IRF7389PbF-1 VDS RDS(on) max (@VGS = 10V) Q g (typical) ID (@TA = 25°C) HEXFET® Power MOSFET N-CH 30 P-CH -30 V 0.029 0.058 Ω 22 23 nC 7.3 -5.3 A S1 N-CHANNEL MOSFET 1 8 D1 G1 2 7 D1 S2 3 6 D2 4 5 D2 G2 SO-8 P-CHANNEL MOSFET Top View Features Industry-standard pinout SO-8 Package Compatible with Existing Surface Mount Techniques RoHS Compliant, Halogen-Free MSL1, Industrial qualification Base Part Number Package Type IRF7389PbF-1 SO-8 ⇒ Standard Pack Form Quantity Tube/Bulk 95 Tape and Reel 4000 Absolute Maximum Ratings ( TA = 25°C Unless Otherwise Noted) Symbol Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Benefits Multi-Vendor Compatibility Easier Manufacturing Environmentally Friendlier Increased Reliability TA = 25°C TA = 70°C Pulsed Drain Current Continuous Source Current (Diode Conduction) TA = 25°C Maximum Power Dissipation TA = 70°C Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Junction and Storage Temperature Range V DS VGS ID IDM IS IRF7389PbF-1 IRF7389TRPbF-1 Maximum P-Channel N-Channel 30 -30 ± 20 7.3 5.9 30 2.5 -5.3 -4.2 -30 -2.5 2.5 1.6 PD EAS IAR EAR dv/dt TJ, TSTG Orderable Part Number 82 4.0 Units V A W 140 -2.8 0.20 mJ A mJ V/ ns 3.8 -2.2 -55 to + 150 °C Symbol Limit Units RθJA 50 °C/W Thermal Resistance Ratings Parameter Maximum Junction-to-Ambient 1 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback May 15, 2014 IRF7389PbF-1 Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter V (BR)DSS Drain-to-Source Breakdown Voltage ΔV(BR)DSS/ΔTJ Breakdown Voltage Temp. Coefficient RDS(ON) Static Drain-to-Source On-Resistance V GS(th) Gate Threshold Voltage gfs Forward Transconductance I DSS Drain-to-Source Leakage Current I GSS Gate-to-Source Forward Leakage Qg Total Gate Charge Qgs Gate-to-Source Charge Qgd Gate-to-Drain ("Miller") Charge td(on) Turn-On Delay Time tr Rise Time td(off) Turn-Off Delay Time tf Fall Time Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance Min. 30 -30 1.0 -1.0 N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-P N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch Typ. Max. 0.022 0.022 0.023 0.029 0.032 0.046 0.042 0.058 0.076 0.098 14 7.7 1.0 -1.0 25 -25 ±100 22 33 23 34 2.6 3.9 3.8 5.7 6.4 9.6 5.9 8.9 8.1 12 13 19 8.9 13 13 20 26 39 34 51 17 26 32 48 650 710 320 380 130 180 Units V V/°C Ω V S µA nA nC ns pF Conditions VGS = 0V, ID = 250µA VGS = 0V, ID = -250µA Reference to 25°C, ID = 1mA Reference to 25°C, ID = -1mA VGS = 10V, ID = 5.8A VGS = 4.5V, ID = 4.7A VGS = -10V, ID = -4.9A VGS = -4.5V, ID = -3.6A VDS = VGS, I D = 250µA VDS = VGS, I D = -250µA VDS = 15V, I D = 5.8A VDS = -15V, I D = -4.9A VDS = 24V, V GS = 0V VDS = -24V, VGS = 0V VDS = 24V, VGS = 0V, T J = 55°C VDS = -24V, V GS = 0V, TJ = 55°C VGS = ±20V N-Channel I D = 5.8A, VDS = 15V, VGS = 10V P-Channel I D = -4.9A, V DS = -15V, VGS = -10V N-Channel VDD = 15V, ID = 1.0A, RG = 6.0Ω, RD = 15Ω P-Channel VDD = -15V, ID = -1.0A, RG = 6.0Ω, RD = 15Ω N-Channel V GS = 0V, V DS = 