ISSI IS31LT3948

IS31LT3948
PFM MODE BOOST LED DRIVER WITH THE EXTERNAL NMOS
OCTOBER 2011
GENERAL DESCRIPTION
FEATURES
The IS31LT3948 is a PFM step-up DC-DC converter
designed for driving the white LED arrays for large
size LCD panel backlighting applications. It can
deliver stable constant output current from a few
milliamps up to 2A, programmed via an external
resistor.
•
•
The IS31LT3948 utilizes a control scheme in which
the output is automatically adjusted to the optimum
output voltage for the system, maximizing the
efficiency. Furthermore, the control scheme is
inherently stable removing the need to provide
additional loop compensation.
•
•
•
•
•
Wide input voltage range: 5V-100V
Constant Current Output limited only by external
component selection (Note)
No loop compensation required
Internal over-voltage protection
Internal over-temperature protection
Operating temperature range -40°C to 85°C
SOP-8 package
Note: The maximum output current is determined by Vout/Vin ratio
as well as the external components. If output current and Vout/Vin
ratio is high, high current components of inductor and NMOS are
needed.
APPLICATIONS
The device features external PWM dimming, which
allows the flexible control of the back-lighting
luminance.
The IS31LT3948 has a wide input voltage range from
5V to 100V (Note). An integrated OVP circuit protects
the chip and the system even under no-load
conditions.
•
•
•
•
•
TV Monitor Backlighting,
Notebook
Automotive
Street Lamp
LED Lighting
Note: The IS31LT3948 has an internal 5V shunt regulator
connected to the VCC pin. A dropping resistor must be
connected between the VCC pin and VIN to limit current flow.
VIN voltages above 100V are allowed but care must be taken to
ensure that the output voltage remains greater than VIN, and that
the NMOS voltage rating is sufficiently large.
TYPICAL OPERATING CIRCUIT
L1
VIN(5~100V)
D1
LED(+)
R1
R4
C1
VCC
TOFF
GATE
M1
C2
ADJ
OVP
GND
FB
LED(-)
C3
CS
R2
R3
R5
Rfb
Figure 1 Typical Operating Circuit
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without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised
to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the
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authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
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Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 8/31/2011
1
IS31LT3948
PIN CONFIGURATIONS
Package
Top View
VCC
1
8
OVP
TOFF
2
7
FB
ADJ
3
6
CS
GND
4
5
GATE
SOP-8
PIN DESCRIPTIONS
Pin
Name
1
VCC
2
TOFF
3
ADJ
4
5
6
GND
GATE
CS
7
FB
8
OVP
Function
Positive power supply input pin. Internally clamped at 5V (typical).
Off time setting pin. An external resistor connected to this PIN forms an
RC discharge path to generate a constant minimum off time of the NMOS
Enable and input peak current control pin. Pulled up to 4.5V internally to
set VCSTH =0.24V when ADJ is floating. If VADJ<0.5V, NMOS will always
shutdown. If 0.5• VADJ• 2.4V, VCSTH = VADJ/10. If VADJ>2.4V, VCSTH =0.24V
Ground
Driver’s output for the gate of the external NMOS
Current sense input for the boost, peak current control loop
Feedback voltage input pin. Used to regulate the current of LEDs by
keeping VFB=0.3V.
Overvoltage protection input pin., if the voltage of OVP exceed 1V, Gate
will always shutdown
ORDERING INFORMATION
Order Part No.
Package
QTY/Reel
IS31LT3948-GRLS2-TR
SOP-8, Lead-free
2500
Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 8/31/2011
2
IS31LT3948
ABSOLUTE MAXIMUM RATINGS
Parameter
Value
VCC to GND
-0.3V to 6V
CS, ADJ,GATE,TOFF,OVP,FB
-0.3V to 6V
VCC Max. Input Current(note)
10mA
Junction Temperature Range
-40oC to +150oC
Storage Temperature Range
-65oC to +150oC
ESD Human Model
3500V
Notes:
