 1
CK
CLR
Q
Same as Load Circuit 1.
1. Test is put into the each flip-flop.
2. CL includes probe and jig capacitance.
3. All diodes are 1S2074(H).
2. tPHL, tPLH (Clear or Preset→ Q, Q)
VCC
Input
Output Q
P.G.
Zout = 50Ω
RL
Load circuit 1
PR
D
Q
CL
Output Q
Input
CK
CLR
Q
P.G.
Zout = 50Ω
Notes:
1. Test is put into the each flip-flop.
2. CL includes probe and jig capacitance.
3. All diodes are 1S2074(H).
Rev.3.00, Jul.22.2005, page 4 of 7
Same as Load Circuit 1.
HD74LS74A
Waveforms 1
tTLH
tTHL
tw(L)
90% 90%
1.3 V 1.3 V
Clock
3V
1.3 V
10%
10%
0V
tw(H)
3V
D
0V
tPLH
tPHL
VOH
1.3 V
Q
1.3 V
tPHL
VOL
tPLH
Q
VOH
1.3 V
1.3 V
VOL
Note:
Clock input pulse; tTLH ≤ 15 ns, tTHL ≤ 6 ns, PRR = 1 MHz, duty cycle = 50% and for fmax,
tTLH = tTHL ≤ 2.5 ns
Waveforms 2
tTHL
Clear
tTLH
90%
1.3V
10%
3V
90%
1.3V
10%
tw (clear)
≥ 25ns
0V
tTHL
tTLH
90%
1.3V
10%
Preset
90%
1.3V
10%
tw (preset)
≥ 25ns
tPLH
tPHL
1.3V
Q
3V
0V
VOH
1.3V
tPLH
VOL
VOH
Q
Note:
1.3V
1.3V
tPHL
Crear and presel input pulse; tTLH ≤ 15 ns, tTHL ≤ 6 ns, PRR = 1 MHz,
Rev.3.00, Jul.22.2005, page 5 of 7
VOL
HD74LS74A
Package Dimensions
JEITA Package Code
P-DIP14-6.3x19.2-2.54
RENESAS Code
PRDP0014AB-B
Previous Code
DP-14AV
MASS[Typ.]
0.97g
D
8
E
14
1
7
b3
Z
A1
A
Reference
Symbol
Nom
e1
7.62
D
19.2
E
6.3
L
θ
A1
0.51
bp
0.40
e1
0.48
c
0.19
θ
0°
JEITA Package Code
P-SOP14-5.5x10.06-1.27
RENESAS Code
PRSP0014DF-B
*1
Previous Code
FP-14DAV
D
0.56
e
2.29
0.31
2.54
2.79
15°
2.39
L
2.54
MASS[Typ.]
0.23g
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
F
14
7.4
0.25
Z
( Ni/Pd/Au plating )
20.32
1.30
b3
c
Max
5.06
A
bp
e
Dimension in Millimeters
Min
8
c
HE
*2
E
bp
Index mark
Reference
Symbol
Terminal cross section
( Ni/Pd/Au plating )
1
Z
*3
Nom
Max
D
10.06
10.5
E
5.50
A2
7
e
A1
bp
Dimension in Millimeters
Min
x
M
0.00
0.10
0.20
0.34
0.40
0.46
0.15
0.20
0.25
7.80
8.00
2.20
A
L1
bp
b1
c
A
c
A1
θ
y
L
Detail F
1
θ
0°
HE
7.50
1.27
e
x
0.12
y
0.15
Z
1.42
0.50
L
L
Rev.3.00, Jul.22.2005, page 6 of 7
8°
1
0.70
1.15
0.90
HD74LS74A
JEITA Package Code
P-SOP14-3.95x8.65-1.27
RENESAS Code
PRSP0014DE-A
*1
MASS[Typ.]
0.13g
Previous Code
FP-14DNV
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
F
D
14
8
c
*2
Index mark
HE
E
bp
Reference
Symbol
Terminal cross section
( Ni/Pd/Au plating )
Dimension in Millimeters
Min
Nom
Max
D
8.65
9.05
E
3.95
A2
A1
7
1
Z
e
*3
bp
0.10
0.14
A
x
M
bp
L1
0.25
1.75
0.34
0.40
0.46
0.15
0.20
0.25
6.10
6.20
b1
c
A
c1
A1
θ
L
y
Detail F
θ
0°
HE
5.80
1.27
e
x
0.25
y
0.15
0.635
Z
L
L
Rev.3.00, Jul.22.2005, page 7 of 7
8°
0.40
1
0.60
1.08
1.27
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
http://www.renesas.com
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology (Shanghai) Co., Ltd.
Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China
Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> 2-796-3115, Fax: <82> 2-796-2145
Renesas Technology Malaysia Sdn. Bhd.
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
© 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .3.0