MX69V28F64 Read-While-Write, Multiplexed, Burst Mode, Flash Memory MX69V28F64 P/N:PM1751 REV. 1.3, JUL. 22, 2013 1 MX69V28F64 128M-BIT [8M x 16-bit] CMOS 1.8 Volt-only 1. FEATURES Characteristics Program/Erase Cycles Burst Length • Burst Mode - Continuous linear Data Retention • 100,000 cycles typical • 20 years • Linear burst length - 8/16 word with wrap around Sector Architecture • Multi-bank Architecture (8 banks) • Read while write operation • Four 16 Kword sectors on top/ bottom of address range • 127 sectors are 64 KWord sectors Hardware Features Power Supply Operations Hardware Sector Protection • All sectors locked when ACC = VIL • Supports multiplexing data and address for reduced I/O count. • A15–A0 multiplexed as Q15–Q0 Sector Architecture • 1.8V for read, program and erase operations (1.70V to 1.95V) • Deep power down mode Package • 56-Ball Thin FBGA (Fine-Pitch Ball Grid Array) • REACH SVHC Free and RoHS Compliant Performance Handshaking Feature • Allows system to determine the read operation High Performance of burst data with minimum possible latency by monitoring RDY. • 30us - Word programming time • 7.5us - Effective word programming time utilizing a 32 word Write Buffer at VCC level • 2.5us - Effective word programming time of utilizing a 32 word Write Buffer at ACC level Sector Erase Time • 500ms for 16 Kword sectors • 1000ms for 64 Kword sectors Read Access Time • Burst access time: 7ns (at industrial temperature range) • Asynchronous random access time: 80ns • Synchronous random access time: 75ns Secure Silicon Sector Region • 128 words for the factory & customer secure silicon sector Power Dissipation • Typical values: 8 bits switching, CL = 10 pF at 108 MHz, CIN excluded • 20mA for Continuous burst read mode • 30mA for Program/Erase Operations (max.) • 30uA for Standby mode P/N:PM1751 REV. 1.3, JUL. 22, 2013 2 MX69V28F64 2. Product Selection Guide MX69V28F64BBXJW 128Mb 108MHz 108MHz Boot Sector Type 7.7x6.2x1.2 56-TFBGA Bottom MX69V28F64BBXLW 128Mb 108MHz 108MHz 7.7x6.2x1.05 56-TFBGA Bottom MX69V28F64MBXLW 128Mb 108MHz 108MHz 7.7x6.2x1.05 56-TFBGA Bottom Device Flash Density Flash Speed P/N:PM1751 pSRAM Package Type REV. 1.3, JUL. 22, 2013 3 MX69V28F64 3. BLOCK DIAGRAM R-LB # R-CRE R-UB# R-CE # OE# WE# AVD # CLK LB# CRE UB# CE # pSRAM WAIT AD15-AD0 Amax-A16 F- CE # F-ACC F-WP# F-RST# OE# WE# AVD # CLK max- A16 CE# ACC WP# RST# OE# WE# AVD # V RDY RDY/WAIT AD15-AD0 AD15-AD0 CLK Amax- A16 P/N:PM1751 REV. 1.3, JUL. 22, 2013 4 MX69V28F64 4. PIN CONFIGURATIONS 56-Ball, VFBGA with pSRAM Legend A1 A14 NC NC C3 C4 C7 C8 C11 C12 NC NC R- LB# R- UB# NC NC D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 F-RDY/ R-WAIT A21 VSS CLK VCC WE# F-ACC A19 A17 A22 E9 E3 E4 E5 E6 E7 E8 E10 E11 E12 VI/O A16 A20 AVD# NC F-RST# F-WP# A18 F-CE# VSSQ F3 F4 F5 F6 F7 F8 F9 F10 F11 F12 VSS A/Q7 A/Q6 A/Q13 A/Q12 A/Q3 A/Q2 A/Q9 A/Q8 OE# G3 G4 G5 G6 G7 G8 G9 G10 G11 G12 A/Q15 A/Q14 VSSQ A/Q5 A/Q4 A/Q11 A/Q10 VI/O A/Q1 A/Q0 H3 H4 H7 H8 H11 H12 NC NC R-CE# NC NC R-CRE No Connect (Distance between outer NC balls is 2x pitch) Flash/RAM Shared Only Flash Only RAM Only K1 K14 NC NC Notes: 1. Flash & pSRAM shared the address pins, which varies by density of pSRAM. MCP Shared AQ Pins Flash-only Addresses Shared Addresses MX69V28F64 AQ15-AQ0 A22 A21~A16 P/N:PM1751 REV. 1.3, JUL. 22, 2013 5 MX69V28F64 5. PIN DESCRIPTION SYMBOL Amax-A16 A/Q15~A/Q0 OE# WE# VCC VI/O VSS VSSQ NC RDY CLK AVD# F-RBST# F-WP# F-ACC R-CE# F-CE# R-CRE R-UB# R-LB# DESCRIPTION Address Inputs for 128Mb Multiplexed Data Inputs/Outputs Output Enable Write Enable Device Power Supply (1.70V~1.95V) Input/Output Power Supply (1.70V~1.95V) Device Ground Input/Output Ground No Connection Ready status of the Burst Mode Refer to configuration register table Clock Address Valid Data input. Hardware Reset Pin, Active Low H/W Write Protect Programming Acceleration Input Chip-enable Chip-enable Control Register Enable Upper Byte Latch Lower Byte Latch Flash V V V V V V V V V V RAM V V V V V V V V V V V V V V V V V V V V V V Note: F- : For Flash R- : For pSRAM P/N:PM1751 REV. 1.3, JUL. 22, 2013 6 MX69V28F64 6. PART NAME DESCRIPTION MX 69V 28 F 64 T T XJ W TEMPERATURE RANGE: W: Wireless (-25° C to 85° C) PACKAGE: XJ: TFBGA with 56-ball (7.7x6.2x1.2mm) XL: TFBGA with 56-ball (7.7x6.2x1.05mm) Top/ Bottom boot pSRAM Vendor pSRAM DENSITY : 64: 64Mb REVISION: F Flash DENSITY : 28: 128Mb DEVICE: 69V : Multi-Chip Product (MCP) 1.8Volt Read-While-Write AD-Mux Burst Mode Flash Memory and RAM P/N:PM1751 REV. 1.3, JUL. 22, 2013 7 MX69V28F64 7. PACKAGE INFORMATION P/N:PM1751 REV. 1.3, JUL. 22, 2013 8 MX69V28F64 P/N:PM1751 REV. 1.3, JUL. 22, 2013 9 MX69V28F64 8. REVISION HISTORY Revision No. Description 1.0 1. Removed "Advanced Information" 2. Modified word programming time, continuous burst read mode and standby mode 3. Added MX69V28F32BBXJW in Product Selection Guide P3 1.1 1. Added MX69V28F64BBXLW in Product Selection Guide 2. Added 56-TFBGA (7.7x6.2x1.05mm) package information P3 P7,9 NOV/27/2012 1.2 1. Modified PIN CONFIGURATIONS (from K3 to K1) 2. Added MX69V28F64MBXLW in Product Selection Guide P5 P3 APR/25/2013 1.3 1. Removed MX69V28F32 All JUL/22/2013 P/N:PM1751 Page P1,2 P2 Date JUL/30/2012 REV. 1.3, JUL. 22, 2013 10 MX69V28F64 Except for customized products which has been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2011~2013. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Audio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only. For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice. 11