BF P750 BF P750 a s a Dri ve r A mpl i fi er for 5.8 G Hz Cor dl es s P hon e A ppl i c a t i ons Appl i c ati o n N ote A N 246 Revision: Rev 1.1 2010-09-24 RF and P r otec ti on D evi c es Edition 2010-09-24 Published by Infineon Technologies AG 81726 Munich, Germany © 2010 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). 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BFP750 BFP750 5.8 GHz Driver Amplifier Application Note AN246 Revision History: 2010-09-24 Previous Revision: Rev1.0 Page Subjects (major changes since last revision) 6 Table 2 updated Trademarks of Infineon Technologies AG A-GOLD™, BlueMoon™, COMNEON™, CONVERGATE™, COSIC™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™, CONVERPATH™, CORECONTROL™, DAVE™, DUALFALC™, DUSLIC™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, E-GOLD™, EiceDRIVER™, EUPEC™, ELIC™, EPIC™, FALC™, FCOS™, FLEXISLIC™, GEMINAX™, GOLDMOS™, HITFET™, HybridPACK™, INCA™, ISAC™, ISOFACE™, IsoPACK™, IWORX™, M-GOLD™, MIPAQ™, ModSTACK™, MUSLIC™, my-d™, NovalithIC™, OCTALFALC™, OCTAT™, OmniTune™, OmniVia™, OptiMOS™, OPTIVERSE™, ORIGA™, PROFET™, PRO-SIL™, PrimePACK™, QUADFALC™, RASIC™, ReverSave™, SatRIC™, SCEPTRE™, SCOUT™, S-GOLD™, SensoNor™, SEROCCO™, SICOFI™, SIEGET™, SINDRION™, SLIC™, SMARTi™, SmartLEWIS™, SMINT™, SOCRATES™, TEMPFET™, thinQ!™, TrueNTRY™, TriCore™, TRENCHSTOP™, VINAX™, VINETIC™, VIONTIC™, WildPass™, X-GOLD™, XMM™, X-PMU™, XPOSYS™, XWAY™. Other Trademarks AMBA™, ARM™, MULTI-ICE™, PRIMECELL™, REALVIEW™, THUMB™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO. OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2009-10-19 Application Note AN246, Rev1.1 3 / 15 2010-09-24 BFP750 BFP750 5.8 GHz Driver Amplifier List of Content, Figures and Tables Table of Content 1 1.1 1.2 1.3 Introduction ........................................................................................................................................5 Features ...............................................................................................................................................5 Applications ..........................................................................................................................................5 BFP750 in cordless phone applications ...............................................................................................6 2 2.1 Application Information .....................................................................................................................8 Schematic Diagram ..............................................................................................................................8 3 Typical Measurement Results...........................................................................................................9 4 Measured Graphs .............................................................................................................................10 Authors..............................................................................................................................................14 List of Figures Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Figure 10 Figure 11 Figure 12 BFP750 in SOT343 Package ...............................................................................................................5 Schematic of the cordless phone 5.8GHz application .........................................................................7 Measuremement Setup for the OP1dB of BFP750 for 5.8GHz cordless phone application ...............7 Schematic diagram of the BFP750 driver application circuit for 5.8 GHz ............................................8 Insertion power gain of the BFP750 driver for 5.8GHz cordless phone application ..........................10 Input matching of the BFP750 driver for 5.8GHz cordless phone application ...................................10 Output matching of the BFP750 driver for 5.8GHz cordless phone application ................................11 Reverse isolation of the BFP750 driver for 5.8GHz cordless phone application ...............................11 Stability K-factor of the BFP750 driver for 5.8GHz cordless phone application ................................12 Input 1dB Compression point of the BFP750 driver for 5.8GHz cordless phone application ............12 rd 3 order intercept point of the BFP750 driver for 5.8GHz cordless phone application .....................13 Input and output Z-Parameters of the BFP750 driver for 5.8GHz cordless phone application..........13 List of Tables Table 1 Table 2 Table 3 Table 4 Pin