HQ Series

 HQ Series
Multilayer Ceramic Capacitors
(High Q)
Feature




Surface mount device with high reliability
Hi-Q and low ESR at high frequencies
Low capacitance with tight tolerance
Excellent temperature characteristics
Part Numbering System
HQ
0603
CG 4R7 B
500
Meritek Series
Chip Size: 0402 / 0603 / 0805
Dielectric: CG=C0G (NPO)
Capacitance
Capacitance expressed in Pico farads (pF).
First two digits are significant figures.
Third digit denotes number of zeros.
'R' denotes decimal point for values less than 10 pF
ie. 4R7=4.2pF, 101=100pF
Tolerance
Code
Value
B
±0.1pF
C
±0.25pF
D
±0.5pF
F
±1%
F
±2%
J
±5%
Rated Voltage
Code
Value
160
16VDC
250
25VDC
500
101
201
251
501
631
50VDC 100VDC 200VDC 250VDC 500VDC 630VDC
Dimensions Size
Inch (mm)
0402
(1005)
0603
(1608)
0805
(2012)
L (mm)
W (mm)
1.00±0.05
0.50±0.05
0.50±0.05
N
1.60±0.10
0.80±0.10
0.80±0.07
S
1.60 +0.15/-0.10
0.80 +0.15/-0.10
0.80 +0.15/-0.10
X
0.60±0.10
A
0.80±0.10
B
1.25±0.10
D
2.00±0.15
T (mm)/Symbol
1.25±0.10
MB (mm)
0.25
-0.5
0.40±0.15
0.50±0.20
L
T
W
MB
MB
Fig. 1 The outline of MLCC
Constructions
No.
Name
NP0

