IS31LT3360-SDLS4-TR

IS31LT3360
40V/1.2A LED DRIVER WITH INTERNAL SWITCH
January 2014
GENERAL DESCRIPTION
FEATURES
The IS31LT3360 is a continuous mode inductive
step-down converter, designed for driving a single
LED or multiple series connected LEDs efficiently
from a voltage source higher than the LED voltage.
The chip operates from an input supply between 6V
and 40V and provides an externally adjustable output
current of up to 1.2A.


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The IS31LT3360 includes an integrated output
switch and a high-side output current sensing circuit,
which uses an external resistor to set the nominal
average output current.
Output current can be adjusted linearly by applying
an external control signal to the ADJ pin. The ADJ
pin will accept either a DC voltage or a PWM
waveform. This will provide either a continuous or a
gated output current.
Applying a voltage less than 0.2V to the ADJ pin
turns the output off and switches the chip into a low
current standby state.
The chip is assembled in SOT89-5 package. It
operates from 6V to 40V over two temperature
ranges of -40°C to +105°C and -40°C to +125°C.


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
Up to 1.2A output current
High efficiency (up to 98%)
Wide input voltage range: 6V ~ 40V
Internal 40V power switch
Simple low parts count
Typical 3% output current accuracy (-40°C to
+105°C, IS31LT3360-SDLS3-TR)
Typical 5% output current accuracy (-40°C to
+125°C, IS31LT3360-SDLS4-TR)
Single pin on/off and brightness control using
DC voltage or PWM
Up to 1MHz switching frequency
Inherent LED open-circuit/short-circuit
protection
Thermal shutdown protection circuitry
Up to 1200: 1 dimming ratio
APPLICATIONS
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Automotive and avionic lighting
LED MR16, MR11 spot light
LED street light
PAR light
Industrial lighting
Refrigeration lights
Other LED lighting
APPLICATION CIRCUIT
Figure 1
Typical Application Circuit
Note: The capacitor, C2, can’t be removed. And it should be placed as close as possible to the VIN and GND pins, otherwise the
operation might be abnormal.
Integrated Silicon Solution, Inc. – www.issi.com
Rev. C, 12/22/2013
1
IS31LT3360
PIN CONFIGURATION
Package
SOT89-5
Pin Configuration
LX
1
GND
2
ADJ
3
5
VIN
Thermal Pad
4
ISENSE
PIN DESCRIPTION
No.
Pin
Description
1
LX
Drain of power switch.
2
GND
Ground (0V).
3
ADJ
Multi-function On/Off and brightness control pin:
* Leave floating for normal operation.(VADJ = VREF = 1.2V giving
nominal average output current IOUT(NOM) =0.1/RS )
* Drive to voltage below 0.2V to turn off output current
* Drive with DC voltage (0.3V<VADJ <1.2V) to adjust output
current from 25% to 100% of IOUT_NOM
* Drive with PWM signal to adjust output current.
* When driving the ADJ pin above 1.2V, the current will be
clamped to 100% brightness automatically.
4
ISENSE
Connect resistor RS from this pin to VIN to define nominal
average output current IOUT_NOM =0.1/RS
5
VIN
Input voltage (6V ~ 40V). Decouple to ground with 0.1μF X7R
ceramic capacitor as close to device as possible.
Thermal Pad
Connect to GND.
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Rev. C, 12/22/2013
2
IS31LT3360
ORDERING INFORMATION
Industrial Range: -40°C to +105°C
Order Part No.
Package
QTY/Reel
IS31LT3360-SDLS3-TR
SOT89-5, Lead-free
2500
Industrial Range: -40°C to +125°C
Order Part No.