25V, = 1.0MHz P-Channel V GS = 0V, V DS = -25V, = 1.0MHz Source-Drain Ratings and Characteristics Parameter IS Continuous Source Current (Body Diode) ISM Pulsed Source Current (Body Diode) VSD Diode Forward Voltage trr Reverse Recovery Time Qrr Reverse Recovery Charge N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch Min. Typ. Max. Units Conditions 2.5 -2.5 A 30 -30 0.78 1.0 TJ = 25°C, IS = 1.7A, VGS = 0V V -0.78 -1.0 TJ = 25°C, IS = -1.7A, VGS = 0V 45 68 N-Channel ns 44 66 TJ = 25°C, I F =1.7A, di/dt = 100A/µs P-Channel 58 87 nC TJ = 25°C, I F = -1.7A, di/dt = 100A/µs 42 63 Notes: Repetitive rating; pulse width limited by Pulse width ≤ 300µs; duty cycle ≤ 2%. max. junction temperature. ( See fig. 22 ) Surface mounted on FR-4 board, t ≤ 10sec. N-Channel ISD ≤ 4.0A, di/dt ≤ 74A/µs, VDD ≤ V(BR)DSS, TJ ≤ 150°C P-Channel I SD ≤ -2.8A, di/dt ≤ 150A/µs, VDD ≤ V(BR)DSS, TJ ≤ 150°C N-Channel Starting TJ = 25°C, L = 10mH RG = 25Ω, IAS = 4.0A. (See Figure 12) P-Channel Starting TJ = 25°C, L = 35mH RG = 25Ω, IAS = -2.8A. 2 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback May 15, 2014 IRF7389PbF-1 N-Channel 100 100 VGS 15V 10V 7.0V 5.5V 4.5V 4.0V 3.5V BOTTOM 3.0V VGS 15V 10V 7.0V 5.5V 4.5V 4.0V 3.5V BOTTOM 3.0V TOP I D, Drain-to-Source Current (A) I D , Drain-to-Source Current (A) TOP 10 3.0V 20μs PULSE WIDTH TJ = 25°C A 1 0.1 1 10 3.0V 20μs PULSE WIDTH TJ = 150°C A 1 10 0.1 V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 100 ISD , Reverse Drain Current (A) I D , Drain-to-Source Current (A) 10 Fig 2. Typical Output Characteristics 100 TJ = 25°C TJ = 150°C 10 VDS = 10V 20μs PULSE WIDTH 1 3.0 3.5 4.0 4.5 Fig 3. Typical Transfer Characteristics www.irf.com © 2014 International Rectifier A 5.0 VGS , Gate-to-Source Voltage (V) 3 1 VDS, Drain-to-Source Voltage (V) TJ = 150°C 10 TJ = 25°C VGS = 0V 1 0.4 0.6 0.8 1.0 1.2 1.4 VSD , Source-to-Drain Voltage (V) Fig 4. Typical Source-Drain Diode Forward Voltage Submit Datasheet Feedback A 1.6 May 15, 2014 IRF7389PbF-1 RDS(on) , Drain-to-Source On Resistance (Normalized) 2.0 RDS (on) , Drain-to-Source On Resistance (Ω) N-Channel ID = 5.8A 1.5 1.0 0.5 0.0 -60 -40 -20 VGS = 10V 0 20 40 60 80 100 120 140 160 0.040 0.032 0.028 0.024 0 0.08 0.06 I D = 5.8A 0.04 0.02 0.00 12 V GS , Gate-to-Source Voltage (V) Fig 7. Typical On-Resistance Vs. Gate Voltage 4 www.irf.com © 2014 International Rectifier 15 A E AS , Single Pulse Avalanche Energy (mJ) RDS (on) , Drain-to-Source On Resistance (Ω) 0.10 9 20 30 40 A Fig 6. Typical On-Resistance Vs. Drain Current 0.12 6 10 I D , Drain Current (A) Fig 5. Normalized On-Resistance Vs. Temperature 3 V GS = 10V 0.020 TJ , Junction Temperature ( °C) 0 V GS = 4.5V 0.036 200 TOP BOTTOM 160 ID D 1.8A 3.2A 4.0A 120 80 40 0 25 50 75 100 125 Starting T J , Junction Temperature (°C) Fig 8. Maximum Avalanche Energy Vs. Drain Current Submit Datasheet Feedback A 150 May 15, 2014 IRF7389PbF-1 N-Channel 20 V GS = 0V, f = 1MHz C iss = Cgs + C gd , Cds SHORTED C rss = C gd C oss = C ds + C gd 900 VGS , Gate-to-Source Voltage (V) C, Capacitance (pF) 1200 Ciss Coss 600 Crss 300 0 1 10 100 A ID = 5.8A VDS = 15V 16 12 8 4 0 0 10 20 30 40 QG , Total Gate Charge (nC) VDS , Drain-to-Source Voltage (V) Fig 9. Typical Capacitance Vs. Drain-to-Source Voltage Fig 10. Typical Gate Charge Vs. Gate-to-Source Voltage Thermal Response (Z thJA ) 100 D = 0.50 10 0.20 0.10 0.05 1 PDM 0.02 t1 0.01 t2 Notes: 1. Duty factor D = t 1 / t 2 2. Peak T J = P DM x Z thJA + TA SINGLE PULSE (THERMAL RESPONSE) 0.1 0.00001 0.0001 0.001 0.01 0.1 1 10 100 t1 , Rectangular Pulse Duration (sec) Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 5 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback May 15, 2014 IRF7389PbF-1 P-Channel 100 100 VGS - 15V - 10V - 7.0V - 5.5V - 4.5V - 4.0V - 3.5V BOTTOM - 3.0V VGS - 15V - 10V - 7.0V - 5.5V - 4.5V - 4.0V - 3.5V BOTTOM - 3.0V TOP -I D , Drain-to-Source Current (A) -I D , Drain-to-Source Current (A) TOP 10 -3.0V 20μs PULSE WIDTH TJ = 25°C A 1 0.1 1 10 -3.0V 20μs PULSE WIDTH TJ = 150°C A 1 0.1 10 Fig 12. Typical Output Characteristics 100 -ISD , Reverse Drain Current (A) -I D , Drain-to-Source Current (A) 10 Fig 13. Typical Output Characteristics 100 TJ = 25°C TJ = 150°C 10 V DS = -10V 20μs PULSE WIDTH 1 3.0 3.5 4.0 4.5 5.0 5.5 6.0 -VGS , Gate-to-Source Voltage (V) Fig 14. Typical Transfer Characteristics 6 1 -VDS, Drain-to-Source Voltage (V) -VDS, Drain-to-Source Voltage (V) www.irf.com © 2014 International Rectifier A TJ = 150°C 10 TJ = 25°C VGS = 0V 1 0.4 0.6 0.8 1.0 1.2 -VSD , Source-to-Drain Voltage (V) Fig 15. Typical Source-Drain Diode Forward Voltage Submit Datasheet Feedback A 1.4 May 15, 2014 IRF7389PbF-1 RDS(on) , Drain-to-Source On Resistance (Normalized) 2.0 RDS(on) , Drain-to-Source On Resistance ( Ω ) P-Channel ID = 4.9A 1.5 1.0 0.5 0.0 -60 -40 -20 VGS = 10V 0 20 40 60 0.6 0.5 0.4 0.3 0.1 0 10 20 Fig 17. Typical On-Resistance Vs. Drain Current 300 0.12 I D = -4.9A 0.04 0.00 0 3 6 9 12 15 -VGS , Gate -to-Source Voltage (V) Fig 18. Typical On-Resistance Vs. Gate Voltage www.irf.com © 2014 International Rectifier A EAS , Single Pulse Avalanche Energy (mJ) 0.16 0.08 30 -ID , Drain Current (A) Fig 16. Normalized On-Resistance Vs. Temperature RDS(on) , Drain-to-Source On Resistance ( Ω ) VGS = -10V 0.0 80 100 120 140 160 TJ , Junction Temperature ( ° C) 7 V GS = -4.5V 0.2 ID -1.3A -2.2A BOTTOM -2.8A TOP 250 200 150 100 50 0 25 50 75 100 125 Starting TJ , Junction Temperature ( °C) 150 Fig 19. Maximum Avalanche Energy Vs. Drain Current Submit Datasheet Feedback May 15, 2014 A IRF7389PbF-1 P-Channel VGS = 0V Ciss = Cgs + Cgd + Cds Crss = Cgd 1200 20 f = 1 MHz SHORTED -VGS , Gate-to-Source Voltage (V) 1400 C, Capacitance (pF) Coss = Cds + Cgd 1000 Ciss 800 Coss 600 Crss 400 200 0 1 10 100 A ID = -4.9A VDS =-15V 16 12 8 4 0 0 10 20 30 40 QG , Total Gate Charge (nC) - V DS , Drain-to-Source Voltage (V) Fig 21. Typical Gate Charge Vs. Gate-to-Source Voltage Fig 20. Typical Capacitance Vs. Drain-to-Source Voltage Thermal Response (Z thJA ) 100 D = 0.50 10 0.20 0.10 0.05 1 PDM 0.02 t1 0.01 t2 Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = P DM x Z thJA + TA SINGLE PULSE (THERMAL RESPONSE) 0.1 0.00001 0.0001 0.001 0.01 0.1 1 10 100 t1 , Rectangular Pulse Duration (sec) Fig 22. