RENESAS RD3CYD08CME

RD3CYD08
IGBT Driver
REJ03D0179-0600
Rev.6.00
Apr 22, 2008
Description
The RD3CYD08 has two–input AND gate in a 5 pin package. This product is suited as IGBT Driver IC for the strobe.
Features
•
•
•
•
Supplied on emboss taping for high-speed automatic mounting.
Supply voltage range : 2.0 to 3.6 V
Operating temperature range : –40 to +85°C
High drive current
IOH short = –130 mA (typ) (@VCC = 3.3 V)
• Low sink current
IOL short = 45 mA (typ) (@VCC = 3.3 V)
• Ordering Information
Package Type
Package Code
(Previous Code)
Package
Abbreviation
RD3CYD08CME
CMPAK-5 pin
PTSP0005ZC–A
(CMPAK-5V)
CM
E (3,000 pcs/reel)
RD3CYD08VSE
VSON-5pin
PUSN0005KA–A
(TNP-5DV)
VS
E (3,000 pcs/reel)
Part Name
Taping Abbreviation
(Quantity)
Outline and Article Indication
• RD3CYD08
Index band
Marking
D
CMPAK–5
REJ03D0179-0600 Rev.6.00 Apr 22, 2008
Page 1 of 7
3
= Control code
RD3CYD08
Outline and Article Indication
• RD3CYD08
Marking
D
3
= Control code
VSON-5
Pin Arrangement
IN B
1
IN A
2
GND
3
5
VCC
4
OUT Y
(Top view)
Logic Diagram
A
B
Y
Function Table
Inputs
A
L
H
L
H
H : High level
L : Low level
REJ03D0179-0600 Rev.6.00 Apr 22, 2008
Page 2 of 7
B
L
L
H
H
Output Y
L
L
L
H
RD3CYD08
Block Diagram
A input
Y output
Internal circuit
B input
Absolute Maximum Ratings
Item
Supply voltage range
Symbol
VCC
Ratings
–0.5 to 4.6
Unit
V
Input voltage range *1
Output voltage range *1, 2
Input clamp current
Output clamp current
VI
VO
IIK
IOK
V
V
mA
mA
Continuous output current
IO
–0.5 to VCC + 0.5
–0.5 to VCC + 0.5
±50
±50
–200
100
Continuous current through
VCC or GND
Maximum power dissipation
3
at Ta = 25°C (in still air) *
Storage temperature
Notes:
mA
ICC or IGND
±200
mA
PT
200
mW
Tstg
–65 to 150
°C
Test Conditions
VI < 0 or VI > VCC
VO < 0 or VO > VCC
VO = 0
VO = VCC
The absolute maximum ratings are values, which must not individually be exceeded, and furthermore no two
of which may be realized at the same time.
1. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are
observed. When Over shoot / Under shoot pulse width is under 10 ns, input and output voltage permit to
–1.5 V or VCC+1.5V.
2. This value is limited to 4.6 V maximum.
3. The maximum package power dissipation was calculated using a junction temperature of 150°C.
Recommended Operating Conditions
Item
Supply voltage range
Input voltage range
Output voltage range
Operating free-air temperature
Note:
Symbol
VCC
VI
VO
Ta
Min
2.0
0
0
–40
Unused or floating inputs must be held high or low.
REJ03D0179-0600 Rev.6.00 Apr 22, 2008
Page 3 of 7
Max
3.6
VCC
VCC
85
Unit
V
V
V
°C
Conditions
RD3CYD08
Electrical Characteristic
Ta = –40 to 85°C
Item
Symbol
VCC (V)
2.5
3.0 to 3.6
2.5
3.0 to 3.6
2.5
3.3
2.5
3.3
2.5
3.3
3.6
VIH
Input voltage
VIL
VH
IOH short
Output current
IOL short
Input current
Quiescent
supply current
Input capacitance
IIN
Min
1.7
2.0
—
—
—
—
–55
–100
20
30
—
Typ
—
—
—
—
0.35
0.40
–75
–130
30
45
—
Max
—
—
0.7
0.8
—
—
–95
–160
40
60
±5
Unit
Test condition
V
VO = 0 V
mA
VO = VCC
µA
VIN = 3.6 V or GND
VIN = VCC or GND,
IO = 0
VIN = VCC or GND
ICC
3.6
—
—
10
µA
CIN
3.3
—
2.5
—
pF
Switching Characteristics
VCC = 2.5 V
Item
Propagation delay time
Output rise time
Output fall time
Symbol
td(ON)
td(OFF)
tr
tf
Ta = –40 to 85°C
Min
Typ
Max
—
—
65
—
—
200
—
—
700
—
—
2000
Unit
ns
Test
Conditions
FROM
(Input)
TO
(Output)
CL = 6500 pF
A or B
Y
Test
Conditions
FROM
(Input)
TO
(Output)
CL = 6500 pF
A or B
Y
VCC = 3.3 ± 0.3 V
Item
Propagation delay time
Output rise time
Output fall time
Symbol
td(ON)
td(OFF)
tr
tf
REJ03D0179-0600 Rev.6.00 Apr 22, 2008
Page 4 of 7
Ta = –40 to 85°C
Min
Typ
Max
—
—
50
—
—
160
—
—
500
—
—
1500
Unit
ns
RD3CYD08
Test Circuit
VCC
Pulse
Generator
Input
Output
Z out = 50 Ω
CL = 6500 pF
Note: CL includes probe and jig capacitance.