Package
QTY/Reel
IS31LT3360-SDLS4-TR
SOT89-5, Lead-free
2500
Copyright © 2014 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. – www.issi.com
Rev. C, 12/22/2013
3
IS31LT3360
ABSOLUTE MAXIMUM RATINGS (NOTE 1)
Input voltage, VIN
ISENSE voltage, VSENSE
LX output voltage, VLX
Adjust pin input voltage, VADJ
Switch output current, ILX
Power dissipation, PD(MAX) (Note 2)
Operating temperature, TA = TJ
Storage temperature, TST
Junction temperature, TJMAX
Junction to ambient, θJA
ESD (HBM)
ESD (CDM)
-0.3V ~ +50V
VIN-5V ~ VIN+0.3V, VIN≥5V
-0.3V ~ VIN+0.3V, VIN<5V
-0.3V ~ +50V
-0.3V ~ +6.0V
1.5A
0.94W
-40°C ~ +105°C, IS31LT3360-SDLS3-TR
-40°C ~ +125°C, IS31LT3360-SDLS4-TR
-55°C ~ +150°C
150°C
132.6°C/W
4kV
750V
Note 1:
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other condition beyond those indicated in the operational sections of the specifications is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Note 2:
Detail information please refer to package thermal de-rating curve on Page 12.
ELECTRICAL CHARACTERISTICS
Valid are at VIN =12V, typical value at 25°C, unless otherwise noted.
○
Parameter range based on TA = -40°C ~ +125°C (Note 3)
The symbol in the table means these parameters are only available in the above temperature range.
Symbol
VIN
Parameter
Conditions
Input voltage
Min.
Quiescent supply current with output
off
ADJ pin grounded
IINQ_ON
Quiescent supply current with output
switching
ADJ pin floating
VSENSE
Mean current sense threshold
voltage
○
ISENSE
ISENSE pin input current
VSENSE =VIN-0.1V
VREF
Internal reference voltage
Measured on ADJ
pin with pin floating
VADJ
External control voltage range on
ADJ pin for dc brightness control
VADJ_OFF
DC voltage on ADJ pin to switch
chip from active (on) state to
quiescent (off) state
VADJ falling
VADJ_ON
DC voltage on ADJ pin to switch
chip from quiescent (off) state to
active (on) state
VADJ rising
○
40
V
160
60
120
200
450
600
450
680
97
100
103
95
100
105
μA
μA
mV
±15
%
8
μA
1.2
V
0.3
○
Unit
120
○
○
Max.
80
Sense threshold hysteresis
Integrated Silicon Solution, Inc. – www.issi.com
Rev. C, 12/22/2013
Typ.
6
IINQ_OFF
VSENSEHYS
Temp.
1.2
0.15
0.2
0.25
0.11
0.2
0.29
0.2
0.25
0.3
0.16
0.25
0.34
V
V
V
4
IS31LT3360
ELECTRICAL CHARACTERISTICS (CONTINUED)
Valid are at VIN =12V, typical value at 25°C, unless otherwise noted.
○
Parameter range based on TA = -40°C ~ +125°C (Note 3)
The symbol in the table means these parameters are only available in the above temperature range.
Symbol
RADJ
Parameter
Conditions
Temp.
Resistance between ADJ pin
and VREF
ILX_LEAK
LX switch leakage current
ILX_MEAN
Continuous LX switch current
Min.
Typ.
Max.
Unit
500
kΩ
1
2.5
○
(Note 4)
1.2
μA
A
0.27
0.4
0.27
0.7
RLX
LX switch ‘ON’ resistance
tON_MIN
Minimum switch ‘ON’ time
LX switch ‘ON’
200
ns
tOFF_MIN
Minimum switch ‘OFF’ time
LX switch ‘OFF’
200
ns
tPD
Internal comparator propagation
delay
(Note 4)
50
ns
TSD
Thermal shutdown temperature
(Note 4)
150
°C
Thermal shutdown hysteresis
(Note 4)
20
°C
TSD_HYS
○
Ω
Note 3: Production testing of the device is performed at 25°C. Functional operation of the device and parameters specified over -40°C to
+125°C temperature range, are guaranteed by design, characterization and process control.
Note 4: Guaranteed by design.