Ceramic material
BaTiO3 based

Inner electrode
AgPd alloy
Inner layer



Termination
Ag or Cu
Middle layer
Ni
Outer layer
Sn (Matt)
Fig. 11 The construction of MLCC
Rev. 7a
HQ Series
Multilayer Ceramic Capacitors
(High Q)
Capacitance Range
Capacitance
DIELECTRIC
SIZE
0.5pF (0R5)
0.6pF (0R6)
0.7pF (0R7)
0.8pF (0R8)
0.9pF (0R9)
1.0pF (1R0)
1.2pF (1R2)
1.5pF (1R5)
1.8pF (1R8)
2.2pF (2R2)
2.7pF (2R7)
3.3pF (3R3)
3.9pF (3R9)
4.7pF (4R7)
5.6pF (5R6)
6.8pF (6R8)
8.2pF (8R2)
10pF (100)
12pF (120)
15pF (150)
18pF (180)
22pF (220)
27pF (270)
33pF (330)
39pF (390)
47pF (470)
56pF (560)
68pF (680)
82pF (820)
100pF (101)
120pF (121)
150pF (151)
180pF (181)
220pF (221)
270pF (271)
330pF (331)
390pF (391)
470pF (471)
560pF (561)
680pF (681)
820pF (821)
1,000pF (102)
1,200pF (122)
1,500pF (152)
1,800pF (182)
2,200pF (222)
2,700pF (272)
3,300pF (332)
NP0
16
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
0402
25
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
0603
50
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
16
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
X
X
X
X
X
X
25
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
X
X
X
X
X
X
50
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
X
X
X
X
X
X
1.
0402, Capacitance <0.5pF: On request.
2.
The letter in cell with “^” mark is expressed product with Ag/Ni/Sn terminations.
3.
The letter in cell is expressed the symbol of product thickness.
100
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
50
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
D
D
100
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
D
D
0805
200
250
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
D
D
D
D
D
D
D
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
D
D
D
D
D
D
D
500
630
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
D
D
D
D
D
D
D
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
D
D
D
D
D
D
D
Rev. 7a
HQ Series
Multilayer Ceramic Capacitors
(High Q)
Electrical Characteristics Fig. 2 Q factor specification vs. Specific frequency for 0402
Fig. 3 Q factor specification vs. Specific frequency for 0603
Typical ESR vs. Frequency
Fig. 4 ESR vs. Frequency 0402
Fig. 5 ESR vs. Frequency 0603 Rev. 7a
Multilayer Ceramic Capacitors
HQ Series
(High Q)
Typical Impedance vs. Frequency
Fig. 6 Impedance vs. Frequency 0402
Fig. 7 Impedance vs. Frequency 0603
SRF vs. Capacitance
Fig. 8 SRF vs. Capacitance
Reliability Test Conditions and Requirements
No.
1.
Item
Visual and
Test Conditions
---
3.
* No remarkable defect.
* Dimensions to conform to individual specification sheet.
Mechanical
2.
Requirements
Capacitance
Cap≤1000pF, 1.0±0.2Vrms, 1MHz±10%
* Shall not exceed the limits given in the detailed spec.
Q/ D.F.
Cap>1000pF, 1.0±0.2Vrms, 1KHz±10%
* NP0: Cap≥30pF, Q≥1000; Cap<30pF, Q≥400+20C
(Dissipation
At 25°C ambient temperature.
Factor)
Rev. 7a
Multilayer Ceramic Capacitors
HQ Series
(High Q)
No.
4.
Item
Test Conditions
Dielectric
* To apply voltage: 250% of rated voltage.
Strength
* Duration: 1 to 5 sec.
Requirements
* No evidence of damage or flash over during test.
* Charge and discharge current less than 50mA.
5.
Insulation
To apply rated voltage for max. 120 sec.
≥10GΩ
* Capacitance change: within ±30ppm/°C
Resistance
6.
7.
Temperature
With no electrical load.
Coefficient
Operating temperature: -55~125°C at 25°C
Adhesive
* Pressurizing force：
Strength of
8.
* No remarkable damage or removal of the terminations.
5N (≤0603) and 10N (>0603)
Termination
* Test time: 10±1 sec.
Vibration
* Vibration frequency: 10~55 Hz/min.
* No remarkable damage.
Resistance
* Total amplitude: 1.5mm
* Cap change and Q/D.F.: To meet initial spec.
* Test time: 6 hrs. (Two hours each in three mutually
perpendicular directions.)
9.
Solderability
* Solder temperature: 235±5°C
95% min. coverage of all metalized area.
* Dipping time: 2±0.5 sec.
10. Bending Test
* The middle part of substrate shall be pressurized by
* No remarkable damage.
means of the pressurizing rod at a rate of about 1 mm per
* Cap change: within ±5.0% or ±0.5pF whichever is larger.
second until the deflection becomes 1 mm and then the
(This capacitance change means the change of capacitance
pressure shall be maintained for 5±1 sec.
