Ultra high Q/ low ESR Multilayer Ceramic Chip Capacitors MERITEK

Ultra high Q/ low ESR Multilayer
Ceramic Chip Capacitors
UQ Series
MERITEK
RoHS
FEATURES
x High Q and low ESR performance at high frequency
x Ultra low capacitance to 0.1pF
x Can offer high precision tolerance to ±0.05pF
APPLICATIONS
x Telecommunication products & equipments: mobile phone,
x
x
WLAN and base station
RF module: power amplifier, VCO
Tuners
DESCRIPTION
MLCC consists of a conducting material and electrodes.
To manufacture a chip-type SMT and achieve
miniaturization, high density and high efficiency, ceramic
condensers are used.
MERITEK UQ series MLCC is used at high frequencies
generally have a small temperature coefficient of
capacitance, typical within the ±30ppm/ºC required for
NPO (COG) classification and have excellent
conductivity internal electrode. Thus, MERITEK UQ
series MLCC will be with the feature of low ESR and high
Q characteristics
PART NUMBER SYSTEM
UQ 05 N 104 J 101 C 7
Meritek Series
Dimension
Code
Size
01
0201
Packaging
Code
02
0402
03
0603
05
0805
Dielectric
Code
N
NPO(COG)
Code
pF
nF
uF
8R2
8.2
---
101
100
0.1
--
223
22000
22
0.022
104
100000
100
0.1
D
13" reeled
Termination - C: Cu/Ni/Sn
Rated Voltage: 2 significant digits + number of zeros
Code
Capacitance (unit: pF)
First 2 digits are significant 3rd digit is multiplier.
"R" indicates decimal for values below 10pF
7
7" reeled
6R3
6.3VDC
101
100VDC
100
10VDC
251
250VDC
250
25VDC
501
500VDC
500
50VDC
Capacitance Tolerance
Code
A
B
C
Tolerance
±0.05pF
±0.1pF
±0.25pF
Code
D
F
Tolerance
±0.5pF
±1%
Code
G
J
GENERAL INFORMATION
Item
Characteristic
Dielectric
NPO
Size
0201, 0402, 0603, 0805
Capacitance range*
0201: 0.1pF~33pF, 0402: 0.1pF~22pF, 0603: 0.3pF~47pF, 0805: 0.3pF~100pF
Capacitance tolerance
Cap≤5pF: A(±0.05pF), B(±0.1pF),C(±0.25pF)
5pF<Cap<10pF: B(±0.1pF), C(±0.25pF), D(±0.5pF)
Cap≥10pF: F(±1%), G(±2%), J(±5%)
Rated voltage (WVDC)
6.3V, 10V, 25V, 50V, 100V, 250V, 500V
Q*
Cap≥30pF, Q≥1000, Cap<30pF, Q≥400+20C
Insulation resistance at Ur
≥10GΩ
Operating temperature
-55qC to +125qC
Capacitance characteristic
±30ppm/ºC; 0201: Cap≥22pF, ±60ppm/ºC
Termination
Ni/Sn (lead-free termination)
*Measured at the conditions of 25ºC ambient temperature and 30%~70%, related humidity
Apply 1.0±0.2Vrms,1.0MHz±10% for Cap≤1000pF and 1.0±0.2Vrms, 1.0kHz±10% for Cap>1000pF
Tolerance
±2%
±5%
Ultra high Q/ low ESR Multilayer
Ceramic Chip Capacitors
UQ Series
MERITEK
RoHS
CONSTRUCTIONS
No.