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Rev. C, 12/22/2013
5
IS31LT3360
TYPICAL PERFORMANCE CHARACTERISTICS
4
3
L = 47μH
RS = 0.083Ω
2
L = 47μH
RS = 0.17Ω
3
2
Error(%)
Error (%)
1LED
1
2LED
3LED
0
4LED
5LED
6LED
-1
1 1LED
2LED
0
3LED
-1
8LED
-2
5LED
6LED
4LED
7LED
-2
9LED
7LED
10LED
8LED
-3
-3
5
10
15
20
25
30
35
-4
40
9LED
5
10
15
Power Supply(V)
Figure 2
L = 47μH
RS = 0.083Ω
95
Figure 3
9LED
6LED 7LED 8LED
4LED 5LED
Efficiency (%)
Efficiency (%)
80
75
15
90
85 1LED
80
20
25
30
35
70
40
L = 47μH
RS = 0.17Ω
5
10
15
20
25
30
35
40
35
40
Power Supply(V)
Power Supply(V)
Figure 4
10LED
3LED
75
10
40
2LED
1LED
70
5
35
6LED 7LED 8LED 9LED
5LED
4LED
95
2LED
85
30
Output Current Error vs. Power Supply
100
10LED
3LED
90
25
Power Supply(V)
Output Current Error vs. Power Supply
100
20
10LED
Efficiency vs. Power Supply
Figure 5
Efficiency vs. Power Supply
400
600
Operating Mode
Shutdown Mode
Supply Current (µA)
Supply Current (µA)
500
400
300
200
300
200
100
100
0
6
10
15
20
25
30
35
40
0
6
Supply Current vs. Power Supply (Operating Mode)
Integrated Silicon Solution, Inc. – www.issi.com
Rev. C, 12/22/2013
15
20
25
30
Power Supply(V)
Power Supply(V)
Figure 6
10
Figure 7
Supply Current vs. Power Supply (Shutdown Mode)
6
IS31LT3360
1145
1150
Normal Supply Voltage
Low Supply Voltage
1146
VREF Voltage (mV)
VREF Voltage (mV)
1143
1141
1139
1138
1134
1137
1135
1142
6
7
8
9
1130
6
10
10
15
VREF vs. Power Supply (Low Supply Voltage)
Figure 9
105
30
35
40
VREF vs. Power Supply (Normal Supply Voltage)
1200
VIN = 12V
VIN = 12V
1190
103
102
101
VADJ (mV)
VSENSE Voltage (mV)
104
25
Power Supply(V)
Power Supply(V)
Figure 8
20
100
99
1180
1170
98
97
1160
96
95
-40
-25
-10
5
20
35
50
65
80
95
110 125
1150
-40 -25
-10
5
Temperature (°C)
Figure 10
35
50
65
80
95
110 125
Temperature (°C)
VSENSE vs. Temperature
Figure 11
400
350
20
VADJ vs. Temperature
VIN = 12V
L = 47µH
RS = 0.2Ω
VIN = 12V
RDS_ON (mΩ)
300
250
200
150
100
IL
100mA/Div
50
0
-40 -25
-10
5
20
35
50
65
80
95
Temperature (°C)
Figure 12
RDS_ON vs. Temperature
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Rev. C, 12/22/2013
110 125
VADJ
1.0V/Div
Time (4µs/Div)
Figure 13
ADJ Pin Voltage vs. IL
7
IS31LT3360
VIN = 12V
L = 47µH
RS = 0.2Ω
LED Open
IL
100mA/Div
IL
100mA/Div
VIN = 12V
L = 47µH
RS = 0.2Ω
LED Short
VLED
2V/Div
VLX
5V/Div
Time (400ms/Div)
Time (1s/Div)
Figure 14
LED Open-Circuit Protection
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Rev. C, 12/22/2013
Figure 15
LED Short-Circuit Protection
8
IS31LT3360
FUNCTIONAL BLOCK DIAGRAM
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Rev. C, 12/22/2013
9
IS31LT3360
APPLICATION INFORMATION
SETTING NOMINAL AVERAGE OUTPUT
CURRENT WITH EXTERNAL RESISTOR R S
the current will be clamped to 100% brightness
automatically.
