APPLICATION NOTE Replacing Spansion® S29GL-S with Macronix MX29GL-G (512Mb/1Gb) 1. Introduction This application note compares Macronix MX29GL-G and Spansion® S29GL-S Parallel Flash. The comparison covers the general features, performance, command codes, and other differences. The document does not provide detailed information on individual devices, but highlights differences that may require additional attention for a successful migration. The MX29GL-G is compatible with the common commands and features of the S29GL-S. Additionally, the supported package types have similar footprints and pin-out definitions. The information in this document is based on the latest datasheets listed in "11. References". Newer versions of the datasheets may override the contents of this document. Both flash device families have similar features and functions as shown in "Table 1-1: Key Feature Comparison". Table 1-1: Key Feature Comparison Macronix MX29GL-G Spansion® S29GL-S Technology 55nm Floating Gate 65nm MirrorBit VCC Range 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V (H/L type) 1.65V to 3.6V (U/D type) 2.7V to 3.6V (01/02 type) 1.65V to 3.6V (V1/V2 type) x16 / x8 x16 only Uniform Sector 128KB Uniform Sector 128KB Read Page Size 16 Words / 32 Bytes 16 Words Write Buffer Size 256 Words / 256 Bytes* 256 Words Security OTP size 512 Words / 1024 Bytes 512 Words Yes** Yes ACC pin Yes - Extended Status Register Yes Yes Deep Power Down Mode Yes - Blank Check Yes Yes CFI Version 1.5 1.5 Read Performance Up to 98 MB/s Up to 98 MB/s Buffer Program Performance Up to 1.8MB/s Up to 1.5MB/s Sector Erase Performance Up to 524 KB/s Up to 477 KB/s Feature I/O Voltage Range Data Bus Width Sector Architecture Advanced Sector Protection Notes: *Write Buffer size is 256 Bytes when using Macronix flash with a x8 Data Bus width. **Provide USPB feature. P/N: AN0240 1 REV. 2, MAY. 30, 2014 APPLICATION NOTE 2. Package Macronix MX29GL-G series is available in 56-pin TSOP, 64-pin LFBGA, and 56-pin FBGA package options, which have similar pin-outs with the Spansion® S29GL-S devices. The footprint comparisons are shown in "Figure 2-1: 56-TSOP Pin-Out" and "Figure 2-2: 64-LFBGA Pin-Out". A summary of pin-out differences is shown in "Table 2-1: Pin-Out Comparison". The 56-TSOP packages of the MX29GL-G are S29GL-S are pin compatible even though pin 53 is BYTE# on the Macronix MX29GL-G because BYTE# has an internal pull-up and can be left unconnected for x16 data bus width operation. Figure 2-1: 56-TSOP Pin-Out P/N: AN0240 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 A24 A25, NC for MX29GL512G A16 BYTE# GND Q15/A-1 Q7 Q14 Q6 Q13 Q5 Q12 Q4 VCC Q11 Q3 Q10 Q2 Q9 Q1 Q8 Q0 OE# GND CE# A0 NC VI/O 2 A23 A22 A15 A14 A13 A12 A11 A10 A9 A8 A19 A20 WE# RESET# A21 WP# RY/BY# A18 A17 A7 A6 A5 A4 A3 A2 A1 RFU DNU 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 ≈ Spansion® S29GL-S ≈ 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 ≈ A23 A22 A15 A14 A13 A12 A11 A10 A9 A8 A19 A20 