APPLICATION NOTE Macronix MX25L_E/F, Spansion S25FL_S, and Micron N25Q 24-BGA PCB Dual Layout for 4x6 and 5x5 Ball Arrays 1. Introduction Macronix offers MX25L_E/F high performance serial flash in densities ranging from 32Mb to 512Mb. Macronix MX25L_E/F, Spansion S25FL_S and Micron N25Q devices have similar 24-BGA packages, but they have different ball arrays. This application note explains how to use a dual layout for 24-BGA packages that have different ball arrays. The information in this document is based on datasheets listed in Section 5. For functional descriptions, please refer to each vendor’s latest datasheet. Newer versions of the datasheets may override the contents of this document. P/N: AN0196 1 Rev:1, Oct. 30, 2012 APPLICATION NOTE Macronix MX25L_E/F, Spansion S25FL_S, and Micron N25Q 24-BGA PCB Dual Layout for 4x6 and 5x5 Ball Arrays 2. Hardware Consideration The Macronix 24-BGA has a similar ball footprint with the Spansion and Micron devices. However, some hardware differences may require a minor PCB adjustment to create a “dual layout” which will accommodate both devices. 2-1. 24-BGA Pin definition (4x6 ball array / 5x5 ball array) Hardware pins are similar, but some balls have minor function differences. Table 2-1: 24-BGA (6x4 Ball Array) Ball Assignment Differences 4x6 ball array Macronix Spansion Ball No. MX25L_E/F S25FL_S A4 D4 E4 NC HOLD#/SIO3 NC RESET#/RFU HOLD#/IO3 VIO/RFU Note NC/SIO3: MX25L6435E/6455E/12855E RESET#: MX25L25655E Table 2-2: 24-BGA (5x5 Ball Array) Ball Assignment Differences 5x5 ball array Macronix Spansion Micron Ball No. MX25L_E/F S25FL_S N25Q A4 NC RESET#/RFU NC D4 HOLD#/SIO3 HOLD#/IO3 HOLD#/DQ3 E4 NC VIO/RFU NC Note RESET#: MX66L51235F, N25Q256/512A NC/SIO3: MX66L51235F*1 HOLD#/RESET#/DQ3: N25Q256/512A - Note:1: MX66L51235F is a 2 die solution and is a member of the MX25L_35F family. MX25L_35F refers to all family members. MX25L_E ( 4x6 ball array) MX25L_E/F (5x5 ball array) 4 NC VCC WP#/ SIO2 HOLD #/SIO3 NC NC 5 NC NC NC NC NC 3 NC GND NC SI/SIO 0 NC NC 4 NC VCC WP#/ SIO2 HOLD #/SIO3 NC 2 NC SCLK CS# SO/SI O1 NC NC 3 NC GND NC SI/SIO 0 NC 1 NC NC NC NC NC NC 2 NC SCLK CS# SO/SI O1 NC A B C D E F 1 NC NC NC NC B C D E A Hold# signal is internal pull high Hold# signal is internal pull high Figure 2-1: 24-BGA Pin Definition P/N: AN0196 2 Rev:1, Oct. 30, 2012 APPLICATION NOTE Macronix MX25L_E/F, Spansion S25FL_S, and Micron N25Q 24-BGA PCB Dual Layout for 4x6 and 5x5 Ball Arrays 2-2. 24-BGA Package dimension (4x6 ball array) Generally, package dimensions (symbol D & E) are the same. Ball dimension and ball pitch are also the same (symbol b, e, D1, E1). Table 2-3 shows all package dimensions. Table 2-3: 24-BGA (4x6 ball array) Package Dimensions Dimension Macronix Spansion MX25L_E/F S25FL_S Symbol Min. Nom. Max. Min. Nom. Max. D D1 E E1 b e 5.90 7.90 0.35 - 6.00 3.00 8.00 5.00 0.40 1.00 6.10 8.10 0.45 - 0.35 - 6.00 3.00 8.00 5.00 0.40 1.00 0.45 Unit: mm P/N: AN0196 3 Rev:1, Oct. 30, 2012 APPLICATION NOTE Macronix MX25L_E/F, Spansion S25FL_S, and Micron N25Q 24-BGA PCB Dual Layout for 4x6 and 5x5 Ball Arrays 2-3. 24-BGA Package dimension (5x5 ball array) Package dimensions (symbol D & E), ball dimension and ball pitch are the same (symbol b, e, D1, E1). Table 2-4 shows all package dimensions. Table 2-4: 24-BGA (5x5 ball array) Package Dimensions Dimension Macronix Spansion MX25L_E/F S25FL_S Symbol Min. Nom. Max. Min. Nom. Max. D D1 E E1 b e 5.90 7.90 0.35 - 6.00 4.00 8.00 4.00 0.40 1.00 6.10 8.10 0.45 - 0.35 - 6.00 4.00 8.00 4.00 0.40 1.00 0.45 - Micron N25Q Min. Nom. Max. 5.90 7.90 0.35 - 6.00 4.00 8.00 4.00 0.40 1.00 6.10 8.10 0.45 Unit: mm P/N: AN0196 4 Rev:1, Oct. 30, 2012 APPLICATION NOTE Macronix MX25L_E/F, Spansion S25FL_S, and Micron N25Q 24-BGA PCB Dual Layout for 4x6 and 5x5 Ball Arrays 3. 