Cree® EZ1350™ LEDs Data Sheet (Anode-up) CxxxEZ1350-Sxxx00-x Cree’s EZBright® LEDs are the newest generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree’s proprietary optical design and device submount technology to deliver superior value for highintensity LEDs. The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern. Additionally, these LEDs are die-attachable with conductive adhesive, solder paste or solder preforms, as well as flux eutectic attach. These vertically structured, low forward voltage LED chips are approximately 170 microns in height and are tested for conformity to optical and electrical specifications. Cree’s EZ™ chips are useful in a broad range of applications such as general illumination, automotive lighting and mobile flash. FEATURES APPLICATIONS • Lambertian Radiation Pattern • • Anode-up design (p-pad up) • EZBright LED Technology, binned @ 350 mA – 450 nm - 560+ mW – 460 nm - 560+ mW General Illumination – Aircraft – Decorative Lighting – Task Lighting – Outdoor Illumination • Low Forward Voltage (Vf) – 3.0 V Typical at 350 mA • White LEDs • Maximum DC Forward Current – 1500 mA • Projection Displays • Backside Metal versions for various attach methods: -A (AuSn) for use with Conductive Adhesives, Flux Eutectic Attach, Solder Paste & Solder Preforms -G (LTDA) for Low Temperature Flux Eutectic Attach • Automotive Exterior • Mobile Flash CxxxEZ1350-Sxxx00-x Chip Diagram A CPR3FY Rev Data Sheet: 1330 x 1330 µm Backside Ohmic Mesa (Junction), 1300 x 1300 µm Metallization Bond pads (2), 130 x 130 µm Anode (+), 2 places Cathode (-) Thickness, 170 µm Top View Side View Subject to change without notice. www.cree.com Bottom View 1 Maximum Ratings at TA = 25°C Note 1 CxxxEZ1350-Sxxx00-x DC Forward Current 1500 mA Peak Forward Current (1/10 duty cycle @ 1 kHz) 2000 mA LED Junction Temperature 150°C Reverse Voltage 5V Operating Temperature Range -40°C to +100°C LED Chip Storage Temperature -40°C to +120°C Recommended Die Sheet Storage Conditions ≤30°C / ≤85% RH Typical Electrical/Optical Characteristics at TA = 25°C, If = 350 mA Part Number Forward Voltage (Vf, V) Note 2 Reverse Current [I(Vr=5V), μA] Full Width Half Max (λD, nm) Min. Typ. Max. Max. Typ. C450EZ1350-Sxxxx00-x 2.6 3.0 3.4 2 20 C460EZ1350-Sxxxx00-x 2.6 3.0 3.4 2 21 Mechanical Specifications CxxxEZ1350-Sxxx00-x Description Dimensions Tolerance P-N Junction Area (μm) 1300 x 1300 ± 35 Chip Area (μm) 1330 x 1330 ± 35 170 ± 25 Chip Thickness (μm) Top Au Bond Pad (μm) - Qty. 2 130 x 130 ± 25 3.0 ± 1.5 1330 x 1330 ± 35 3.3 ± 1.5 Au Bond Pad Thickness (μm) Backside Ohmic Metal Area (μm) Backside Ohmic Metal Thickness (μm) Notes: 1. Maximum ratings are package-dependent. The above ratings were determined using a silicone encapsulated chip on MCPCB for characterization. Ratings for other packages may differ. The junction temperature should be characterized in a specific package to determine limitations. Assembly processing temperature must not exceed 325°C (< 5 seconds). See Cree EZBright Applications Note for assembly-process information. 2. All products conform to the listed minimum and maximum specifications for electrical and optical characteristics when assembled and operated at 350 mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given are within the range of average values expected by the manufacturer in large quantities and are provided for information only. All measurements were made using a Au-plated TO39 header without an encapsulant. Optical characteristics were measured in an integrating sphere using Illuminance E. 3. The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end-product to be designed in a manner that minimizes the thermal resistance from the LED junction to ambient in order to optimize product performance. 