IS31LT3505 1.0MHZ BOOST CONVERTER WITH 35V INTERNAL NMOS July 2014 GENERAL DESCRIPTION FEATURES The IS31LT3505 is a constant current step-up converter with internal NMOS. The step-up converter topology allows series connection of the white LEDs so the LED currents are identical for uniform brightness as well as constant output voltage to drive other devices. The output current of each channel can be set by an external resistor and dimming the brightness of LEDs with the PWM signal or DC voltage. The IS31LT3505 operates with a switching frequency up to 1MHz. A low 0.3V feedback voltage minimizes power loss in the current setting resistor for better efficiency. With OVP circuit, the chip and the system can be safe even if the load is not connected. IS31LT3505 is available in MSOP-10. It operates from 6V to 30V over the temperature range of -40°C to +85°C. 6V to 30V supply voltage High efficiency: 90% typical PWM dimming control Fast 1.0MHz switching frequency Internal high power 35V NMOS Internal soft start Adjustable LED Open Protection Over-temperature protection MSOP-10 package APPLICATIONS TV monitor backlighting PDA, handheld computer GPS receiver TYPICAL APPLICATION CIRCUIT Figure 1 Typical Application Circuit (Constant Current to Drive White LEDs) Note: These components with * symbol are recommended to fix the value. Or it will decrease the performance of whole system. Integrated Silicon Solution, Inc. – www.issi.com Rev. D, 07/15/2014 1 IS31LT3505 PIN CONFIGURATION Package Pin Configuration (Top View) MSOP-10 PGND 1 10 LX VP 2 9 VDD AGND 3 8 NC EN 4 7 FB AGND 5 6 OVP PIN DESCRIPTION No. Pin 1 PGND 2 VP Internal 5V regulator. A power supply for the internal NMOS gate driver and the internal control circuitry. 3,5 AGND Signal ground. All external components ground must be connected to this pin. 4 EN 6 OVP 7 FB Feedback voltage of output. 8 NC No connection. 9 VDD Supply voltage. 10 LX Thermal Pad Description Power ground. Enable control input. Do not let this pin floating. Over-voltage protection of output. The drain of the internal NMOS. Connect to ground. Integrated Silicon Solution, Inc. – www.issi.com Rev. D, 07/15/2014 2 IS31LT3505 ORDERING INFORMATION INDUSTRIAL RANGE: -40°C TO +85°C Order Part No. Package QTY/Reel IS31LT3505-SLS2-TR MSOP-10, Lead-free 2500 Copyright © 2014 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Integrated Silicon Solution, Inc. – www.issi.com Rev. D, 07/15/2014 3 IS31LT3505 ABSOLUTE MAXIMUM RATINGS Supply voltage, VDD Voltage at EN, LX pin All other pins Operate temperature range Storage temperature range Junction temperature range JA ESD (HBM) -0.3V ~ +40V -0.3V ~ +40V -0.3V ~ +6.0V -40°C ~ +85°C -65°C ~ +150°C -40°C ~ +150°C 60°C/W 2.5kV Note: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other condition beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS TA = 25°C, VDD = 12V, unless otherwise noted. Symbol VDD Parameter Condition Supply voltage UVLO Undervoltage threshold ∆UVLO Undervoltage threshold hysteresis IDD Supply current ISD Min. Typ. 6 VP falling Continuous switching Max. Unit 30 V 2.9 V 100 mV 2 No switching 1.1 Shutdown current VEN = 0V 15 VP Internal regulator 6V<VDD<30V, CVP=100nF 4.5 VEN ON EN on threshold VEN rising 1.4 VEN OFF EN off threshold VEN falling 5 mA μA 5.5 V V 0.4 V Fosc Operation frequency 1 MHz DMAX Maximum duty cycle 90 % RDS_ON Internal NMOS on-resistance 0.8 ISW_LK Internal NMOS leakage current VSW = 35V ISW_LIMIT Internal NMOS current limit Duty = 