WE# RESET# A21 WP#/ACC RY/BY# A18 A17 A7 A6 A5 A4 A3 A2 A1 NC NC ≈ Macronix MX29GL-G 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 A24 A25, NC for S29GL512S A16 RFU VSS DQ15 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 OE# VSS CE# A0 RFU VI/O REV. 2, MAY. 30, 2014 APPLICATION NOTE The 64-LFBGA packages of the MX29GL-G and S29GL-S are pin compatible even though pin F7 is BYTE# on the Macronix MX29GL G because BYTE# has an internal pull-up and can be left unconnected for x16 data bus width operation. Figure 2-2: 64-LFBGA Pin-Out Macronix MX29GL-G Spansion® S29GL-S 8 NC A22 A23 VI/O GND*2 A24 A25*1 NC 8 NC A22 A23 VI/O VSS A24 A25*1 NC 7 A13 A12 A14 A15 A16 BYTE# Q15/ A-1 GND*2 7 A13 A12 A14 A15 A16 RFU DQ15 VSS 6 A9 A8 A10 A11 Q7 Q14 Q13 Q6 6 A9 A8 A10 A11 DQ7 DQ14 DQ13 DQ6 5 WE# RESET# A21 A19 Q5 Q12 VCC Q4 5 WE# RESET# A21 A19 DQ5 DQ12 VCC DQ4 4 RY/ BY# WP#/ ACC A18 A20 Q2 Q10 Q11 Q3 4 RY/ BY# WP# A18 A20 DQ2 DQ10 DQ11 DQ3 3 A7 A17 A6 A5 Q0 Q8 Q9 Q1 3 A7 A17 A6 A5 DQ0 DQ8 DQ9 DQ1 2 A3 A4 A2 A1 A0 CE# OE# GND 2 A3 A4 A2 A1 A0 CE# OE# VSS 1 NC NC NC NC NC VI/O NC NC 1 NC NC NC NC DNU VI/O RFU NC C D E F G H C D E F G H A B A B Notes: 1. G8(A25) is NC for S29GL512S Notes: 1. G8(A25) is NC for MX29GL512G 2. Macronix F7 is BYTE# and should be left floating or pulled up to VI/O for x16 operation. Spansion F7 is RFU. Table 2-1: Pin-Out Comparison Package Pin P/N: AN0240 Signal Name 56-TSOP (14x20mm) 64-LFBGA (11x13mm) Macronix MX29GL-G Spansion® S29GL-S 16 B4 WP#/ACC WP# 28 E1 NC DNU 53 F7 BYTE# RFU 51 G7 Q15/A-1 DQ15 - - NC DNU - - NC RFU 3 Remarks Spansion® S29GL-S does not support program acceleration voltage. NC = Pin not connected internally. DNU = Do Not Use. Leave pin unconnected. Macronix MX29GL-G supports BYTE mode in the 56 TSOP and 64-LFBGA packages. The BYTE# pin should be left unconnected or pulled up to VI/O. Spansion® S29GL-S does not support BYTE mode and does not have an A-1 pin. NC = Pin not connected internally. DNU = Do Not Use. Leave pin unconnected. NC = Pin not connected internally. RFU = Reserved for Future Use. REV. 2, MAY. 30, 2014 APPLICATION NOTE 3. Commands Macronix MX29GL-G is command compatible with the Spansion® S29GL-S. Please refer to the product datasheet for detailed descriptions the command set. 4. Electrical Characteristics DC and AC characteristics are compared in "Table 4-1: DC Characteristics", "Table 4-2: AC Characteristics", and "Table 4-3: Timing" below. Table 4-1: DC Characteristics Parameter Description Macronix MX29GL-G Type 512Mb f=1MHz Icr1 Read Current f=5MHz typ f=10MHz P/N: AN0240 f=10MHz 1Gb 5 - 12 55 20 8 - 6 12 9 Page Read Current Icw Write Current typ Isb Standby Current typ 20 Isbr Reset Current typ Isbs Sleep Mode Current Idpd Vhv f=33MHz 512Mb 4 Icr2 typ 1Gb Spansion® S29GL-S 35 Unit mA mA 45 mA 40 70 uA 20 40 10 uA typ 20 40 100 uA Vcc deep power down current typ 3 6 - uA Very High Voltage for Auto Select/Accelerated Program min 9.5 - max 10.5 - min -0.1 -0.5 max 0.3xVI/O 0.3xVI/O