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 8 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback May 15, 2014 IRF7389PbF-1 SO-8 Package Outline Dimensions are shown in milimeters (inches) D DIM B 5 A 8 6 7 6 H E 1 2 3 0.25 [.010] 4 A MIN .0532 .0688 1.35 1.75 A1 .0040 0.25 e e1 .0098 0.10 .013 .020 0.33 0.51 c .0075 .0098 0.19 0.25 D .189 .1968 4.80 5.00 E .1497 .1574 3.80 4.00 e .050 BASIC 1.27 BASIC .025 BASIC 0.635 BAS IC 0.25 [.010] H .2284 .2440 5.80 6.20 K .0099 .0196 0.25 0.50 L .016 .050 0.40 1.27 y 0° 8° 0° 8° K x 45° A C 8X b MAX b e1 6X MILLIMET ERS MAX A 5 INCHES MIN y 0.10 [.004] A1 8X L 8X c 7 C A B FOOT PRINT NOT ES : 1. DIMENS IONING & T OLERANCING PER AS ME Y14.5M-1994. 8X 0.72 [.028] 2. CONT ROLLING DIMENS ION: MILLIMETER 3. DIMENS IONS ARE SHOWN IN MILLIMET ERS [INCHES ]. 4. OUT LINE CONFORMS T O JEDEC OUT LINE MS-012AA. 5 DIMENS ION DOES NOT INCLUDE MOLD PROT RUSIONS . MOLD PROT RUSIONS NOT T O EXCEED 0.15 [.006]. 6 DIMENS ION DOES NOT INCLUDE MOLD PROT RUSIONS . MOLD PROT RUSIONS NOT T O EXCEED 0.25 [.010]. 6.46 [.255] 7 DIMENS ION IS T HE LENGT H OF LEAD FOR SOLDERING T O A S UBS T RAT E. 3X 1.27 [.050] 8X 1.78 [.070] SO-8 Part Marking Information (Lead-Free) EXAMPLE: T HIS IS AN IRF7101 (MOSFET ) INT ERNAT IONAL RECT IFIER LOGO XXXX F 7101 DAT E CODE (YWW) P = DES IGNAT ES LEAD-FREE PRODUCT (OPTIONAL) Y = LAST DIGIT OF T HE YEAR WW = WEEK A = AS SEMBLY S IT E CODE LOT CODE PART NUMBER Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 9 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback May 15, 2014 IRF7389PbF-1 SO-8 Tape and Reel Dimensions are shown in milimeters (inches) TERMINAL NUMBER 1 12.3 ( .484 ) 11.7 ( .461 ) 8.1 ( .318 ) 7.9 ( .312 ) FEED DIRECTION NOTES: 1. CONTROLLING DIMENSION : MILLIMETER. 2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 3. OUTLINE CONFORMS TO EIA-481 & EIA-541. 330.00 (12.992) MAX. 14.40 ( .566 ) 12.40 ( .488 ) NOTES : 1. CONTROLLING DIMENSION : MILLIMETER. 2. OUTLINE CONFORMS TO EIA-481 & EIA-541. Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ † Qualification information Industrial Qualification level Moisture Sensitivity Level (per JE DEC JE S D47F SO-8 †† guidelines) MS L1 †† (per JE DE C J-S TD-020D ) RoHS compliant Yes † Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability †† Applicable version of JEDEC standard at the time of product release IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA To contact International Rectifier, please visit http://www.irf.com/whoto-call/ 10 www.irf.com © 2014 International Rectifier Submit Datasheet Feedback May 15, 2014