1600 Maximum Operating Current (mA) 1400 1200 1000 800 Rth j-a = 5 °C/W Rth j-a = 10 °C/W Rth j-a = 15 °C/W Rth j-a = 20 °C/W 600 400 200 0 25 50 75 100 125 150 Ambient Temperature (°C) © 2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, and EZBright® are registered trademarks, and EZ™ and EZ1350™ are trademarks of Cree, Inc. 2 CPR3FY Rev A (201502) Cree, Inc. 4600 Silicon Drive Durham, NC 27703-8475 USA Tel: +1.919.313.5300 Fax: +1.919.313.5778 www.cree.com/chips Standard Bins for CxxxEZ1350-Sxxx00-x LED chips are sorted to the radiant flux and dominant wavelength bins shown. A sorted die sheet contains die from only one bin. Sorted die kit (CxxxEZ1350-Sxxx00-x) orders may be filled with any or all bins (CxxxEZ1350-0xxx-x) contained in the kit. All radiant flux and dominant wavelength values shown and specified are at If = 350 mA. Radiant flux values are measured using Au-plated headers without an encapsulant. Radiant Flux (mW) C450EZ1350-S56000-x C450EZ1350-0225-x C450EZ1350-0226-x C450EZ1350-0227-x C450EZ1350-0228-x C450EZ1350-0221-x C450EZ1350-0222-x C450EZ1350-0223-x C450EZ1350-0224-x C450EZ1350-0217-x C450EZ1350-0218-x C450EZ1350-0219-x C450EZ1350-0220-x C450EZ1350-0213-x C450EZ1350-0214-x C450EZ1350-0215-x C450EZ1350-0216-x C450EZ1350-0209-x C450EZ1350-0210-x C450EZ1350-0211-x C450EZ1350-0212-x C450EZ1350-0205-x C450EZ1350-0206-x C450EZ1350-0207-x C450EZ1350-0208-x 660 640 620 600 580 560 445 447.5 450 452.5 455 Dominant Wavelength (nm) Radiant Flux (mW) C460EZ1350-S56000-x C460EZ1350-0225-x C460EZ1350-0226-x C460EZ1350-0227-x C460EZ1350-0228-x C460EZ1350-0221-x C460EZ1350-0222-x C460EZ1350-0223-x C460EZ1350-0224-x C460EZ1350-0217-x C460EZ1350-0218-x C460EZ1350-0219-x C460EZ1350-0220-x C460EZ1350-0213-x C460EZ1350-0214-x C460EZ1350-0215-x C460EZ1350-0216-x C460EZ1350-0209-x C460EZ1350-0210-x C460EZ1350-0211-x C460EZ1350-0212-x C460EZ1350-0205-x C460EZ1350-0206-x C460EZ1350-0207-x C460EZ1350-0208-x 660 640 620 600 580 560 455 457.5 460 462.5 465 Dominant Wavelength (nm) © 2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, and EZBright® are registered trademarks, and EZ™ and EZ1350™ are trademarks of Cree, Inc. 3 CPR3FY Rev A (201502) Cree, Inc. 4600 Silicon Drive Durham, NC 27703-8475 USA Tel: +1.919.313.5300 Fax: +1.919.313.5778 www.cree.com/chips Characteristic Curves, TA = 25°C Relative Intensity vs. Forward Current 500% Relative Light Intensity Vs Junction Temperature 400% 300% 200% 100% 0% 0 500 1000 1500 2000 Relative Light Intensity Relative Light Intensity This is a representative measurement for the EZ1350 LED product. Actual curves will vary slightly for the various radiant flux and dominant wavelength bins. 100% 95% 90% 85% 80% 75% 25 If (mA) DW Shift (nm) DW Shift (nm) 6 1 0 -1 5 4 3 2 1 0 500 1000 1500 0 2000 25 If (mA) -0.050 2 2.5 3 Vf (V) 3.5 4 -0.100 -0.150 -0.200 -0.250 -0.300 -0.350 -0.400 25 50 CPR3FY Rev A (201502) 75 100 125 150 Junction Temperature (°C) © 2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, and EZBright® are registered trademarks, and EZ™ and EZ1350™ are trademarks of Cree, Inc. 4 150 0.000 Voltage Shift (V) If (mA) 50 75 100 125 Junction Temperature (°C) Voltage Shift Vs Junction Temperature Forward Current vs. Forward Voltage 2000 1750 1500 1250 1000 750 500 250 0 150 Dominant Wavelength Shift Vs Junction Temperature Wavelength Shift vs. Forward Current 2 -2 50 75 100 125 Junction Temperature (°C) Cree, Inc. 4600 Silicon Drive Durham, NC 27703-8475 USA Tel: +1.919.313.5300 Fax: +1.919.313.5778 www.cree.com/chips Radiation Pattern This is a representative radiation pattern for the EZ LED products. Actual patterns will vary slightly for each chip. © 2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, and EZBright® are registered trademarks, and EZ™ and EZ1350™ are trademarks of Cree, Inc. 5 CPR3FY Rev A (201502) Cree, Inc. 4600 Silicon Drive Durham, NC 27703-8475 USA Tel: +1.919.313.5300 Fax: +1.919.313.5778 www.cree.com/chips