definition.........................................................................................................................................5 Infineon’s bipolar transistors for different driver applications ...............................................................6 Bill-of-Materials.....................................................................................................................................8 Summary of Measurement results (at room temperature) ...................................................................9 Application Note AN246, Rev1.1 4 / 15 2010-09-24 BFP750 BFP750 5.8 GHz Driver Amplifier Introduction 1 Introduction 1.1 Features Highly linear low noise driver amplifier for all RF frontends up to 5.5 GHz Based on Infineon´s reliable, high volume SiGe:C wafer technology Easy to use Pb-free (RoHS compliant) standard package with visible leads Figure 1 1.2 BFP750 in SOT343 Package Applications The BFP750 from Infineon Technologies is a SiGe:C Heterojunction bipolar Transistor dedicated for high linearity applications. Packaged into a SOT343 Package, this transistor is easy-to-use for the designs. The pin configuration is shown in Table 1. Table 1 Pin definition Pin Pin name comments 1 B Base of the BFP750 transistor 2 E Emitter of the BFP750 transistor 3 C Collector of the BFP750 transistor 4 E Emitter of the BFP750 transistor Additionally Infineon offers a range of other transistors which can be used either as a driver or a second stage amplifier. The following table (please see Table 2) presents different bipolar transistors and their different applications in driver configuration. Application Note AN246, Rev1.1 5 / 15 2010-09-24 BFP750 BFP750 5.8 GHz Driver Amplifier Introduction Table 2 Infineon’s bipolar transistors for different driver applications Application Frequency / MHz FM 78 … 110 BFR380F BFP450 BFP650 BFP750 X VHF 170 … 470 X UHF 470 … 880 X X ISM 434 / 868 X X GSM 900 X DECT 1900 X SDARS 2330 X X WiMax Low 2300 … 2700 X X WiMax Middle 3300 … 3700 X 5.8 GHz Cordless Phone 5800 X X Thus, the BFP750 component fits to any applications related to signal reception/transmission like WiMax and Cordless phones applications. On those conditions of use, the transmission module needs a strong power and moreover, a high linearity in order to achieve the WiMax and Cordless phones standards requirements. 1.3 BFP750 in cordless phone applications Since the creation of the Cordless phone in 1966, the communication standards concerning this technology saw a constant evolution. From the “first” cordless telephone using a signal at 1.7MHz (very sensitive to ambient noise) until the actual telephone visible on the market, the frequency usage of this technology changed a lot due to environmental perturbations and technology convenience. We can remark now a lot of standards like PHS (1.9GHz), DECT (1.9GHz), Wi-fi (2.4GHz) and cordless phone (5.8GHz) invading the domestical telephone market. These standards of communication, controlled by telecommunication authorities (for example the IEEE and FCC), regulate and establish rules of communication between devices. Such rules like protocols or even power emission and transmission are really essential in order to respect the quality and electromagnetic compatibility of each device. For the cordless telephone application, it is therefore important to send a signal with a high linearity, in one hand, to respect the quality of the signal (voice or data to send) and on the other hand not to perturbate other surroundings devices. That is why the signal to send has to include two or three stages of amplification. The schematic of the Figure 2 summarizes the needed elements for a RF Tx/Rx communication for cordless phone applications. Application Note AN246, Rev1.1 6 / 15 2010-09-24 BFP750 BFP750 5.8 GHz Driver Amplifier Introduction Figure 2 Schematic of the cordless phone 5.8GHz application This documentation presents BFP750’s performance in a driver configuration for 5.8 GHz cordless phone applications (please refer to the Table 4 for results). The application circuit of the driver BFP750 for Cordless phone is defined on the Figure 4 The circuit provides a Gain of about 10.5 dB at 5.8 GHz. The output 1dB compression point is located at 14.0 dBm (using a power sweep from -30 dBm to 10 dBm at input). The measurement setups can be found Figure 3. The measurements are made in reference to input and output of the amplifier (filter and cable losses substracted). Figure 3 Measuremement Setup for the OP1dB of BFP750 for 5.8GHz cordless phone