APPLICATION NOTE Spansion S29GL_S & Macronix MX29GL_F 64-BGA Dual Layout 1. Introduction Macronix offers MX29GL_F high performance parallel flash in densities from 128Mb to 1Gb. MX29GL_F and Spansion S29GL_S devices have similar 64-BGA package, but are different in package dimension. This application note explains how to use a dual layout for 64-BGA package with different dimension. Note: 1. Function difference may refer to document “AN143V1_MGRT_S29GL-S to MX29GL-F”. 2. Hardware Consideration Macronix device has a similar footprint with the Spansion device. However, some hardware differences may require a minor effort to provide a dual layout for both devices. 2-1. 64-LFBGA Pin definition (11x13mm / 9x9mm) Hardware pins are similar, but some pins are different in minor function. The table below shows a simple comparison. MX29GL_F (11x13mm) S29GL_S (9x9mm) 8 NC A22 A23 VIO GND A24 A25 NC 8 NC A22 A23 VIO VSS A24 A25 NC 7 A13 A12 A14 A15 A16 BYTE # Q15/A -1 GND 7 A13 A12 A14 A15 A16 RFU Q15 VSS 6 A9 A8 A10 A11 Q7 Q14 Q13 Q6 6 A9 A8 A10 A11 DQ7 DQ14 DQ13 DQ6 5 WE# RESET# A21 A19 Q5 Q12 VCC Q4 5 WE# RESET# A21 A19 DQ5 DQ12 VCC DQ4 4 RY/ BY# WP#/ ACC A18 A20 Q2 Q10 Q11 Q3 4 RY/ BY# WP# A18 A20 DQ2 DQ10 DQ11 DQ3 3 A7 A17 A6 A5 Q0 Q8 Q9 Q1 3 A7 A17 A6 A5 DQ0 DQ8 DQ9 DQ1 2 A3 A4 A2 A1 A0 CE# OE# GND 2 A3 A4 A2 A1 A0 CE# OE# VSS 1 NC NC NC NC NC VIO NC NC 1 NC NC NC NC DNU VIO RFU NC F G H F G H A B C D E C8: NC on MX29GL128F F8: NC on MX29GL128F/256F G8: NC on MX29GL128F/256F/512F A B C D E C8: NC on S29GL128S F8: NC on S29GL128S/256S G8: NC on S29GL128S/256S/512S Note: Macronix 1Gb devices only offer a VI/O = Vcc option;VI/O = 1.65 ~ Vcc is not supported. Ball connection recommendation table Ball No. MX29GL_F S29GL_S E1 NC Do not use G1 NC Reserve future use F7 Byte# Reserve future use Publication Number: AN-168V1 1 Note NC for both NC for both MX29GL_F: pull high for word mode S29GL_S: NC Jun. 25, 2012 APPLICATION NOTE Spansion S29GL_S & Macronix MX29GL_F 64-BGA Dual Layout 2-2. 64-LFBGA Package dimension (11x13mm / 9x9mm) Ball dimension and ball pitch are the same (symbol b, e, D1, E1), but the package dimension (symbol D & E) is different. Detail comparison table describes below. Dimensio n Symbol D D1 E E1 b e Macronix MX29GL_F Min Typ Max 10.90 12.90 0.50 11.00 7.00 13.00 7.00 0.60 1.00 Spansion S29GL_S Min Typ Max 11.10 13.10 0.70 0.50 9.00 7.00 9.00 7.00 0.60 1.00 0.70 Unit: mm Publication Number: AN-168V1 2 Jun. 25, 2012 APPLICATION NOTE Spansion S29GL_S & Macronix MX29GL_F 64-BGA Dual Layout 3. 11x13mm and 9x9mm 64-BGA layout recommendation In general, a PCB dual layout will accommodate both packages in the same. When comparing the 9x9mm original space (purple rectangle) with the space required by the 11x13mm package (pink rectangle), it can be seen that the PCB needs to extend the package space by 1mm of length and 2mm of width in order to fit both 64-BGA packages. The dual layout is shown below for reference. 4. Summary Macronix MX29GL_F 11x13mm 64-BGA and Spansion S29GL_S 9x9mm 64-BGA have the same ball size and similar pin functions. Generally, the designer may use this application note as a design reference for a 64-BGA dual layout. Note: 1. Detail comparison may refer to“AN143V1_MGRT_S29GL-S to MX29GL-F”, in order to multi source using. Publication Number: AN-168V1 3 Jun. 25, 2012 APPLICATION NOTE Spansion S29GL_S & Macronix MX29GL_F 64-BGA Dual Layout 5. Appendix The table below shows basic part number and package information cross references for the Macronix MX29GL_F and Spansion S29GL_S. Density Dimensio n 128Mb 256Mb 512Mb 1Gb Macronix Part 11x13x14mm, 0.6mm ball Spansion Part 9x9x14mm. 0.6mm ball MX29GL128FHXFI-90G MX29GL128FLXFI-90G MX29GL128FUXFI-11G MX29GL128FDXFI-11G MX29GL256FHXFI-90Q MX29GL256FLXFI-90Q MX29GL256FUXFI-11G MX29GL256FDXFI-11G MX29GL512FHXFI-10Q*1 MX29GL512FLXFI-10Q*1 MX29GL512FHXFI-12G*1 MX29GL512FLXFI-12G*1 MX68GL1G0FHXFI-11G*1 MX68GL1G0FLXFI-11G*1 S29GL128S90DHI01 S29GL128S90DHI02 S29GL128S10DHIV1 S29GL128S10DHIV2 S29GL256S90DHI01 S29GL256S90DHI02 S29GL256S10DHIV1 S29GL256S10DHIV2 S29GL512S10DHI01 S29GL512S10DHI02 S29GL512S10DHIV1 S29GL512S10DHIV2 S29GL01GS11DHI01 S29GL01GS11DHI02 Package 64-LFBGA 64-LFBGA 64-LFBGA 64-LFBGA Note: 1: MX68GL1G0F and MX29GL512F are 2 dies solution and are MX29GL_F family members. MX29GL_F refers to all family members. Publication Number: AN-168V1 4 Jun. 25, 2012 APPLICATION NOTE Spansion S29GL_S & Macronix MX29GL_F 64-BGA Dual Layout Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2011~2012. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com Publication Number: AN-168V1 5 Jun. 25, 2012