1. Exceeding VCC maximum input current may cause the pin not to clamp at 5V.
2. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other condition beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, Vin=10V, Rin=10KΩ, ADJ floating, Tamb=25 oC)
Symbol
VINDC
VCC
UVLO
Δ UVLO
Parameter
Conditions
Min
Input voltage
Supply voltage
connected to VCC via a
appropriate resistor
(Note)
VCC clamp voltage
Rin=10KOhm
4.3
Undervoltage threshold
VCC rising
2.0
spec
Typ
5
Undervoltage threshold hysteresis
Max
Unit
100
V
5
5.6
V
2.7
3.0
V
300
mV
Quiescent supply current
VCC=5V
250
400
uA
Quiescent supply current when
VCC undervoltage
VCC=2.5V
50
75
uA
VCSTH
Peak current sense threshold
ADJ=5V
240
265
mV
TBLANK
Peak current sense blank interval
VCS=VCSTH+50mV
500
ns
Fixed turn-off interval
Rext=250KΩ
10
us
Peak current control low threshold
0.5
V
Peak current control high threshold
2.4
V
Thermal shutdown threshold
125
o
20
o
ISS
TOFF
215
VADJ
TSD
TSD-HYS
Thermal shutdown hysteresis
C
C
VfbTH
Feedback voltage threshold
0.29
0.3
0.31
V
VOVP-TH
Overvoltage input threshold
0.9
1
1.1
V
Note:
VIN is the input voltage. When VIN • 5V, connect input voltage directly to Vcc. When VIN > 5V, input voltage should be connected to Vcc pin via
an appropriately valued resistor.
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Rev. A, 8/31/2011
3
IS31LT3948
400
100
380
90
Efficiency(%)
Iout(mA)
TYPICAL PERFORMANCE CHARACTERISTICS
360
340
320
Vout=40V,Rfb=0.825Ω,Rcs=0.12Ω
L=100uH,Cout=220uF(Low ESR)
300
80
70
60
Vout=40V,Rfb=0.825Ω,Rcs=0.12Ω
L=100uH,Cout=220uF(Low ESR)
50
10
12
14
16
18
20
22
24
26
10
Vin(V)
12
14
400
100
380
90
360
340
320
300
38
Vout(V)
42
46
50
30
770
90
Efficiency(%)
Iout(mA)
100
740
710
24
28
34
38
Vout(V)
42
46
50
70
Vout=48V,Rfb=0.392Ω,Rcs=0.1Ω
Vout=48V,Rfb=0.392Ω,Rcs=0.1
L=100uH,Cout=220uF(Low
L=100uH,Cout=220uF(Low
ESR)
ESR)
Ω
50
32
26
80
60
Vout=48V,Rfb=0.392Ω,Rcs=0.1Ω
Vout=48V,Rfb=0.392Ω,Rcs=0.1
L=100uH,Cout=220uF(Low
L=100uH,Cout=220uF(Low
ESR)
ESR)
Ω
20
24
Figure 5. Vout & Efficiency
800
650
22
Vin=12V,Rfb=0.825Ω,Rcs=0.12Ω
L=100uH,Cout=220uF(Low ESR)
Figure 4. Vout & Iout
680
20
70
50
34
Vin(V)
80
60
Vin=12V,Rfb=0.825Ω,Rcs=0.12Ω
L=100uH,Cout=220uF(Low ESR)
30
18
Figure 3. Vin & Efficiency
Efficiency(%)
Iout(mA)
Figure 2. Vin & Iout
16
36
Vin(V)
Figure 6. Vin & Iout
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Rev. A, 8/31/2011
40
20
24
28
32
36
40
Vin(V)
Figure 7. Vin & Efficiency
4
800
100
770
90
Efficiency(%)
Iout(mA)
IS31LT3948
740
710
680
40
42
44
46
70
60
Vint=24V,Rfb=0.392Ω,Rcs=0.1Ω
Vout=48V,Rfb=0.392Ω,Rcs=0.1
L=100uH,Cout=220uF(Low
L=100uH,Cout=220uF(Low
ESR)
ESR)
Ω
650
80
Vout=48V,Rfb=0.392Ω,Rcs=0.1
Vin=24V,Rfb=0.392Ω,Rcs=0.1Ω
L=100uH,Cout=220uF(Low
L=100uH,Cout=220uF(Low
ESR)
ESR)
Ω
50
48
50
52
Vout(V)
Figure 8. Vout & Iout
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Rev. A, 8/31/2011
54
40
42
44
46
48
50
52
54
Vout(V)
Figure 9.Vout & Efficiency
5
IS31LT3948
APPLICATION INFORMATION
Internal 5V Regulator
LED Current Control
The IS31LT3948 includes an internal shunt regulator of
5V (typ.) connected to the VCC pin. When the input
voltage is higher than 5V, connect VCC to VIN using an
appropriately valued, current limiting resistor. The
regulator maintains a 5V power supply for the internal
NMOS switch gate driver and the internal control
circuitry. In applications where the input voltage is 5V,
connect the input voltage directly to VCC. When VCC is
connected directly to VIN, VIN may not exceed 5V.