The nominal average output current in the LED(s) is
determined by the value of the external current sense
resistor (RS) connected between VIN and ISENSE
pins and in is given by Equation (1):
The input impedance of the ADJ pin is 500kΩ (Typ.).
I OUT _ NOM
OUTPUT CURRENT ADJUSTMENT BY PWM
CONTROL
Directly Driving ADJ Input
0.1

RS
(1)
Note that RS=0.083Ω is the minimum allowed value
of sense resistor under these conditions to maintain
switch current below the specified maximum value. It
is possible to use different values of RS if the ADJ pin
is driven from an external voltage.
The table below gives values of nominal average
output current for several preferred values of current
setting resistor (RS) in the typical application circuit
Figure 1:
A Pulse Width Modulated (PWM) signal with duty
cycle DPWM can be applied to the ADJ pin, as shown
in Figure 17, to adjust the output current to a value
below the nominal average value set by resistor RS,
the signal range is from 0V~5V.The logic “HIGH” is
higher than 1.2V, the logic “LOW” is lower than
0.2V.The PWM signal must have the driving ability to
drive internal 500kΩ pull-up resistor.
RS (Ω)
Nominal Average Output
Current (mA)
0.083
1200
Driving The ADJ Input From A Microcontroller
0.15
667
0.3
333
Another possibility is to drive the chip from the open
drain output of a microcontroller. The Figure 18
below shows one method of doing this:
The above values assume that the ADJ pin is floating
and at a nominal voltage of VREF =1.2V.
Figure 17
PWM Dimming Control Via ADJ Pin
Rs need to be chosen 1% accuracy resistor with
enough power tolerance and good temperature
characteristic to ensure stable output current.
OUTPUT CURRENT ADJUSTMENT BY
EXTERNAL DC CONTROL VOLTAGE
The ADJ pin can be driven by an external DC voltage
(VADJ), as shown in Figure 16, to adjust the output
current to a value above or below the nominal
average value defined by RS.
Figure 18
Dimming By MCU
The diode and resistor suppress possible high
amplitude negative spikes on the ADJ input resulting
from the drain-source capacitance of the FET.
Negative spikes at the input to the chip should be
avoided as they may cause errors in output current or
erratic device operation.
SHUTDOWN MODE
Taking the ADJ pin to a voltage below 0.2V will turn
off the output and supply current will fall to a low
standby level of 120μA nominal.
Figure 16
Dimming by External DC Voltage
The nominal average output current in this case is
given by Equation (2):
I OUT _ DC 
0.083  V ADJ
RS
(2)
For 0.3V< VADJ <1.2V.
Note that 100% brightness setting corresponds to
VADJ = VREF. When driving the ADJ pin above 1.2V,
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Rev. C, 12/22/2013
INHERENT OPEN-CIRCUIT LED PROTECTION
If the connection to the LED(s) is open-circuited, the
coil is isolated from the LX pin of the chip, so the chip
will not be damaged, unlike in many boost converters,
where the back EMF may damage the internal switch
by forcing the drain above its breakdown voltage.
CAPACITOR SELECTION
A low ESR capacitor should be used for input
decoupling, as the ESR of this capacitor appears in
10
IS31LT3360
series with the supply source impedance and lowers
overall efficiency. This capacitor has to supply the
relatively high peak current to the coil and smooth the
current ripple on the input supply.
If the source is DC supply, the capacitor is decided
by ripple of the source, the value is given by Equation
(3):
C MIN 
I F  tON
U MAX
(3)
IF is the value of output current， U MAX is the ripple
of power supply. tON is the “ON” time of MOSFET.
The value is higher than the minimum value. A
100µF capacitor is recommended.