under specified flexure of substrate from the capacitance
* Measurement to be made after keeping at room temp for
measured before the test.)
24±2 hrs.
11. Resistance to * Solder temperature: 270±5°C
* No remarkable damage.
Soldering
* Dipping time: 10±1 sec
Heat
* Preheating: 120 to 150°C for 1 minute before immerse the * Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* Cap change: within ±2.5% or ±0.25pF whichever is larger.
capacitor in a eutectic solder.
* 25% max leaching on each edge.
* Measurement to be made after keeping at room temp for
24±2 hrs. (Class I) or 48±4 hrs. (Class II).
12. Temperature
Cycle
* Conduct the five cycles according to the temperatures and * No remarkable damage.
time.
Step
1
2
3
4
* Cap change：within ±2.5％ or ±0.25pF whichever is larger.
Temp. (°C)
Min. operating temp. +0/-3
Room temp.
Max operating temp. +3/-0
Room temp.
Time (min.)
30±3
2~3
30±3
2~3
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* Measurement to be made after keeping at room temp for
24±2 hrs.
* Test temp.: 40±2°C
* No remarkable damage.
(Damp Heat)
* Humidity: 90~95% RH
* Cap change: within ±5.0% or ±0.5pF whichever is larger.
Steady State
* Test time: 500+24/-0hrs.
* Q/D.F. value:
13. Humidity
* Measurement to be made after keeping at room temp for
24±2 hrs.
NP0: Cap≥30pF, Q≥350; 10pF≤Cap<30pF, Q≥275+2.5C
Cap<10pF; Q≥200+10C
* I.R.: ≥1GΩ.
* Test temp.: 40±2°C
* No remarkable damage.
(Damp Heat)
* Humidity: 90~95%RH
* Cap change: within ±7.5% or ±0.75pF whichever is larger.
Load
* Test time: 500+24/-0 hrs.
* Q/D.F. value:
14. Humidity
* To apply voltage：rated voltage
* Measurement to be made after keeping at room temp for
NP0: Cap≥30pF, Q≥200; Cap<30pF, Q≥100+10/3C
* I.R.: ≥500MΩ.
24±2 hrs.
Rev. 7a
HQ Series
Multilayer Ceramic Capacitors
(High Q)
No.
Item
Test Conditions
Requirements
* Test temp.:
15. High
Temperature
* No remarkable damage.
NP0, X7R: 125±3°C
* Cap change: within ±3.0% or ±0.3pF whichever is larger.
Load
* To apply voltage: 200% of rated voltage.
(Endurance)
* Test time: 1000+24/-0 hrs.
* Q/D.F. value:
NP0: Cap≥30pF, Q≥350
* Measurement to be made after keeping at room temp for
10pF≤Cap<30pF, Q≥275+2.5C
24±2 hrs.
Cap<10pF, Q≥200+10C
* I.R.: ≥1GΩ.
Packaging Dimension and Quality
Size
0402
0603
0805
0.50±0.05
N
0.80±0.07
S
0.80 +0.15/-0.10
0.60±0.10
0.80±0.10
1.25±0.10
X
A
B
D
7” reel
10K
13” reel
20K
4K
15K
4k
4k
15k
15k
Tape & Reel Dimensions
Size
Thickness
A0
Fig. 9 The dimension of paper tape
Plastic tape
Paper tape
Thickness (mm)
0402
N
0.62±0.05
7” reel
13” reel
3K
10K
0603
S,X
1.02±0.05
0805
A
1.50±0.10
B0
1.12±0.05
1.82±0.05
2.30±0.10
T
K0
W
0.60±0.05
8.00±0.10
0.95±0.05
8.00±0.10
0.75±0.05
8.00±0.10
P0
4.00±0.10
4.00±0.10
4.00±0.10
10xP0
P1
P2
40.0±0.10
2.00±0.05
2.00±0.05
40.0±0.10
4.00±0.10
2.00±0.05
40.0±0.10
4.00±0.10
2.00±0.05
D0
1.55±0.05
1.55±0.05
1.55±0.05
D1
-
-
-
E
1.75±0.05
1.75±0.05
1.75±0.05
F
3.50±0.05
3.50±0.05
3.50±0.05
Size
0402, 0603,0805
Reel size
7”
13”
C
13.0+0.5/-0.2
13.0+0.5/-0.2
W1
8.4+1.5/-0
8.4+1.5/-0
A
178.0±0.10
330.0±1.0
N
60.0+1.0/-0
100±1.0
Fig. 10 The dimension of reel
Rev. 7a
Multilayer Ceramic Capacitors
HQ Series
(High Q)
Storage and handling conditions
(1) To store products at 5 to 40C ambient temperature and 20 to 70% related humidity conditions.
(2) The product is recommended to be used within one year after shipment. Check solder ability in case of shelf life extension is
needed.
Cautions:
a. Don’t store products in a corrosive environment such as sulfide, chloride gas, or acid. It may cause oxidization of electrode,
which easily be resulted in poor soldering.
b. To store products on the shelf and avoid exposure to moisture.
c. Don’t expose products to excessive shock, vibration, direct sunlight and so on.
Recommended soldering conditions
The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable against
lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and concentration of N2
within oven are recommended.
Fig. 12 Recommended IR reflow soldering profile for SMT process with SnAgCu series solder paste.
Rev. 7a
Multilayer Ceramic Capacitors
HQ Series
(High Q)
Fig. 13 Recommended wave soldering profile for SMT process with SnAgCu series solder.
Rev. 7a