Bypass the VCC pin using a low ESR capacitor
(recommended 10µF ceramic capacitor) to provide a
high frequency path to GND.
IS31LT3948 regulates the LED current by sensing the
voltage across an external sense resistor in series with
the LEDs. The voltage is sensed via the FB pin where
the internal feedback reference voltage is 0.3V. The
LED current can be set according to the following
equation easily.
I out =
0.3
R fb
(2)
In order to have an accurate LED current, precision
resistors are required (1% is recommended).
Setting the Over Voltage Protection
The current required by IS31LT3948 is 0.25mA
(typical) plus the switching current of the external
switch. The switching frequency of the external NMOS
affects the amount of current required, as does the
NMOS’s gate charge requirement (found on the NMOS
data sheet).
(1)
I IN ≈ 0.25mA + QG × f S
Where fS is the switching frequency and QG is the
external NMOS gate charge.
Under Voltage Lockout
The open string protection is achieved through the over
voltage protection (OVP). In some cases, an LED
string failure will set the feedback voltage to always
zero. If this happens, the chip will keep boosting the
output voltage higher and higher again. If the output
voltage reaches the programmed OVP threshold, the
protection mechanism will be triggered and stops the
switching action. To make sure that the circuit
functions properly, the OVP setting resistor divider
must be set with an appropriate value. The
recommended VOVP point is about 1.25 times or 5V
IS31LT3948 features an under voltage lockout
threshold of 2.7V (typical) with a hysteresis of 300mV.
The chip is disabled when VCC is lower than 2.4V and
enabled when VCC exceeds 2.7V.
(choose the larger one) higher than the output voltage
for normal operation.
Step-up Converter
Where, VOVP-TH is 1V, and VOVP is the output voltage
OVP level.
IS31LT3948’s step-up converter uses a peak current
mode topology wherein the CS pin voltage determines
the peak current in the inductor of the converter and
hence the duty cycle of the GATE switching waveform.
The basic loop uses a pulse from an internal oscillator
to set an RS flip-flop and turn on the external power
NMOS. After the blanking time, the inductor current is
sensed during the GATE on period by a sense resistor,
RCS, in the source of the external power NMOS. The
current through the NMOS and inductor increases until
the voltage across the sense resistor reaches the CS
threshold, at this time, the NMOS is turned off. Once
the NMOS is turned off, the inductor reverses polarity,
providing the voltage boost, and the current of inductor
will decrease until the FB pin voltage drops below an
internal reference voltage and the NMOS is then
turned on again. This operation repeats in each cycle.
Note: In the case where the FB pin voltage does not
exceed the FB reference voltage of 0.3V, such as at
the start-up, the NMOS will remain off for the
programmed minimum TOFF time, then the NMOS is
switched on again.
Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 8/31/2011
VOVP = VOVP−TH ×
R4 + R5
R5
(3)
Dimming Control
There are two methods for dimming.
1) External NMOS PWM dimming:
LED(-)
M2
FB
IS31LT3948
SN3948
Rfb
GND
ADJ
PWM
Figure 10
When the PWM input is high (VH>2.4V), M2 is on and
IS31LT3948 operates normally to regulate the output
current. When PWM is low (VL<0.5V), M2 is off and
IS31LT3948 is shutdown. Using a fixed frequency
PWM signal and changing the duty cycle adjusts the
average output current. The recommended 5V PWM
frequency is between 200Hz and 1KHz. M2 is
recommended to use AP2306.
6
IS31LT3948
2) RC filter PWM dimming:
Input Capacitor
LED(-)
SN3948
IS31LT3948
R6
Rfb
FB
The input capacitor of the IS31LT3948 will supply the
transient input current of the power inductor. Value of
100μF or higher is recommended to prevent excessive
input voltage ripple.