min 0.7xVI/O 0.7xVI/O max VI/O+0.3 VI/O+0.4 V Vil Input Low Voltage Vih Input High Voltage Vol Output Low Voltage max 0.45 0.15xVI/O V Voh Output High Voltage min 0.85xVI/O 0.85xVI/O V Vlko Low Vcc Lock-out voltage min 2.1 2.25 max 2.4 2.5 4 V V V REV. 2, MAY. 30, 2014 APPLICATION NOTE Table 4-2: AC Characteristics Parameter Description Macronix MX29GL-G Spansion® S29GL-S 100 100 110 110 15 15 25 25 100 100 110 110 25 25 30 35 Type Macronix MX29GL-G Spansion® S29GL-S Unit Type VI/O=VCC Taa Valid data output after address Tpa Page access time Tce Valid data output after CE# low VI/O=VCC Toe Valid data output after OE# low VI/O=VCC VI/O=1.65 to VCC VI/O=VCC VI/O=1.65 to VCC VI/O=1.65 to VCC VI/O=1.65 to VCC max max max max Unit ns ns ns ns Table 4-3: Timing Parameter P/N: AN0240 Description Tvcs VCC Setup Time min 300 300 us Tvios VI/O Setup Time min 300 300 us Trh RESET# High Time Before Read min 50 50 ns Trp1 RESET# Pulse Width (During Automatic Algorithms) min 10 0.2 us Trp2 RESET# Pulse Width (Not During Automatic Algorithms) min 0.2 0.2 us min - 200 max 30 - min - 200 max 0.5 - Tready1 RESET# PIN Low (During Automatic Algorithms) to Read or Write Tready2 RESET# PIN Low (Not During Automatic Algorithms) to Read or Write 5 us us REV. 2, MAY. 30, 2014 APPLICATION NOTE 5. Erase and Programming Performance A comparison of erase and programming performance is shown in "Table 5-1: Erase and Programming Performance". Table 5-1: Erase and Programming Performance Description Type Chip Erase Time typ Sector Erase Time typ Word Program Time typ Total Write Buffer Time 32 Words 256 Words typ Macronix MX29GL-G Spansion® S29GL-S 512Mb 1Gb 512Mb 100 200 1Gb Unit N/A sec 0.25 0.28 sec 30 125 us - 175 284 340 us Total ACC Write Buffer Time typ 200 N/A* us Write Buffer Program Throughput typ 1.8 1.5 MB/Sec ACC Write Buffer Program Throughput typ 2.6 N/A* MB/Sec Erase/Program Cycles typ 100,000 100,000 cycles ® Note: Spansion S29GL-S series do not support High Voltage ACC programming. 6. Memory Organization The memory and sector architecture of Macronix MX29GL-G is identical to the Spansion® S29GL-S. 7. Device Identification Manufacturer IDs are different, but Device IDs are the same. Table 7-1: Manufacturer ID and Device ID Macronix MX29GL-G Spansion® S29GL-S Manufacturer ID 00C2h 0001h Device ID (cycle 1) 227Eh 227Eh 512Mb 2223h 2223h 1Gb 2228h 2228h 2201h 2201h Parameter Device ID (cycle 2) Device ID (cycle 3) P/N: AN0240 6 REV. 2, MAY. 30, 2014 APPLICATION NOTE 8. CFI Difference The Common Flash Interface Register values are compared in "Table 8-1: CFI Table Comparison". Table 8-1: CFI Table Comparison Macronix Spansion® Address (h) Address (h) MX29GL-G S29GL-S (Word Mode) (Byte Mode) Data (h) Data (h) Description Typical timeout per single word write, 2n us 1F 3E 0005 0008 Max. timeout for single word write, 2n times typical 23 46 0003 0001 26 4C 0001 0003 28 50 0002 0001 48 90 0001 0000 4D 9A 0095 0000 4E 9C 00A5 0000 Erase Suspend Timeout Maximum < 2n (us) 55 AA 0005 0006 Program Suspend Timeout Maximum < 2n (us) 56 AC 0005 0006 Embedded Hardware Reset Timeout Maximum < 2n (us) Reset with Reset Pin 78 F0 0005 0006 Max. timeout for full chip erase, 2n times typical (00h = not supported) Flash Device Interface Description 0 = x8-only, 1 = x16-only, 2 = x8/x16 capable Temporary sector unprotect (1=supported) Minimum ACC(acceleration) supply (0= not supported), [D7:D4] for volt, [D3:D0] for 100mV Maximum ACC(acceleration) supply (0= not supported), [D7:D4] for volt, [D3:D0] for 100mV P/N: AN0240 7 REV. 2, MAY. 30, 2014 APPLICATION NOTE 9. Part Number Cross-Reference Cross Reference "Table 9-1: Part Number Cross-Reference" shows basic part number and package information for the Macronix MX29GL-G and Spansion® S29GL-S devices. Table 9-1: Part Number Cross-Reference Density Package 56-TSOP 512Mb 64-LFBGA 56-TSOP 1Gb 64-LFBGA Macronix MX29/68GL-G P/N Spansion® S29GL-S P/N MX29GL512GHT2I-10G S29GL512S10TFI01 MX29GL512GLT2I-10G S29GL512S10TFI02 MX29GL512GUT2I-11G S29GL512S11TFIV1 MX29GL512GDT2I-11G S29GL512S11TFIV2 MX29GL512GHXFI-10G S29GL512S10FHI01 MX29GL512GLXFI-10G S29GL512S10FHI02 MX29GL512GUXFI-11G S29GL512S11FHIV1 MX29GL512GDXFI-11G S29GL512S11FHIV2 MX68GL1G0GHT2I-10G S29GL01GS10TFI01 MX68GL1G0GLT2I-10G S29GL01GS10TFI02 MX68GL1G0GUT2I-11G S29GL01GS11TFIV1 MX68GL1G0GDT2I-11G S29GL01GS11TFIV2 MX68GL1G0GHXFI-10G S29GL01GS10FHI01 MX68GL1G0GLXFI-10G S29GL01GS10FHI02 Note: MX68GL1G0G is a 2-die solution and is included in the MX29GL-G family referenced in this document. P/N: AN0240 8 REV. 2, MAY. 30, 2014 APPLICATION NOTE 10.Summary The MX29GL-G is command compatible with the S29GL-S. Additionally, the package options of the S29GL-S are also supported by the MX29GL-G with similar footprints and pin-out definitions. The 56-TSOP and 64-LFBGA packages of the MX29GL-G and S29GL-S are pin compatible. 11.References "Table 11-1: Datasheet Version" shows the datasheet versions used for comparison in this application note. For the most current, detailed Macronix specification, please refer to the Macronix Website at http://www. macronix.com. Table 11-1: Datasheet Version Datasheet Date Issued Version MX29GL512G-MX68GL1G0G May. 29, 2014 1.0 S29GL-S Oct. 09, 2013 08 12.Revision History Table 12-1: Application Note Revision Revision No. REV. 1 REV. 2 Description Initial Release Revised "Table 1-1: Key Feature Comparison", "2. Package", "Table 4-1: DC Characteristics", "Table 4-3: Timing", "Table 5-1: Erase and Programming Performance", "Table 8-1: CFI Table Comparison", "Table 9-1: Part Number Cross-Reference", "Table 11-1: Page Date ALL JUL. 05, 2013 1, 4-9 MAY. 30, 2014 Datasheet Version" P/N: AN0240 9 REV. 2, MAY. 30, 2014 APPLICATION NOTE Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2013~2014. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Audio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only. For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice. P/N: AN0240 10 REV. 2, MAY. 30, 2014