IR3531 4+1 Phase Dual Output Control IC FEATURES DESCRIPTION Integrated 6.8V/0.8A Buck Regulator provides bias to Control and Driver IC(s) Adjustable switching frequency from 250 KHz up to 1.5MHz per phase based on the synchronization SCLK input Sink and source tracking capability Margining via SVID for both rails Pre-bias compatible Soft Stop capability 0.5% overall system set point accuracy Voltage Mode Modulation for excellent transient performance Single NTC thermistor for current reporting, OC Threshold, and Load Line thermal compensation Complete protection including over-current, over-voltage, over-temperature, open remote sense and open control loop Thermally enhanced 48L 7mm x 7mm MLPQ package The IR3531 control IC provides all the necessary control, communication and protection to support compact dual output power solutions up to 210W. The IR3531 can be combined with either discrete IR3535 driver ICs and Direct FetsTM or our IR35XX family of footprint compatible and scalable PowIRstagesTM which integrate the MOSFETs and driver into the same package. The IR3531 provides overall system control and current sharing while the Driver IC or power stages senses perphase current locally and communicates it to the Control IC. The IR3531 has tri-state PWM outputs to allow diode emulation during light load events. The IR3531 provides a high performance transient solution through classic voltage mode control and our non-linear transient solutions, TurboTM and Body BrakingTM. TurboTM automatically turns on all phases to minimize load turn-on transients while Body BrakingTM automatically turns off the low-side MOSFET to help dissipate stored inductor energy at load turn-off. RoHS compliant IIN_R1 VDAC1 VDRP1 EA1 FB1 VO1 VOSEN1+ VOSEN1- TRACK1 IIN4 IIN3 PIN DIAGRAM PWM_R1 BASIC APPLICATION CIRCUIT 48 47 46 45 44 43 42 41 40 39 38 37 EN 1 36 VRHOT# 2 35 PWM4 VRRDY1 3 34 PWM3 VRRDY 4 VCC 5 SW 6 V12V 7 ALERT# 8 VCLK BBR1# 33 TSENS 32 ROSC/OVP 31 ADDR 30 ICCP 29 SCLK 9 28 PWM2 VDIO 10 27 PWM1 PHSSHED 11 26 BBR# IMON_R1 12 25 TRACK IR3531 48 Pin 7 x 7 MLPQ Top View Figure 1: IR3531 Basic Application Circuit, showing a 4+1 Configuration 1 March 22, 2012 | FINAL | V2.27 13 14 15 16 17 18 19 20 21 22 23 24 IMON VDAC VN VDRP EA PSC FB VO VOSEN+ VOSEN- IIN1 IIN2 49 GND Figure 2: IR3531 Package Top View IR3531 4+1 Phase Dual Output Control IC ORDERING INFORMATION IR3531 ― M Package PBF – Lead Free TR – Tape and Reel Tape & Reel Qty Part Number 48 Lead MLPQ (7x7 mm body) 100 IR3531-MPBF 48 Lead MLPQ (7x7 mm body) 3000 IR3531-MTRPBF 1 1 PWM_R1 IIN_R1 VDAC1 VDRP1 EA1 FB1 VO1 VOSEN1+ VOSEN1- TRACK1 IIN4 IIN3 Note : Samples only. 48 47 46 45 44 43 42 41 40 39 38 37 EN 1 36 BBR1# VRHOT# 2 35 PWM4 VRRDY1 3 34 PWM3 VRRDY 4 33 TSENS VCC 5 32 ROSC/OVP SW 6 31 ADDR V12V 7 30 ICCP ALERT# 8 29 SCLK VCLK 9 28 PWM2 VDIO 10 27 PWM1 PHSSHED 11 26 BBR# 25 TRACK IR3531 48 Pin 7 x 7 MLPQ Top View 49 GND 15 16 17 18 19 20 21 22 23 24 VDRP EA PSC FB VO VOSEN+ VOSEN- IIN1 IIN2 14 VN 13 VDAC 12 IMON IMON_R1 Figure 3: Package Top View, Enlarged 2 March 22, 2012 | FINAL | V2.27 4+1 Phase Dual Output Control IC FUNCTIONAL BLOCK DIAGRAM Figure 4: IR3531 Block Diagram 3 March 22, 2012 | FINAL | V2.27 IR3531 4+1 Phase Dual Output Control IC TYPICAL APPLICATION DIAGRAM Figure 5: IR3531 Typical Application Diagram 4 March 22, 2012 | FINAL | V2.27 IR3531 4+1 Phase Dual Output Control IC IR3531 PIN DESCRIPTIONS PIN # PIN NAME 1 EN 2 VRHOT# Open collector output of the VRHOT# comparator which drives low if Rail0 temperature exceeds the programmed threshold. Connect external pull-up to bias. 3 VDRRY1 Open collector output that drives low during startup and under any external fault condition for Rail1 regulator. Connect external pull-up to bias. 4 VDRRY Open collector output that drives low during startup and under any external fault condition for Rail0 regulator. Connect external pull-up to bias. 5 VCC Bias buck regulator output, feedback pin, and bias input for internal circuitry. 6 SW Switching node for bias buck regulator. 7 V12V 8 ALERT# 9 VCLK SVID Clock Input. Clock is a high impedance input pin. It is driven by the open collector output of a microprocessor and requires a pull-up resistor. 10 VDIO SVID Data Input/Output. High impedance input when address, command or data bits are shifted in, open drain output when acknowledging or sending data back to the microprocessor. Pin requires a pull up resistor. 11 PHSSHED Analog signal that represents the number of phases to be disabled. 0% to 25% VCC, no phases disabled. 25% to 50% VCC, disable 1 phase. 50% to 75% VCC, disable 2 phases. 75% to 100% VCC, disable 3 phases (if available). 12 IMON_R1 Voltage at this pin is proportional to Rail1 load current. It is also the input to the ADC for output current register. 13 IMON Voltage at this pin is proportional to Rail0 load current. It is also the input to the ADC for output current register. 14 VDAC Voltage Regulator Rail 0 reference voltage programmed by SVID. VDAC is also used as the A/D reference during power up for pins ADDR/PSN, TSENS and ICCP. 15 VN 16 VDRP 17 EA Output of the error amplifier for Rail0. 18 PSC Node for Power Savings mode compensation input. 19 FB Inverting input to the Error Amplifier for Rail0. 20 VO Remote sense amplifier output for Rail0. 21 VOSEN+ Rail0 remote sense amplifier input. Connect to output at the load. 22 VOSEN- Rail0 remote sense amplifier input. Connect to ground at the load. 23, 24, 37, 38 IIN1-4 Current signals from the driver IC-s of Rail0. 25 TRACK External tracking reference for Rail0. 26 BBR# Body-brakingTM bus for Rail0 driver ICs to disable synchronous switches. 27, 28, 34, 35 PWM1-4 29 SCLK 5 PIN DESCRIPTION Enable input. Grounding this pin shuts down the voltage regulators. Do not float this pin as the logic state will be undefined. Power Supply input supply rail. Output pin for SVID Alert# interrupt. Open collector output that drives low to notify the master. Node for DCR thermal compensation network. Buffered, scaled and thermally compensated current signal for Rail0. Connect an external resistor to FB to program converter output impedance. PWM outputs for Rail0. Each output is connected to the input of the driver IC. Connecting the PWMx output to LGND disables the phase, allowing the IR3531 to operate as a 1, 2, 3, or 4 phase controller. Synchronization clock input. Program ROSC using ROSC vs. Frequency to match the SCLK frequency. March 22, 2012 | FINAL | V2.27 4+1 Phase Dual Output Control IC IR3531 PIN # PIN NAME 30 ICCP Program maximum load current for both Rail0 and Rail1. 