GND
Setting TOFF(min)
IS31LT3948 operates in a pulsed frequency
modulation mode. The boost control loop is a constant
off-time architecture. The off time is programmable and
set by an external resistor connected between the TOFF
pin and GND. In most application, the recommended
TOFF (min) is 1µs. The governing equation for the off
C4
R8
PWM
For dimming
Figure 11
A filtered PWM signal can be used as an adjustable
DC voltage for LED dimming control. The filtered PWM
signal becomes DC voltage which is summed together
with the FB voltage to regulate the output current. Fix
the frequency of the PWM signal and change the duty
cycle to adjust the LED current. The LED current can
be calculated by the following equation:
V fbTH − R6 × (VPWM × Duty − V fbTH ) /( R7 + R8)
(4)
Iout =
Rfb
The PWM duty cycle is inversely proportional to the
LED current. That is, when the PWM signal is 100%
duty cycle, the output current is minimum, ideally zero,
and when the PWM signal is 0% duty cycle, the output
current is maximum.
See details value in the Example section.
Note: When the VOUT/VIN ratio is less than 2, careful
consideration must be given to ensure that VOUT
remains greater than VIN at the minimum dimming level.
Input Peak Current control
IS31LT3948 limits the peak inductor current, and thus
the peak input current through the feedback of R3
connected from source of NMOS to ground. The
required average input current is based on the boost
ratio, Vout/Vin, and the designed value for average
LED current. The required average input current can
be calculated as:
I avg ( IN ) =
Vout × I out
Vin ×η
TOFF (min) = 40 × 10 −12 × REXT
(7)
10
8
6
4
2
0
0
25
50
75
100
125
R
150
175
200
225
250
(KΩ)
Note: The minimum TOFF (min) is 1µs.
Inductor Selection
Inductor value directly determines the switching
frequency of the converter. To the fixed condition and
the larger the inductor’s value, the lower the switching
frequency is. The higher frequency will reduce the
value of inductor, but will increase the switching loss
on NMOS.
The switching frequency can be calculated blow.
(8)
Switching frequency: f = 1 / (TON + TOFF )
The current ripple in the inductor:
I Ripple = 2 × (I peak ( IN ) − I avg ( IN ) )
(5)
η: assumed power conversion efficiency (the
recommended value is 0.9)
Generally, setting the peak inductor current to 1.5
times the average input current is sufficient to maintain
a good regulation of the output current.
I peak ( IN ) = 1.5 × I avg ( IN ) =
time is:
TOFF(min) (us)
R7
VCSTH
RCS
(6)
VCSTH: If 0.5<VADJ<2.4V, VCSTH = VADJ/10. If VADJ>2.4V,
VCSTH =0.24V. ADJ floating, VCSTH=0.24V.
(9)
NMOS on time:
TON =
I Ripple × L
Vin − I avg ( IN ) × ( RL + RDS (ON ) + RCS )
(10)
NMOS off time:
TOFF =
I Ripple × L
Vout + VD − Vin − I avg ( IN ) × RL
(11)
Note: the selection of inductor must ensure the TOFF
larger than the TOFF (min) , otherwise, the converter
cannot output the required current.
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Rev. A, 8/31/2011
7
IS31LT3948
Where:
Vin: Input voltage (V)
Vout: Output voltage (V)
IRipple: Current ripple in the inductor (A)
L: inductor value (H)
Ipeak(IN): Input peak current (A)
Iavg(IN): Input average current (A)
RL: Inductor DCR (Ω)
RDS(ON): NMOS on resistance (Ω)
VD: diode forward voltage at the required load current
(V)
The recommended switching frequency: 20KHz < f <
200KHz (Lower than 20KHz will cause audio noise of
the inductor and too high frequency will increase the
switching loss on NMOS).
With fixed Vin, Vout, Iavg(IN), and Ipeak(IN), the switching
frequency is inversely proportional to the inductor
value.
Select an inductor with a rating current higher than the
input average current and the saturation current over
the calculated peak current. To calculate the worst
case inductor peak current, use the minimum input
voltage, maximum output voltage, and maximum total
LED current. Also ensure that the inductor has a low
DCR (copper wire resistance) to minimize I2R power
loss.
Output Capacitor
The output capacitor holds the output current during
NMOS turns ON. The capacitor directly impacts the
line regulation and the loading regulation.
Low ESR capacitors using at the IS31LT3948
converter output can minimize output ripple voltage
and improve output current regulation. For most
applications, a 220μF low ESR capacitor will be
sufficient. Proportionally lower ripple can be achieved
with higher capacitor values.
Schottky Rectifier
The external diode for the IS31LT3948 must be a
Schottky diode with low forward voltage drop and fast
switching speed. The diode’s average current rating
must exceed the application’s average output current.