Waveforms
VIH
Input
50%
50%
GND
tr
t d(ON)
t d(OFF)
90%
tf
VOH
90%
Output
10%
Note: Input waveform : duty cycle 50%
REJ03D0179-0600 Rev.6.00 Apr 22, 2008
Page 5 of 7
10%
VOL
RD3CYD08
Application Note (Strobe circuit)
Luminescence Circuit
Trigger
trance
Xenon tube
IGBT Driver
Control IC
IGBT
Combination example
SYSTEM IGBT
3.3 V
5.0 V
IGBT Driver
Control IC
RJP4002ANS
RD3CYD08
RJP4002ASA
RD3CYDT08
RJP4003ANS
RD5CYD08
5.0 V signal
RJP4003ASA
RD5CYDT08
3.3 V signal
3.3 V signal
IGBT Driver Lineup
TYPE No.
Specification
Package
RD3CYD08
VCC = 2.0 to 3.6V CMOS lever input
IOH(short) = -130mA(typ) @ VCC = 3.3V
IOL(short) = 45mA(typ) @ VCC = 3.3V
CMPAK-5
VSON-5
RD3CYDT08
VCC = 2.0 to 3.6V CMOS lever input
IOH(short) = -130mA(typ) @ VCC = 3.3V
IOL(short) = 45mA(typ) @ VCC = 3.3V
CMPAK-5
RD5CYD08
VCC = 4.0 to 6.0V CMOS lever input
IOH(short) = -130mA(typ) @ VCC = 5.0V
IOL(short) = 40mA(typ) @ VCC = 5.0V
RD5CYDT08
VCC = 4.0 to 6.0V TTL lever input
IOH(short) = -130mA(typ) @ VCC = 5.0V
IOL(short) = 40mA(typ) @ VCC = 5.0V
CMPAK-5
IGBT Lineup
TYPE No.
Specification
Package
RJP4002ANS
VCES = 400V(max), ICP = 150A(max), 2.5V drive
VSON-8
RJP4002ASA
VCES = 400V(max), ICP = 150A(max), 2.5V drive
TSSOP-8
RJP4003ANS
VCES = 400V(max), ICP = 150A(max), 4V drive
VSON-8
RJP4003ASA
VCES = 400V(max), ICP = 150A(max), 4V drive
TSSOP-8
REJ03D0179-0600 Rev.6.00 Apr 22, 2008
Page 6 of 7
RD3CYD08
Package Dimensions
JEITA Package Code
RENESAS Code
SC-88A
Previous Code
PTSP0005ZC-A
MASS[Typ.]
CMPAK-5 / CMPAK-5V
D
0.006g
A
e
Q
c
E
HE
LP
L
A
A
x M
L1
S
Reference
Symbol
A3
b
A
A
A1
A2
A3
b
b1
c
c1
D
E
e
e
A2
A
A1
y S
S
e1
HE
L
L1
LP
x
y
b
b1
l1
c1
c
b2
A-A Section
JEITA Package Code
P-USON5-1.2x1.6-0.50
Pattern of terminal position areas
RENESAS Code
PUSN0005KA-A
Previous Code
TNP-5D/TNP-5DV
Dimension in Millimeters
Min
0.8
0
0.8
0.15
0.1
1.8
1.15
1.8
0.3
0.1
0.2
Nom
0.9
0.25
0.22
0.2
0.13
0.11
2.0
1.25
0.65
2.1
b2
e1
1.5
l1
Q
0.25
Max
1.1
0.1
1.0
0.3
0.15
2.2
1.35
2.4
0.7
0.5
0.6
0.05
0.05
0.35
0.9
MASS[Typ.]
0.002g
D
L1
1.0 ±0.1
4
( 0.1 )
HE
E
( 0.1 )
5
1
3
A
c
e
b
REJ03D0179-0600 Rev.6.00 Apr 22, 2008
Page 7 of 7
Reference Dimension in Millimeters
Symbol
D
E
A
A1
A2
b
b1
e
Lp
x
y
ZD
c
c1
HE
L1
Min Nom Max
1.55 1.6 1.65
1.1 1.2 1.3
0.6
0.15
0.2
0.3
0.5
0.07 0.12 0.22
1.55
1.6
0.2
1.65
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Notes:
1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes
warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property
rights or any other rights of Renesas or any third party with respect to the information in this document.
2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including,
but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples.
3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass
destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws
and regulations, and procedures required by such laws and regulations.
4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this
document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document,
please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be
disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com )
5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a
result of errors or omissions in the information included in this document.
6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability
of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular
application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products.
7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications
or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality
and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or
undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall
have no liability for damages arising out of the uses set forth above.
8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:
(1) artificial life support devices or systems
(2) surgical implantations
(3) healthcare intervention (e.g., excision, administration of medication, etc.)
(4) any other purposes that pose a direct threat to human life
Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing
applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all
damages arising out of such applications.
9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range,
movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages
arising out of the use of Renesas products beyond such specified ranges.
10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain
rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage
caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and
malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software
alone is very difficult, please evaluate the safety of the final products or system manufactured by you.
11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as
swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products.
Renesas shall have no liability for damages arising out of such detachment.
12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas.
13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have
any other inquiries.
http://www.renesas.com
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology (Shanghai) Co., Ltd.
Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120
Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7858/7898
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2377-3473
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 3518-3399
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
Renesas Technology Malaysia Sdn. Bhd
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
© 2008. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .7.2