31 ADDR Programs SVID address for Rail0 and Rail1, discrete or coupled inductor operation for Rail0, enable/disable turbo function for Rail0. 32 ROSC/OVP 33 TSENS Pin for thermal network that senses the temperature of Rail0 and Rail1. 36 BBR1# Body-brakingTM bus for Rail1 driver ICs to disable synchronous switches. 39 TRACK1 External tracking reference for Rail1. 40 VOSEN1- Rail1 remote sense amplifier input. Connect to ground at the load. 41 VOSEN1+ Rail1 remote sense amplifier input. Connect to output at the load. 42 VO1 Remote sense amplifier output for Rail1. 43 FB1 Inverting input to the Error Amplifier for Rail1. 44 EA1 Output of the error amplifier for Rail1. 45 VDRP1 Buffered, scaled and thermally compensated current signal for Rail1. Connect an external resistor to FB1 to program converter output impedance. 46 VDAC1 Buffered Rail1 reference voltage. Voltage can be margined via SVID. 47 IIN_R1 Current signal from Rail1 driver IC. 48 PWM_R1 49 GND 6 PIN DESCRIPTION Connect a resistor to LGND to program oscillator frequency. Oscillator frequency equals switching frequency per phase. ROSC/OVP pin is pulled up to VCC when an over voltage event occurs. PWM output for Rail1. Local Ground for internal circuitry and IC substrate connection. March 22, 2012 | FINAL | V2.27 4+1 Phase Dual Output Control IC IR3531 ABSOLUTE MAXIMUM RATINGS Storage Temperature Range -65°C To 150°C Operating Junction Temperature 0°C To 150°C ESD Rating HBM Class 1C JEDEC Standard MSL Rating 2 Reflow Temperature 260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications are not implied. PIN Number PIN NAME VMAX VMIN ISOURCE ISINK 1 EN 3.5V -0.3V 25mA 1mA 2 VRHOT# VCC -0.3V 1mA 50mA 3 VDRRY1 VCC -0.3V 1mA 20mA 4 VDRRY VCC -0.3V 1mA 20mA 5 VCC 8V -0.3V 1mA 20mA 6 SW 16V -1.0V 3A 1mA 7 V12V 16V -0.5V 1mA 1.5A 8 ALERT# 3.5V -0.3V 1mA 50mA 9 VCLK 3.5V -0.3V 1mA 1mA 10 VDIO 3.5V -0.3V 1mA 50mA 11 PHSSHED VCC -0.3V 1mA 1mA 12 IMON_R1 3.5V -0.3V 25mA 1mA 13 IMON 3.5V -0.3V 25mA 1mA 14 VDAC 3.5V -0.3V 5mA 35mA 15 VN VCC -0.3V 1mA 1mA 16 VDRP VCC -0.3V 35mA 1mA 17 EA VCC -0.3V 35mA 5mA 18 PSC VCC -0.3V 1mA 1mA 19 FB VCC -0.3V 1mA 1mA 20 VO VCC -0.3V 35mA 5mA 21 VOSEN+ VCC -0.5V 5mA 1mA 22 VOSEN- 1.0V -0.5V 5mA 1mA 23 IIN1 VCC -0.3V 1mA 1mA 24 IIN2 VCC -0.3V 1mA 1mA 25 TRACK VCC -0.3V 1mA 1mA 26 BBR# VCC -0.3V 1mA 5mA 27 PWM1 VCC -0.3V 1mA 5mA 7 March 22, 2012 | FINAL | V2.27 4+1 Phase Dual Output Control IC IR3531 PIN Number PIN NAME VMAX VMIN ISOURCE ISINK 28 PWM2 VCC -0.3V 1mA 5mA 29 SCLK 3.5V -0.3V 1mA 5mA 30 ICCP 3.5V -0.3V 1mA 1mA 31 ADDR 3.5V -0.3V 1mA 1mA 32 ROSC VCC -0.3V 1mA 1mA 33 TSEN 3.5V -0.3V 1mA 1mA 34 PWM3 VCC -0.3V 1mA 5mA 35 PWM4 VCC -0.3V 1mA 5mA 36 BBR1# VCC -0.3V 1mA 5mA 37 IIN3 VCC -0.3V 1mA 1mA 38 IIN4 VCC -0.3V 1mA 1mA 39 TRACK1 VCC -0.3V 1mA 1mA 40 VOSEN1- 1.0V -0.5V 5mA 1mA 41 VOSEN1+ VCC -0.5V 5mA 1mA 42 VO1 VCC -0.5V 35mA 5mA 43 FB1 