90% VOVP_TH Over voltage threshold 1.8 2.1 1.2 Ω 1 μA 2.4 A 0.9 VFB Feedback voltage TOTP Over temperature threshold 150 °C TOTP-HYS Over temperature threshold hysteresis 50 °C Integrated Silicon Solution, Inc. – www.issi.com Rev. D, 07/15/2014 0.285 0.3 V 0.315 V 4 IS31LT3505 TYPICAL OPERATING CHARACTERISTICS 100 360 355 350 Iout(mA) 345 340 90 Efficiency(%) 335 330 60 Vout=30V,RSET=0.88,L=10uH 50 15 20 Figure 2 25 30 10 Iout vs. Vin Figure 3 345 335 Vin=12VDC,RSET=0.88,L=10uH 21 70 60 Vin=12VDC,RSET=0.88,L=10uH 50 18 80 330 15 Vin(V) 24 27 30 12 Vout(V) 730 700 690 27 30 80 70 60 680 24 100 Efficiency(%) 21 90 710 Iout(mA) 18 720 15 Vout(V) Figure 5 Efficiency vs. Vout Figure 4 Iout vs. Vout Efficiency vs. Vin 90 350 12 30 100 340 25 Efficiency(%) Iout(mA) 20 Vin(V) 360 15 355 70 Vout=30V,RSET=0.88,L=10uH 10 80 Vout=30V,RSET=0.42,L=10uH Vout=30V,RSET=0.42,L=10uH 670 50 18 20 22 24 26 Vin(V) Figure 6 Iout vs. Vin 28 18 20 22 24 26 28 Vin(V) Figure 7 Efficiency vs. Vin Integrated Silicon Solution, Inc. – www.issi.com Rev. D, 07/15/2014 5 IS31LT3505 100 730 720 Iout(mA) Efficiency(%) 710 90 700 690 70 60 680 Vin=24VDC,RSET=0.42,L=10uH Vin=24VDC,RSET=0.42,L=10uH 50 670 80 25 26 27 28 25 30 26 27 28 29 30 Vout(V) Vout(V) Figure 8 Iout vs. Vout 29 Figure 9 Efficiency vs. Vout 320 Reference Voltage(mV) 310 300 290 280 270 260 250 6 10 14 18 22 26 30 Vin(V) Figure 10 VFB voltage vs. Vin Vin=12VDC, RSET=0.88, L=10uH, Vout=28V Figure 11 Soft-start waveform Integrated Silicon Solution, Inc. – www.issi.com Rev. D, 07/15/2014 6 IS31LT3505 Vin=12VDC, RSET=0.88, L=10uH, Vout=28V Figure 12 Operation waveform Vin=12VDC, RSET=0.88, L=10uH, Vout=28V, Vovp=33V Figure 13 OVP waveform Integrated Silicon Solution, Inc. – www.issi.com Rev. D, 07/15/2014 7 IS31LT3505 FUNCTIONAL BLOCK DIAGRAM Integrated Silicon Solution, Inc. – www.issi.com Rev. D, 07/15/2014 8 IS31LT3505 APPLICATION INFORMATION INPUT AND OUTPUT CAPACITOR The output capacitor is decided by the output voltage ripple. A low ESR ceramic capacitor (recommended 22µF) and a 0.1µF/50V ceramic capacitor in parallel will provide sufficient output capacitance for most applications. The input capacitor is used to reduce the input voltage ripple and noise. A low ESR electric capacitor (22µF or larger) and a 1µF/50V ceramic capacitor in parallel as input capacitor is recommended. Place the input and output capacitors close to the IS31LT3505 to reduce the ripple. INDUCTOR Inductor value involves trade-offs in performance. Larger inductors reduce inductor ripple current and larger inductors also bring in unwanted parasitic resistor that degrade the performance. Select an inductor with a rating current over input average current and the saturation current over the Internal NMOS current limit. A 10µH inductor with saturation current over 2A is sufficient for the most applications. Note: The DC voltage (PWM duty cycle) is inversely proportional to the LED current. That is when DC voltage is maximum (the PWM signal is 100% duty cycle), the output current is minimum, ideally zero, and when DC voltage is minimum (the PWM signal is 0% duty cycle), the output current is maximum. The output LED voltage will decrease when the output current becomes lower. Therefore, it must to ensure the output voltage always higher than the input voltage during the dimming. DC VOLTAGE CONTROL Figure 14 shows that the intensity of the LEDs can be adjusted by the DC voltage. As the DC voltage increases, the current pass through R3 increasingly