1
2
3
4
5
Name
Ceramic material
Inner electrode
Inner layer
Termination
Middle layer
Outer layer
Material
BaTiO3 based
Cu
Cu
Ni
Sn(Matt)
DIMENSIONS (mm)
Size inch (mm)
BL
BW
BT/symbol
#0201(0603) 0.60±0.03 0.30±0.03 0.30±0.03 L
E1/E2
0.15±0.05
#0402(1005) 1.00±0.05 0.50±0.05 0.50±0.05
0603(1608)
1.60±0.10 0.80±0.10 0.80±0.07
0805(2012)
2.00±0.20 1.25±0.20 0.85±0.10
# reflow soldering only is recommended
0.25+0.05
-0.10
0.4±0.15
0.5±0.20
N
S
T
DIMENSIONS&CAPACITANCE
Dimension
Rated Voltage
0201
VDC
10
25
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
0402
VDC
50
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
0603
VDC
100
6.3
50
25
100
50
250
Capacitance(pF)
0.1
L
L
N
N
0.2
L
L
N
N
0.3
L
L
N
N
S
S
S
0.4
L
L
N
N
S
S
S
0.5
L
L
N
N
S
S
S
0.6
L
L
N
N
S
S
S
0.7
L
L
N
N
S
S
S
0.8
L
L
N
N
S
S
S
0.9
L
L
N
N
S
S
S
1.0
L
L
N
N
S
S
S
1.2
L
L
N
N
S
S
S
1.5
L
L
N
N
S
S
S
1.8
L
L
N
N
S
S
S
2.2
L
L
N
N
S
S
S
2.7
L
L
N
N
S
S
S
3.3
L
L
N
N
S
S
S
3.9
L
L
N
N
S
S
S
4.7
L
L
N
N
S
S
S
5.6
L
L
N
N
S
S
S
6.8
L
L
N
N
S
S
S
8.2
L
L
N
N
S
S
S
10
L
L
N
N
S
S
S
11
L
L
N
N
S
S
S
12
L
L
N
N
S
S
S
13
L
L
N
N
S
S
S
15
L
L
N
N
S
S
S
16
L
L
N
N
S
S
S
18
L
L
N
N
S
S
S
20
L
L
N
N
S
S
S
22
L
N
N
S
S
S
24
L
N
N
S
S
S
27
L
N
N
S
S
S
30
L
N
N
S
S
S
33
L
N
N
S
S
S
36
N
N
S
S
S
39
N
N
S
S
S
43
N
N
S
S
S
47
N
N
S
S
S
56
N
N
68
N
82
N
100
N
1. The letter in cell is expressed the symbol of product thickness.
2. For more information about products with special capacitance or other data, please contact
50
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
0805
VDC
100 250
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
MERITEK
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
500
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
Tolerance
B
A,B
A,B
A,B
A,B,C
A,B,C
A,B,C
A,B,C
A,B,C
A,B,C
A,B,C
A,B,C
A,B,C
A,B,C
A,B,C
A,B,C
A,B,C
A,B,C
B,C,D
B,C,D
B,C,D
F,G,J
F,G,J
F,G,J
F,G,J
F,G,J
F,G,J
F,G,J
F,G,J
F,G,J
F,G,J
F,G,J
F,G,J
F,G,J
F,G,J
F,G,J
F,G,J
F,G,J
F,G,J
F,G,J
F,G,J
F,G,J
UQ Series
Ultra high Q/ low ESR Multilayer
Ceramic Chip Capacitors
RoHS
CHARACTERISTICS CURVES
UQ0402, NP0, 50V
1
1pF
1.5pF
ESR ()
3.3pF
0.1
6.8pF
0.01
100
1,000
10,000
Frequency (MHz)
Fig. 2 ESR vs. Frequency
UQ0402, NP0, 50V
10000
1000
Q
1pF
100
1.5pF
6.8pF
10
1
100
1,000
10,000
Frequency (MHz)
Fig. 3 Q vs. Frequency
UQ0402, NP0, 50V
100000
IZI ()
10000
1000
1pF
100
1.5pF
3.3pF
10
6.8pF
1
1
10
100
Frequency (MHz)
Fig. 4 Impedance vs. Frequency
1,000
10,000
MERITEK
UQ Series
Ultra high Q/ low ESR Multilayer
Ceramic Chip Capacitors
MERITEK
RoHS
UQ0402, NP0, 50V
UQ0201, NP0, 25V
25
Measured data (<8.5GHz)
Simulation data
25
20
15
10
5
Self resonance frequency (GHz)
Self resonance frequency (GHz)
30
Measured data (<8.5GHz)
Simulation data
20
15
10
5
0
0
0.1
1
10
100
0.1
1
Capacitance (pF)
10
100
Capacitance (pF)
Fig. 5 Self resonance frequency vs. Capacitance (0201 size)
Fig. 6 Self resonance frequency vs. Capacitance (0402 size)
UQ0201, N P0, 25 V C om parison
U Q 0 4 0 2 , N P 0, 50 V C om p a riso n
0
0
0.5pF
0.5pF
- 20
-40
1 pF
-60
S11 (dB)
S11 (dB)
-20
2 pF
- 40
- 60
1 pF
2p F
- 80
-80
-1 00
-100
0.1
1
0.1
10
1
Fig. 7
S11 vs. frequency. (0201 size)
Fig. 8