VCC -0.3V 1mA 1mA 44 EA1 VCC -0.3V 35mA 5mA 45 VDRP1 VCC -0.3V 35mA 1mA 46 VDAC1 3.5V -0.3V 1mA 35mA 47 IIN_R1 VCC -0.3V 1mA 1mA 48 PWM_R1 VCC -0.3V 1mA 1mA 49 GND N/A N/A 20mA 1mA 8 March 22, 2012 | FINAL | V2.27 IR3531 4+1 Phase Dual Output Control IC ELECTRICAL SPECIFICATIONS RECOMMENDED OPERATING CONDITIONS FOR RELIABLE OPERATION WITH MARGIN The electrical characteristics table lists the spread of values guaranteed within the recommended operating conditions. Typical values represent the median values, which are related to 25°C. Unless otherwise specified, these specifications apply over: -0.3V ≤ VOSEN- ≤ 0.3V, 7.75KΩ ≤ ROSC ≤ 50.0 KΩ Recommended V12V Range 10.8V 12 13.2V V Recommended VCC Range 6.6 6.8 7.0 V VOSEN- and VOSEN1- to LGND offset -0.3 0 0.3 V ROSC Resistor Programming Range 7.75 50 KΩ TJ 100 ºC MIN TYP MAX UNIT -0.5 - 0.5 % 0.8 ≤ VID < 1V -5 - +5 mV 0.25V ≤ VID < 0.8V -8 - +8 mV Recommended Operating Junction Temperature 0 ELECTRICAL CHARACTERISTICS PARAMETER SYMBOL CONDITIONS VDAC Reference System Set-Point Accuracy SETACC VID ≥ 1V Slew Rate – Fast Mode VIDFAST 15 20 25 mV/µs Slew Rate – Slow Mode VIDSLOW 3.75 5 6.25 mV/µs Default VBOOT Rail 0 VBOOT0 Note 3 - 1.5 - V Default VBOOT Rail 1 VBOOT1 Note 3 - 1.5 - V VROSC ROSC = 24.5 KΩ 0.570 0.595 0.620 V DACOFF V(VDAC, VDAC1) ― VID code + VID offset, 0.25V ≤ V(VDAC, VDAC1) ≤ 1.52V, < 1mA load -15 0 15 mV 0.25V ≤ V(VDAC1) ≤ 1.52V 0.3 0.44 0.6 0.25V ≤ V(VDAC) ≤ 1.52V 0.9 1.65 2.4 0.5V ≤ V(VDAC1) ≤ 1.52V 2 13 20 0.5 1.5 2 3 15 30 0.5 1.5 3 Unity Gain Bandwidth - 3.5 - MHz Slew Rate - 1.5 - V/µs -14 0 14 mV Oscillator (Note 4) ROSC Voltage VDAC Buffer Amplifier Input Outset Voltage Source Current DACSRC Sink Current DACSNK V(VDAC1) = 0.25V 0.5V ≤ V(VDAC) ≤ 1.52V V(VDAC) = 0.25V mA mA Thermal Compensation Amplifier (VDRP) Output Offset Voltage 9 VDRPOUTOFF March 22, 2012 | FINAL | V2.27 0V ≤ V(IIN) – V(VDAC) ≤ 1.52V, 0.25V ≤ V(VDAC) ≤ 1.52V, IR3531 4+1 Phase Dual Output Control IC PARAMETER SYMBOL CONDITIONS Req/R2 = 2 MIN TYP MAX UNIT mA Source Current VDRPSRC 0.25V ≤ V(VDAC) ≤ 1.52V 3 8 15 Sink Current VDRPSNK 0.5V ≤ V(VDRP) ≤ 1.52V 0.2 0.4 0.7 0.175 0.25 0.4 2 4.5 7 MHz - 5.5 - V/µs -2 0 2 µA VID = 250 mV 250 350 385 mV VID = 1.52 V 2 2.15 2.26 V VID = 250 mV, SF = 500 kHz 60 151 200 VID = 1.52 V, SF = 500 kHz 220 409 480 PS2COTMIN1 VID = 250 mV, SF = 500 kHz 50 100 200 PS2COTMAX1 VID = 1.52 V, SF = 500 kHz 220 358 480 PS1DELAY PS0 to PS1 only - 8 - PWM Cycle V(VDRP) = 0.25V Req/R2 = 2, Note 1 Unity Gain Bandwidth Slew Rate V(VN) = 2 V VN Bias Current mA Power Savings Mode Operation PS2/PS3 Turn-on Threshold PS2/PS3 Pulse Width Rail0 PS2/PS3 Pulse Width Rail1 PS Mode Enter Delay PS2THRSH PS2COT0 ns ns Enable Input Rising Threshold ENRISE 625 650 675 mV Falling Threshold ENFALL 575 600 625 mV Hysteresis ENHYST Bias Current ENBIAS Blanking Time 25 50 75 mV 0V ≤ V(ENABLE) ≤ 3.3V -5 0 5 µA Noise Pulse < 100ns will not register an ENABLE state change. Note 1 75 250 400 ns 15 50 90 mV - 1 - MHz - 1 - µs 1.00 -2 1.09 0 1.145 2 V % -75 0 75 mV 3 8 15 mA 0.2 0.4 0.6 0.175 0.25 0.375 - 9 - V/V IMONx Current Report Amplifier Output Offset Voltage IMONOFF