and the voltage drop on R3 increase, i.e. the LED current decreases. The LED current can be calculated by the Formula (2). The internal feedback voltage VFB is 0.3V (Typ.). VFB I LED DIODE To achieve high efficiency, a Schottky diode must be used. Ensure that the diode's average and peak current rating exceed the output LED current and inductor peak current. The diode's reverse breakdown voltage must exceed the over voltage protection voltage (VOVP). Therefore, A SS26 Schottky diode is sufficient for the most applications. SOFT-START The function of soft-start is made for suppressing the inrush current to an acceptable value at startup. The IS31LT3505 provides a built-in soft-start function by clamping the input current and increasing step-by-step so that the output voltage will rise gradually in the softstart period. LED CURRENT CONTROL The IS31LT3505 regulates the LED current by setting the external resistor connecting to feedback and ground. The internal feedback reference voltage is 0.3V (Typ.). The LED current can be set from the Formula (1) easily. I LED V FB RSET (1) In order to have an accurate LED current, precision resistors are preferred (1% is recommended). DIMMING CONTROL R3 (VDC VFB ) R4 RSET (2) When the DC voltage is from 0V to 5V, the value of R3 should be 10kΩ. Refer to Figure 14. PWM SIGNAL CONTROL A filtered PWM signal acts as the DC voltage to regulate the output current. The recommended application circuit is shown as Figure 15. In this circuit, the output ripple depends on the frequency of PWM signal. For smaller output voltage ripple, the recommended frequency of 5V PWM signal should be above 2kHz. To the fixed frequency of PWM signal and change the duty cycle of PWM signal can get different output current. The LED current can be calculated by the Formula (3). The internal feedback voltage VFB is 0.3V (Typ.). VFB I LED R3 (VPWM Duty VFB ) R4 R5 RSET (3) When it’s the 5V PWM signal, the value of R3 should be 10kΩ. Refer to Figure 15. SETTING THE OUTPUT VOLTAGE When IS31LT3505 drives other devices (Figure 16) with the constant voltage, the output voltage is set through the Formula (4). The internal feedback voltage VFB is 0.3V (Typ.). IS31LT3505 can modulate the brightness of LEDs by controlling the DC voltage or the PWM duty cycle (Figure 14, 15). Integrated Silicon Solution, Inc. – www.issi.com Rev. D, 07/15/2014 9 IS31LT3505 VOUT VFB R3 RSET RSET (4) layout is not carefully done, the regulator could show instability as well as EMI problems. SETTING THE OVER VOLTAGE PROTECTION The open string protection is achieved through the over voltage protection (OVP). In some cases, if the output voltage reaches the programmed OVP voltage (VOVP), the protection will be triggered. To make sure the chip functions properly, the OVP setting resistor divider must be set with a proper value. The OVP voltage should be 3V higher than normal operation output voltage and the maximum should not exceed 35V. OVP pin should connect a 10nF ceramic capacitor to GND to avoid unexpected noise coupling into this pin and affecting the OVP function. The OVP threshold is calculated through the Formula (5). 