The diode’s maximum reverse voltage rating must
exceed the over voltage protection of the application.
For PWM dimming applications, be aware of the
reverse leakage of the Schottky diode. Lower leakage
current will drain the output capacitor less during PWM
low periods, allowing for higher PWM dimming ratios.
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Rev. A, 8/31/2011
Power NMOS Selection
The power NMOS selected should have a VDS rating
which exceeds the maximum over voltage protection
(OVP) level programmed for the application. The VGS(th)
of NMOS should be not higher than 4V. The RDS (ON) of
the NMOS will determine DC power loss. The DC
power loss can be calculated by:
Ploss = I M 1 × RDS (ON )
2
2
 V × I × Duty 
 × RDS (ON )
=  out out
Vin ×η


(12)
The recommended NMOS rating current is 5 times (or
higher) to the input peak current ( I peak ( IN ) ). Be aware
of the power dissipation within the NMOS and deciding
if the thermal resistance of the NMOS package causes
the junction temperature to exceed maximum ratings.
PCB layout consideration
As for all switching power supplies, especially those
providing high current and using high switching
frequencies, layout is an important design step. If
layout is not carefully done, the regulator could show
instability as well as EMI problems.
• Wide traces should be used for connection of the
high current loop to minimize the EMI and
unnecessary loss.
• The external components ground should be
connected to IS31LT3948 ground as short as
possible. Especially the Rfb ground to IS31LT3948
ground connection should be as short and wide as
possible to have an accurate LED current.
• The capacitor C1, C2, C3 should be placed as close
as possible to IS31LT3948 for good filtering.
Especially the output capacitor C3 connection should
be as short and wide as possible.
• NMOS drain is a fast switching node. The inductor
and Schottky diode should be placed as close as
possible to the drain and the connection should be
kept as short and wide as possible. Avoid other
traces crossing and routing too long in parallel with
this node to minimize the noise coupling into these
traces. The feedback pin (e.g. CS, FB, OVP) should
be as short as possible and routed away from the
inductor, the Schottky diode and NMOS. The
feedback pin and feedback network should be
shielded with a ground plane or trace to minimize
noise coupling into this circuit.
• The thermal pad on the back of NMOS package
must be soldered to the large ground plane for ideal
power dissipation.
8
IS31LT3948
L1
VIN(5~100V)
D1
LED(+)
R1
R4
C1
VCC
M1
GATE
TOFF
R2
C2
ADJ
OVP
GND
FB
LED(-)
C3
CS
R3
R5
M2
Rfb
PWM
Figure.12 External NMOS PWM dimming
L1
VIN(5~100V)
D1
LED(+)
R1
C3
C1
VCC
TOFF
LED(-)
CS
R2
C2
R4
M1
GATE
ADJ
OVP
GND
FB
R3
R5
R6
R7
Rfb
C4
R8
PWM
For dimming
Figure.13 RC filter PWM dimming
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Rev. A, 8/31/2011
9
IS31LT3948
Example
Input: Vin = 12~24V
Output: Iout = 350mA, Vout≈ 30~40V (9~12LEDs,
Vf=3.3V)
To calculate the worst case parameter, use the
minimum input voltage, the maximum output voltage,
and maximum output current. i.e. Vin = 12V, Iout =
350mA and Vout≈ 40V (12LEDs, Vf=3.3V)
Iout =
V fbTH − R6 × (VPWM × Duty − V fbTH ) /( R7 + R8)
Rfb
0.3 − 26.2 × (5 × 0% − 0.3) /(400 + 10)
=
= 0.35 A
Rfb
So, Rfb=0.91Ω (With the RC filter PWM dimming, the
Rfb will be different from the no dimming application.)