S11 vs. frequency. (0402 size)
U Q 0 4 0 2, N P0, 50V C om parison
U Q 0 2 0 1 , N P 0, 25 V C om p a riso n
0
0
2 pF
2 pF
1 pF
-20
1p F
-20
0.5p F
0 .5pF
-40
S21 (dB)
S21 (dB)
10
Fre quenc y (G H z)
Frequen cy (G H z )
-60
-80
-40
-60
-80
-100
-100
0 .1
1
10
0.1
1
F re qu e n cy (G H z )
Fig. 9
S21 vs. frequency. (0201 size)
F re qu e n cy (G H z )
Fig. 10
S21 vs. frequency. (0402 size)
10
Ultra high Q/ low ESR Multilayer
Ceramic Chip Capacitors
UQ Series
MERITEK
RoHS
RELIABILITY
Item
Visual and Mechanical
Conditions
Requirements
No remarkable defect
Dimensions to confirm to individual
specification sheet
Capacitance &
1.0±0.2Vrms, 1MHz±10%, @ 25ºC ambient temperature Shall not exceed the limits given in the
Q/D.F. (dissipation factor)
detailed specification.
Cap≥30pF: Q≥1000,
Cap<30pF: Q≥400+20C.
ESR
ESR should be measured at room temperature and
tested at frequency 1.0±0.1GHz.
0201,0402
0603
--
0.5pF≤Cap≤1pF:<350mΩ 0.3pF≤Cap≤1pF:<1500mΩ
1pF<Cap≤5pF:<300mΩ 1pF<Cap≤10pF:<250mΩ
5pF<Cap≤22pF:<250mΩ 10pF<Cap≤47pF:<200mΩ
Dielectric strength
Insulation resistance
Temperature coefficient
Adhesive strength of
termination
Vibration resistance
Solderability
Bending test
Resistance to soldering
heat
Temperature cycle
Humidity (damp heat)
steady state
Humidity (damp heat)
load
To apply voltage UR≤100V, ≥250% of rated voltage
UR=250V, ≥200% of rated voltage
Duration: 1 to 5 seconds
Charge and discharge current less than 50mA
To apply rated voltage for 120seconds (max.)
No evidence of damage or flash over
during test
With no electrical load
Operating temperature: -55ºC~+125ºC at 25ºC
Pressurizing force 0201:2N
0402&0603:5N
>0603:10N
Test time: 10.0±1.0seconds
Vibration frequency: 10~55Hz/minute
Total amplitude: 1.5mm
Duration : 6 hours ( two hours each in three mutually
perpendicular directions)
Solder temperature: 235±5ºC
Dipping time: 2.0±0.5seconds
The middle part of substrate shall be pressurized by
means of the pressurizing rod at a rate of about 1 mm
per second until the deflection becomes 1mm and then
the pressure shall be maintained for 5.0±1.0seconds.
Measurement to be made after keeping at room
temperature for 24±2 hours.
Capacitance change: within ±30ppm/ºC
Solder temperature: 270±5ºC
Dipping time: 10±1.0seconds
Preheating: 120ºC~150ºC for 1 minute before immerse
the capacitor in a eutectic solder.
Measurement to be made after keeping at room
temperature for 24±2hours.
Conduct the five cycles according to the temperatures
and duration
Step
Temperature(ºC)
Duration (minute)
1 mini operating temp +0/-3
30±3
2 room temperature
2~3
3 max operating temp +3/-0
30±3
4 room temperature
2~3
Measurement to be made after keeping at room
temperature for 24±2hours
Test temperature: 40ºC±2ºC
Humidity: 90~95% R.H.
+24
Test time: 500 -0 hours
Measurement to be made after keeping at room
temperature for 24±2hours
Test temperature: 40ºC±2ºC
Humidity: 90~95% R.H.
+24
Test time: 500 -0 hours
≥10GΩ
No remarkable damage or removal of the
terminations
No remarkable damage
Cap change and Q/D.F.: to meet initial
specification.
95% min. coverage of all metalized area
No remarkable damage
Cap change within ±5.0% or ±0.5pF
whichever is larger.