0.9V R1 R2 R2 VOVP (5) SETTING OTHER COMPONENTS There is an R, C between power supply positive terminal to VDD pin. 51 resistor for R and 220nF ceramic capacitor for C are the recommended. The VP pin, output of the internal regulator, must be connected to a 100nF bypass capacitor. If EN pin is not used to enable and disable the IS31LT3505, it should be connected to power supply positive through a 100k resistor. The enable pin needs to be terminated and should not be left floating. These components should be fixed the value as above description, or it will decrease the performance of whole system. Wide traces should be used for connection of the high current loop. When laying out signal ground (pin 5), it is recommended to use the traces separate from power ground (pin1) traces and connect them together at the input capacitor negative terminal or the large ground plane that will avoid the signal ground shift. Both of signal and power ground should be as wide as possible. Other components ground must be connected to signal ground. Especially the RSET ground to signal ground (pin 5) connection should be as short as possible to have an accurate LED current. The capacitor CVDD and CVP should be placed as close as possible to VDD and VP pin for good filtering. The ground of CVDD and CVP must be connected to the signal ground (pin 5). LX pin is a fast switching node. The inductor and diode should be placed as close as possible to the switch pin and the connection between this pin to the inductor and the schottky diode should be kept as short and wide as possible. Avoid other traces cross and routing too long in parallel with this node to minimum the noise coupling into these traces. The feedback network (FB, OVP) should be as short as possible and routed away from the inductor, the schottky diode and LX pin. The feedback pin and feedback network should be shielded with a ground plane or trace to minimize noise coupling into this circuit. The thermal pad on the back of package must be soldered to the large ground plane for ideal power dissipation. PCB LAYOUT CONSIDERATION As for all switching power supplies, especially those providing high current and using high switching frequencies, layout is an important design step. If Integrated Silicon Solution, Inc. – www.issi.com Rev. D, 07/15/2014 10 IS31LT3505 51 100k 4 CIN 22µF D1 (Schottky,ss26) L1 10 H 6.0V~30V 9 C1 1 F LX EN VDD OVP IS31LT3505 C2 220nF 1, 3, 5 GND VP FB 10 R1 6 2 10nF 100nF C3 COUT 0.1 F 22 F R2 7 R4 156k R3 10k RSET DC Control 0V - 5V Figure 14 Application Circuit (Constant Current to Drive White LEDs With DC Dimming) Figure 15 Application Circuit (Constant Current to Drive White LEDs With PWM Dimming) Integrated Silicon Solution, Inc. – www.issi.com Rev. D, 07/15/2014 11 IS31LT3505 D1 (Schottky,ss26) L1 10µH 6.0V~30V VOUT = VFB×(R3+RSET)/RSET 51Ω 100kΩ 4 CIN 22µF 9 C1 1 F LX EN VDD OVP IS31LT3505 VP 10 R1 6 2 C2 220nF C3 COUT R3 0.1 F 22 F 10nF Load R2 100nF 1, 3, 5 GND FB 7 RSET Figure 16 Application Circuit (Constant Voltage to Drive Other Devices) Integrated Silicon Solution, Inc. – www.issi.com Rev. D, 07/15/2014 12 IS31LT3505 CLASSIFICATION REFLOW PROFILES Profile Feature Pb-Free Assembly Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) 150°C 200°C 60-120 seconds Average ramp-up rate (Tsmax to Tp) 3°C/second max. Liquidous temperature (TL) Time at liquidous (tL) 217°C 60-150 seconds Peak package body temperature (Tp)* Max 260°C Time (tp)** within 5°C of the specified classification temperature (Tc) Max 30 seconds Average ramp-down rate (Tp to Tsmax) 6°C/second max. Time 25°C to peak temperature 8 minutes max. Figure 17 Classification Profile Integrated Silicon Solution, Inc. – www.issi.com Rev. D, 07/15/2014 13 IS31LT3505 PACKAGE INFORMATION MSOP-10 Integrated Silicon Solution, Inc. – www.issi.com Rev. D, 07/15/2014 14