If the source is an AC supply, typical output voltages
ripple from a nominal 12V AC transformer can be
±10%.If the input capacitor value is lower than 220μF,
the AC input waveform is distorted, sometimes the
lowest value will be lower than the forward voltage of
LED strings. This lower the average current of the
LEDs. So it is recommended to set the value of the
capacitor bigger than 220µF.
t OFF 
Where:
L is the coil inductance (H)
RL is the coil resistance (Ω)
IAVG is the required LED current (A)
∆I is the coil peak-peak ripple current (A) {Internally
set to 0.3 × IAVG}
VIN is the supply voltage (V)
VLED is the total LED forward voltage (V)
RLX is the switch resistance (Ω)
VD is the diode forward voltage at the required load
current (V)
Example:
For VIN=12V, L=47μH, RL=0.26Ω, VLED=3.4V, IAVG
=333mA, VD =0.36V, RS = 0.3Ω, RLX=0.27Ω:
47  0.3  0.333
 0.564 s
12  3.4  0.333  (0.3  0.26  0.27)
47  0.3  0.333

 1.19 s
3.4  0.36  0.333  (0.26  0.3)
t ON 
Recommended inductor values for the IS31LT3360
are in the range 47μH to 220μH.
t OFF
The chosen coil should have a saturation current
higher than the peak output current and a continuous
current rating above the required mean output
current. It is recommended to use inductor with
saturation current bigger than 1.2A for 700mA output
current and inductor with saturation current bigger
than 500mA for 350mA output current.
The inductor value should be chosen to maintain
operating duty cycle and switch 'on/off' times within
the specified limits over the supply voltage and load
current range.
The following equations can be used as a guide.
LX Switch 'ON' time:
t ON 
VIN  VLED
L  I
(4)
 I AVG ( RS  RL  RLX )
Note: tON_MIN > 200ns.
LX Switch 'OFF' time:
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Rev. C, 12/22/2013
(5)
Note: tOFF_MIN > 200ns.
INDUCTOR SELECTION
Higher values of inductance are recommended at
higher supply voltages and low output current in
order to minimize errors due to switching delays,
which result in increased ripple and lower efficiency.
Higher values of inductance also result in a smaller
change in output current over the supply voltage
range. The inductor should be mounted as close to
the chip as possible with low resistance connections
to the LX and VIN pins.
VLED
L  I
 VD  I AVG ( RL  RS )
This gives an operating frequency of 570kHz and a
duty cycle of 32%.
Optimum performance will be achieved by setting the
duty cycle close to 50% at the nominal supply voltage.
This helps to equalize the undershoot and overshoot
and improves temperature stability of the output
current.
DIODE SELECTION
For maximum efficiency and performance, the
rectifier (D1) should be a fast low capacitance
Schottky diode with low reverse leakage at the
maximum operating voltage and temperature.
If alternative diodes are used, it is important to select
parts with a peak current rating above the peak coil
current and a continuous current rating higher than
the maximum output load current. It is very important
to consider the reverse leakage of the diode when
operating at high temperature. Excess leakage will
increase the power dissipation in the device.
The higher forward voltage and overshoot due to
reverse recovery time in silicon diodes will increase
the peak voltage on the LX output. If a silicon diode is
used, care should be taken to ensure that the total
voltage appearing on the LX pin including supply
ripple, does not exceed the specified maximum
value.
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IS31LT3360
A value of 1μF will reduce nominal ripple current by a
factor three (approx.). Proportionally lower ripple can
be achieved with higher capacitor values. Note that
the capacitor will not affect operating frequency or
efficiency, but it will increase start-up delay, by
reducing the rate of rise of LED voltage.
OPERATION AT LOW SUPPLY VOLTAGE
The internal regulator disables the drive to the switch
until the supply has risen above the startup threshold
set internally which makes power MOSFET
on-resistance small enough. Above this threshold,
the chip will start to operate. However, with the
supply voltage below the specified minimum value,
the switch duty cycle will be high and the chip power
dissipation will be at a maximum. Care should be
taken to avoid operating the chip under such
conditions in the application, in order to minimize the
risk of exceeding the maximum allowed die
temperature. (See next section on thermal
considerations).