4x6 Ball Array and 5x5 Ball Array 24-BGA Layout Recommendation In general, a PCB “dual layout” can accommodate both packages in the same footprint when clearance is provided around the overlapped package outlines. In order to align the balls of both 24-BGA packages, one package must be offset from the other by 0.5mm. When comparing the 4x6 ball array 24-BGA (rectangle offset to the lower right corner in Figure 3-1) with 5x5 ball array 24-BGA (rectangle offset to the upper left corner in Figure 3-1), it can be seen in Figure 3-1, that by extending the package space on the PCB board to 8.5mm in length and 6.5mm in width (red dot rectangle), the PCB can now accommodate both BGA footprints. 2.0mm 0.5mm 0.5mm 6.5mm 1.0mm 1.5mm 1.5mm 8.5mm 1.0mm Figure 3-1: 4x6 Ball Array and 5x5 Ball Array 24-BGA Dual Layout P/N: AN0196 5 Rev:1, Oct. 30, 2012 APPLICATION NOTE Macronix MX25L_E/F, Spansion S25FL_S, and Micron N25Q 24-BGA PCB Dual Layout for 4x6 and 5x5 Ball Arrays 4. Part Number Cross-Reference Table 4-1 shows basic part number and package information cross references for the Macronix MX25L_E/F, Spansion S25FL_S, and Micron N25Q. Table 4-1: Part Number Cross-Reference Density Macronix Part Spansion Part MX25L3255EXCI-10G MX25L3255EXDI-10G MX25L6435EXCI-10G MX25L6455EXCI-10G MX25L6456EXCI-10G MX25L6456EXDI-10G MX25L12855EXCI-10G MX25L25655EXCI-12G MX66L51235FXDI-10G - 32Mb 64Mb 128Mb 256Mb 512Mb S25FL128SAGBHI3/B/D_ S25FL128SAGBHI2/A/C_ S25FL256SAGBHI3/B/D_ S25FL256SAGBHI2/A/C_ S25FL256SAGBHI2/A/C1 S25FL256SAGBHI3/B/D1 Micron Part Ball array N25Q032A13E1240 N25Q064A13E1240 N25Q128A13E1240 N25Q256A1/3/83E1240 N25Q512A1/83E1240 - 4x6 ball array 5x5 ball array 4x6 ball array 4x6 ball array 4x6 ball array 5x5 ball array 4x6 ball array 5x5 ball array 4x6 ball array 5x5 ball array 5x5 ball array 4x6 ball array 5. References Table 5-1 shows the datasheet versions used for comparison in this application note. For the most current, detailed specification, please refer to the each flash vender’s website. Table 5-1: Datasheet Version Datasheet Location Data Issued Version MX25L3255E MX25L6435E MX25L6455E/12855E MX25L6456E MX25L25655E MX66L51235F S25FL128S/256S S25FL512S N25Q032A N25Q064A N25Q128A N25Q256A N25Q512A Macronix Website Macronix Website Macronix Website Macronix Website Macronix Website Macronix Website Spansion Website Spansion Website Micron Website Micron Website Micron Website Micron Website Micron Website Jul. 23, 2012 Apr. 19, 2012 Jun. 18, 2012 Jul. 23, 2012 Sep 01, 2010 Aug. 08, 2012 Jul. 12, 2012 Mar. 2, 2012 Jun. 2012 Jun. 2012 Jun. 2012 Aug. 2012 Aug. 2012 Rev 0.01 Rev 0.05 Rev 1.5 Rev 0.00 Rev. 1.0 Rev. 0.00 Rev. 05 Rev. 02 Rev. E Rev. G Rev. L Rev. L Rev. J P/N: AN0196 6 Rev:1, Oct. 30, 2012 APPLICATION NOTE Macronix MX25L_E/F, Spansion S25FL_S, and Micron N25Q 24-BGA PCB Dual Layout for 4x6 and 5x5 Ball Arrays 6. Summary The Macronix MX25L_E/F, Spansion S25FL_S, and Micron N25Q 24-BGA packages have the same ball size and pitch dimensions with similar pin functions, but they use different ball arrays. A PCB “dual layout” can be created to accommodate both packages in the same footprint if a small amount of extra clearance is provided around the overlapped package outlines. In general, the designer may use this application note as a reference while designing a PCB with a dual layout to accommodate the 5x5 and 6x4 ball arrays within the same footprint. 7. Revision History Revision No. 1.0 P/N: AN0196 Description Date Initial Release Sep. 12, 2012 7 Rev:1, Oct. 30, 2012 APPLICATION NOTE Macronix MX25L_E/F, Spansion S25FL_S, and Micron N25Q 24-BGA PCB Dual Layout for 4x6 and 5x5 Ball Arrays Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2011~2012. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com P/N: AN0196 8 Rev:1, Oct. 30, 2012