(This capacitance change means the
change of capacitance under specified
flexure of substrate from the capacitance
measured before the test)
No remarkable damage
Cap change within ±2.5% or ±0.25pF
whichever is larger.
Q/D.F., I.R. and dielectric strength, to meet
initial requirements.
25% max. leaching on each edge
No remarkable damage
Cap change within ±2.5% or ±0.25pF
whichever is larger.
Q/D.F., I.R. and dielectric strength, to meet
initial requirements.
No remarkable damage
Cap change within ±5.0% or ±0.5pF
whichever is larger.
Q/D.F.value: Cap≥30pF: Q≥350
10pF≤Cap<30pF: Q≥275+2.5C
Cap<10pF: Q≥200+10C
IR≥1GΩ
No remarkable damage
Cap change within ±7.5% or ±0.75pF
whichever is larger.
Q/D.F.value: Cap≥30pF: Q≥200
Ultra high Q/ low ESR Multilayer
Ceramic Chip Capacitors
UQ Series
MERITEK
RoHS
High temperature load
(endurance)
Apply voltage: rated voltage
Measurement to be made after keeping at room
temperature for 24±2hours
Test temperature: 125ºC±3ºC
Apply voltage: 200% of rated voltage
+24
Test time: 1000 -0 hours
Measurement to be made after keeping at room
temperature for 24±2hours
Cap<30pF: Q≥100+10/3C
IR≥500MΩ
No remarkable damage
Cap change within ±3.0% or ±0.3pF
whichever is larger.
Q/D.F.value: Cap≥30pF: Q≥350
10pF≤Cap<30pF: Q≥275+2.5C
Cap<10pF: Q≥200+10C
IR≥1GΩ
PACKAGING
Dim
0201
0402
CL
0.37±0.03 0.62±0.05
CW
0.67±0.03 1.12±0.05
TT
0.42±0.03 0.60±0.05
TW
8.00±0.10 8.00±0.10
HP
4.00±0.10 4.00±0.10
HPx10 40.0±0.10 40.0±0.10
HC2
2.00±0.05 2.00±0.05
HC1
2.00±0.05 2.00±0.05
HD
1.55±0.05 1.55±0.05
HE
1.75±0.05 1.75±0.05
HCD
3.50±0.05 3.50±0.05
All Dimension in millimeters
For paper tape.
Reel Size
ΦC
RW
RD
ΦN
7"
13.0+0.5
-0.2
8.4+1.5
-0
178.0±1.0
60.0+1.0
-0
0603
1.00+0.05
-0.1
1.80±0.10
0.95±0.05
8.00±0.10
4.00±0.10
40.0±0.20
4.00±0.10
2.00±0.05
1.55±0.05
1.75±0.05
3.50±0.05
0805
1.50±0.10
2.30±0.10
0.95±0.05
8.00±0.10
4.00±0.10
40.0±0.20
4.00±0.10
2.00±0.05
1.55±0.05
1.75±0.05
3.50±0.05
13"
13.0+0.5
-0.2
8.4+1.5
-0
330.0±1.0
100±1.0
All Dimension in millimeters
PACKAGING&QUANTITY
Size
0201(0603)
0402(1005)
0603(1608)
0805(2012)
Thickmess(mm) /symbol
0.30±0.03
L
0.50±0.05
N
0.80±0.07
S
0.85±0.10
T
Paper tape
7" reel
13" reel
15kpcs
70kpcs
10kpcs
50kpcs
4kpcs
10kpcs
4kpcs
15kpcs
STORAGE
1. To store products at +5ºC~+40ºC ambient temperature and 20% to 70% related humidity conditions.
2. The product is recommended to be used within one year after shipment.Check solderability in case of shelf life extension is needed.
Cautions:
a. Don't store products in a corrosive environment such as sulfide, chloride gas or acid. It may cause oxidization of electrode,
which easily be resulted in poor soldering
b. To store products on the shelf and avoid exposure to moisture.
c. Don't expose products to excessive shock, vibration, direct sunlight and so on.
Ultra high Q/ low ESR Multilayer
Ceramic Chip Capacitors
UQ Series
MERITEK
RoHS
RECOMMENDED SOLDERING CONDITIONS
The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable against
lead-containing solder paste. If the optimized solder points is requested, increasing soldering time, temperature and concentration of N 2
within oven are recommended.
Fig. 9 Recommended wave soldering profile for SMT process
with SnAgCu series solder.