1. R1, C1 and C2
Assume Iin = 2.5mA
4. R3 to set input peak current
Assume: I peak ( IN ) = 1.5 × I avg ( IN )
R1 =
I peak ( IN ) = 1.5 × I avg ( IN ) = 1.5 ×
Vin − Vcc
≈ 3kΩ
Iin
Vout × I out
Vin × η
 Choose C1 as 220µF/35V
C2 as 10µF/16V
= 1.5 ×
2. R2 to set minimal-TOFF
The recommended value is 1µs
η: assumed power conversion efficiency (the
recommended value is 0.9)
TOFF (min) = 40 × 10 −12 × REXT = 1µs
Rcs =
 Choose R2 = 24kΩ
40 × 0.35
≈ 1.95 A
12 × 0.9
VCSTH
= 0.123Ω
I peak ( IN )
 Choose R3=0.123Ω , Ipeak=1.95A
3. Rfb to set output current and C3
Rfb =
V fbTH
Iout
5. L1 to set frequency
≈ 0.86Ω
 Choose C3 = 220µF/63V (Low ESR electrolytic
capacitor)
4. R6, R7, R8 and C4
R6、R7、R8 can be obtained by:
Iout =
V fbTH − R6 × (VPWM × Duty − V fbTH ) /( R7 + R8)
Rfb
Put Duty=100%, VPWM = 5V and Iout=0 into the
equation, we have:
0=
0.3 − R6 × (5 ×100% − 0.3) /( R 7 + R8)
0.86
which can be simplified to:
15.66 × R6 = R7 + R8
The low pass filter formed by R8 & C4 must have a
corner frequency much lower than the PWM frequency.
As the corner frequency of the filter decreases, the
response time of the LED current to changes in PWM
increases. Choose a corner frequency 50 times lower
than fPWM.
R8 × C 4 ≥
50
2πf PWM
Assume fPWM is 200Hz (or higher), and choose C4 =
0.1µF, we have R8 ≥ 400kΩ .
 Choose C4 = 0.1µF, R8 = 400kΩ .
Choose a nominal value for R7, then, we calculate R6.
 Choose R7 = 10kΩ , then R6 = 26.2kΩ
Put Duty=0, VPWM = 5V and Iout=350mA into the
equation, then we have:
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Rev. A, 8/31/2011
Input average current: I avg ( IN ) =
Vout × I out
= 1.3 A
Vin ×η
The current ripple in the inductor:
I Ripple = 2 × (I peak ( IN ) − I avg ( IN ) ) = 1.3 A
According to Toff > TOFF (min) :
TOFF =
I Ripple × L
Vout + VD − Vin − I avg ( IN ) × RL
> 1µs
This gives L>22µH.
Assume L=22µH and RL + RDS ( ON ) + RCS = 0.4Ω .
TON =
I Ripple × L
Vin − I avg ( IN ) × ( RL + RDS (ON ) + RCS )
≈ 2.5µs
Then the assumed switching frequency:
f ' = 1 / (TON + TOFF ) ≈ 285 KHz
The recommended switching frequency:
20KHz < f < 200KHz, according to the switching
frequency is inversely proportional to the inductor value,
choose L=100 µH. Therefore:
f = f '×
22
≈ 63KHz
100
The saturation current of the inductor must exceed the
input peak current ( I peak ( IN ) ).
10
IS31LT3948
6. R4, R5 to set OVP
Set VOVP = Vout+5V = 45V
VOVP = VOVP−TH ×
R4 + R5
R5
Choose R5=10kΩ , then R4 = 470kΩ .
7. NMOS M1 and diode D1
I1(NMOS) >Ipeak(IN)
V1(NMOS) >VOVP
Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 8/31/2011
NMOS with RDS(on) can improve the converter efficiency.
The recommended NMOS rating current is 5 times (or
higher) to the input peak current ( I peak ( IN ) ).
 Choose 13N10L as M1
The average and peak current of diode must exceed
the output average current and input peak current. The
diode’s maximum reverse voltage rating must exceed
the over voltage protection of the application.
 Choose SS310 as D1
11
IS31LT3948
CLASSIFICATION REFLOW PROFILES
Profile Feature
Pb-Free Assembly
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
150°C
200°C
60-120 seconds
Average ramp-up rate (Tsmax to Tp)
3°C/second max.
Liquidous temperature (TL)
Time at liquidous (tL)
217°C
60-150 seconds
Peak package body temperature (Tp)*
Max 260°C
Time (tp)** within 5°C of the specified
classification temperature (Tc)
Max 30 seconds
Average ramp-down rate (Tp to Tsmax)
6°C/second max.
Time 25°C to peak temperature
8 minutes max.
Classification Profile
Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 8/31/2011
12
IS31LT3948
TAPE AND REEL INFORMATION
Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 8/31/2011
13
IS31LT3948
PACKAGE INFORMATION
Package Outline Drawing
#D08
0.25
0.17
5.10
4.70
1.27
0.40
6.20 4.00
5.80 3.80
8
0
1.27BSC
0.51
0.33
0.25
0.10
1.55
1.35
Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 8/31/2011
1.75
1.35
14