Note that when driving loads of two or more LEDs,
the forward drop will normally be sufficient to prevent
the chip from switching below approximately 6V. This
will minimize the risk of damage to the chip.
To ensure the performance, the die temperature (TJ)
of IS31LT3360 should not exceed 125°C. The graph
below gives details for power derating.
1
SOT89-5
Power Dissipation (W)
REDUCING OUTPUT RIPPLE
0.8
0.6
0.4
0.2
0
-40
-25
-10
5
20
35
50
65
80
95
110
125
Temperature (°C)
Figure 19
PD vs. TA
It will also increase if the efficiency of the circuit is low.
This may result from the use of unsuitable coils, or
excessive parasitic output capacitance on the switch
output.
LAYOUT CONSIDERATIONS
THERMAL CONSIDERATIONS
VIN Pin
When operating the chip at high ambient
temperatures, or when driving maximum load current,
care must be taken to avoid exceeding the package
power dissipation limits. The maximum power
dissipation can be calculated using the following
Equation (6):
The GND of power supply usually have some
distance to the chip GND pin, which cause parasitic
resistance and inductance. It causes ground voltage
bounce while the MOSFET is switching. Connect a
0.1µF capacitor C2 as close to device as possible to
minimize the ground bounce.
PD ( MAX ) 
TJ ( MAX )  TA
 JA
LX Pin
(6)
Where TJ(MAX) is the maximum junction temperature,
TA is the ambient temperature, and θJA is the junction
to ambient thermal resistance.
The recommended maximum operating junction
temperature, TJ(MAX), is 150°C and so maximum
ambient temperature is determined by the junction to
ambient thermal resistance, θJA.
Therefore the maximum power dissipation at TA =
25°C is:
PD ( MAX ) 
150C  25C
 0.94W
132.6C / W
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Rev. C, 12/22/2013
The LX pin of the chip is a fast switching node, so
PCB traces should be kept as short as possible. To
minimize ground 'bounce', the ground pin of the chip
should be soldered directly to the ground plane.
Coil And Decoupling Capacitor C 1
It is particularly important to mount the coil and the
input decoupling capacitor close to the chip to
minimize parasitic resistance and inductance, which
will degrade efficiency. It is also important to take
account of any trace resistance in series with current
sense resistor RS.
ADJ Pin
The ADJ pin is a high impedance input, so when left
floating, PCB traces to this pin should be as short as
possible to reduce noise pickup. ADJ pin can also be
connected to a voltage between 1.2V~5V. In this
case, the internal circuit will clamp the output current
at the value which is set by VADJ = 1.2V.
12
IS31LT3360
High Voltage Traces
Avoid running any high voltage traces close to the
ADJ pin, to reduce the risk of leakage due to board
contamination. Any such leakage may affect the ADJ
pin voltage and cause unexpectable output current.
The IS31LT3360 has external protection circuitry to
prevent excessive output current if ADJ voltage rises
above 1.2V. A ground ring placed around the ADJ
pin will minimize changes in output current under
these conditions.
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13
IS31LT3360
CLASSIFICATION REFLOW PROFILES
Profile Feature
Pb-Free Assembly
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
150°C
200°C
60-120 seconds
Average ramp-up rate (Tsmax to Tp)
3°C/second max.
Liquidous temperature (TL)
Time at liquidous (tL)
217°C
60-150 seconds
Peak package body temperature (Tp)*
Max 260°C
Time (tp)** within 5°C of the specified
classification temperature (Tc)
Max 30 seconds
Average ramp-down rate (Tp to Tsmax)
6°C/second max.
Time 25°C to peak temperature
Figure 20
8 minutes max.
Classification Profile
Integrated Silicon Solution, Inc. – www.issi.com
Rev. C, 12/22/2013
14
IS31LT3360
PACKAGE INFORMATION
SOT89-5
Note: All dimensions in millimeters unless otherwise stated.
Integrated Silicon Solution, Inc. – www.issi.com
Rev. C, 12/22/2013
15