application The input and output are matched to 50 Ω and present an input return loss of about 19.0 dB and an output return loss of nearly 16.6 dB. the device BFP750 is unconditionally stable from DC to 10 GHz. Concerning the small signal linearity, the output 3 (using two tones spaced 1 MHz at 5.8 GHz). Application Note AN246, Rev1.1 rd order intercept point of the application reaches 28.3 dBm 7 / 15 2010-09-24 BFP750 BFP750 5.8 GHz Driver Amplifier Application Information 2 Application Information 2.1 Schematic Diagram Figure 4 Schematic diagram of the BFP750 driver application circuit for 5.8 GHz Table 3 Bill-of-Materials Symbol Value Unit Size Manufacturer Comment C1 0.5 pF 0402 Various Input matching/ DC Block C2 33 nF 0402 Various RF signal to ground C3 33 pF 0402 Various Negative feedback C4 33 nF 0402 Various RF signal to ground C5 1.8 pF 0402 Various Output matching C6 0.5 pF 0402 Various Output Matching L1 2.0 nH 0402 Murata LQG series Output matching/DC Feed R1 910 Ω 0402 Various Voltage fixation R2 1.8 kΩ 0402 Various Negative feedback resistance R3 1.8 kΩ 0402 Various Base current setting R4 0 Ω 0402 Various Jumper R5 0 Ω 0402 Various Jumper R6 5.6 Ω 0402 Various Stabilization/Matching Q1 BFP750 Application Note AN246, Rev1.1 SOT343 Infineon Technologies SiGe C: bipolar transistor 8 / 15 2010-09-24 BFP750 BFP750 5.8 GHz Driver Amplifier Typical Measurement Results 3 Typical Measurement Results Table 4 Summary of Measurement results (at room temperature) Vcc=2.8V, Ic=51mA, freq=5800MHz Parameter Symbol Value Unit Frequency Range Freq 5800 MHz DC Voltage Vcc 2.8 V DC Current Icc 51 mA Gain G 10.6 dB Input P1dB IP1dB 5.5 dBm Output P1dB OP1dB 14.0 dBm Input Return Loss RLin 19.2 dB Output Return Loss RLout 16.6 dB Reverse Isolation IRev 15.8 dB Input IP3 IIP3 17.7 dBm Output IP3 OIP3 28.3 dBm Noise Figure NF 2.2 dB Comment/Test Condition Input Power sweep from Pin=-30…10dBm Input Power Pin=-30dBm Pin=-20dBm, f1=5800MHz, f2=5801MHz Unconditionnally stable from 0 to 10GHz ->1 Note: the measurements showed in Table 4 are excluding the PCB and SMA losses of 0.3dB. Stability Application Note AN246, Rev1.1 k 9 / 15 2010-09-24 BFP750 BFP750 5.8 GHz Driver Amplifier Measured Graphs 4 Measured Graphs Insertion Power Gain InBand 15 5800 MHz 10.59 dB 10 5 0 0 Figure 5 1000 2000 3000 4000 5000 6000 Frequency (MHz) 7000 8000 9000 10000 Insertion power gain of the BFP750 driver for 5.8GHz cordless phone application Input Matching 0 -10 -20 5800 MHz -19.16 dB -30 -40 0 Figure 6 1000 2000 3000 4000 5000 6000 Frequency (MHz) 7000 8000 9000 10000 Input matching of the BFP750 driver for 5.8GHz cordless phone application Application Note AN246, Rev1.1 10 / 15 2010-09-24 BFP750 BFP750 5.8 GHz Driver Amplifier Measured Graphs Output Matching 0 5800 MHz -16.62 dB -10 -20 -30 0 Figure 7 1000 2000 3000 4000 5000 6000 Frequency (MHz) 7000 8000 9000 10000 Output matching of the BFP750 driver for 5.8GHz cordless phone application Reverse Isolation 25 20 15 5800 MHz 15.76 dB 10 5 0 0 Figure 8 1000 2000 3000 4000 5000 6000 Frequency (MHz) 7000 8000 9000 10000 Reverse isolation of the BFP750 driver for 5.8GHz cordless phone application Application Note AN246, Rev1.1 11 / 15 2010-09-24 BFP750 BFP750 5.8 GHz Driver Amplifier Measured Graphs Stability K Factor 5 4 3 2 4118.4 MHz 1.181 1 0 0 Figure 9 2000 4000 6000 Frequency (MHz) 8000 10000 Stability K-factor of the BFP750 driver for 5.8GHz cordless phone application Mu2 factor Stability Mu factor 2 Mu1 factor 1.5 1 0.5 0 0 Figure 10 2000 4000 6000 Frequency (MHz) 8000 10000 Input 1dB Compression point of the BFP750 driver for 5.8GHz cordless phone application Application Note AN246, Rev1.1 12 / 15 2010-09-24 BFP750 BFP750 5.8 GHz Driver Amplifier Measured Graphs Figure 11 rd 3 order intercept point of the BFP750 driver for 5.8GHz cordless phone application Swp Max 6000MHz 2. 0 0. 6 0.8 Z11 1.0 Z Parameters Input output matching Z22 0. 0 3. 4 4. 5.0 5.0 10.0 1 0.0 4.0 3.0 5800 MHz r 1.0111 x -0.222604 2.0 1.0 0.8 0.6 5800 MHz r 0.772859 x -0.131191 0.4 0.2 0.2 0 0 -10. 0 2 -0. -4 .0 -5. 0 -3 .0 .0 -2 .4 Figure 12 -1.0 -0.8 -0 .6 -0 Swp Min 5000MHz Input and output Z-Parameters of the BFP750 driver for 5.8GHz cordless phone application Application Note AN246, Rev1.1 13 / 15 2010-09-24 BFP750 BFP750 5.8 GHz Driver Amplifier Authors Authors Anthony Thomas, RF Engineer of Business Unit “RF and Protection Devices” Dietmar Stolz, Staff engineer of Business Unit “RF and Protection Devices” Application Note AN246, Rev1.1 14 / 15 2010-09-24 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG AN246