Unity Gain Bandwidth VDRP–VDAC = 0, 225, 450, 900mV Note 1 Input Filter Time Constant Max Output Voltage IMONMAX Current Report A/D Accuracy IMONACC VDRP–VDAC = 900mV VDRP1OFF 0V≤ V(IIN_R1) - V(VDAC1) ≤ 0.2V 0.25V ≤ V(IIN_R1) - V(VDAC1) ≤ 1.52V Rail1 VDRP Amplifier Output Outset Voltage Source Current VDRP1SRC VDRP1SNK Sink Current 0.25V ≤ V(VDAC1) ≤ 1.52V 0.5V≤ V(VDRP1) ≤ 1.52V mA Closed Loop Gain V(VDRP1) = 0.25V Note 1 Unity Gain Bandwidth Note 1 0.8 1.5 3 MHz Slew Rate Note 1 - 5.5 - V/µs Error Amplifier 10 March 22, 2012 | FINAL | V2.27 IR3531 4+1 Phase Dual Output Control IC PARAMETER SYMBOL Input Offset Voltage CONDITIONS Note 2 (test mode only) FB Bias Current MIN TYP MAX UNIT - 0 - mV -1 0 1 µA DC Gain Note 1 100 110 120 dB Unity Gain Bandwidth Note 1 20 30 40 MHz Note 1 Slew Rate 7 12 20 V/µs Sink Current EASRC 0.40 0.85 1.35 mA Source Current EASNK 5 8 12 mA Maximum Voltage EAMAX 500 925 1100 mV Minimum Voltage EAMIN - 120 250 mV Open Voltage Loop Detection Threshold EAOPENTHR 100 300 1100 mV Open Loop Detection Delay EAOPENDEL - 8 - PWM PS2 Clamp Voltage EAPS2CLMP -240 -70 -10 mV Measure V(VCC) – V(EA), V(EA1) Measure V(VCCx) - V(EA), V(EA1), Relative to Error Amplifier maximum voltage V(EA), V(EA1) = V(VCC) to VRRDY = low With respect to VDAC Phase Firing Comparators Input Offset KEEPOFF -30 0 30 mV Propagation Delay KEEPDEL - - 320 ns µA Phase Shedding Comparators Bias Current PHSDBIAS Threshold PHSDTHRS -2 0 2 Comparator 1 1.3 1.7 2.0 Comparator 2 3.0 3.4 3.85 Comparator 3 4.8 5.1 5.55 42 52.5 57 mV/ %DC 55 70 ns V PWM Comparator PWM Ramp Slope PWMSLP V12V= 12V Minimum Pulse Width PWMMIN Note 1 Input Offset Voltage PWMOFF Note 1 -5 0 5 mV SAAOFF Note 1 -3 0 3 mV SAAGAIN CSIN+ = CSIN- = DACIN, Note 1 4 5.0 6 V/V Note 1 4 8.5 17 kHz 100 180 22 0 mV -220 -160 -100 mV 1.615 1.65 1.67 V 100 130 150 mV - 90 180 ns Share Adjust Amplifier Input Offset Voltage Gain Unity Gain Bandwidth Maximum PWM Ramp Floor Voltage Minimum PWM Ramp Floor Voltage MINFLOOR MAXFLOOR IOUT = DACIN – 200mV Measure relative to floor voltage IOUT = DACIN + 200mV Measure relative to floor voltage Over Voltage Protection (OVP) Comparators Threshold at Power-up OVPPUP Threshold during Normal Operation OVPTHR Propagation Delay to OVP OVPPROP 11 March 22, 2012 | FINAL | V2.27 Compare to VID Voltage + VID offset Measure time from V(FB), V(FB1) > VID voltage + VID offset (250mV overdrive) to V(PWM) transition to > 0.5 * V(VCC) IR3531 4+1 Phase Dual Output Control IC PARAMETER Turbo Circuit Activation Threshold Voltage SYMBOL CONDITIONS TURBACT Note 1 Compare to EA, Note 1 Turbo Comparator Hysteresis TURBHYST Note 1 Note 1 Filter Time Constant TURBTIME Note 1 Note 1 Turbo Pulse Width TURBPW 500kHz 600mV Peak sine wave on EAIN, measure GATEH pulse width Peak Detect Reset Time Constant TURBRESET Over-Current Comparator Input Filter Time Constant MIN TYP MAX UNIT - 390 - mV - 90 - mV - 8 - µs 115 230 280 ns - 400 - ns - 2 - µs Over-Current Threshold OCTHRSH VDRP-VDAC, VDRP1-VDAC1 0.94 1.08 1.18 V OC Threshold PSI Reduction Factor OCPSI PSI mode, 4ph to 2ph, 2ph to 1ph 450 540 610 PSI mode, 3ph to 1ph 310 360 410 3ph to 2ph 640 720 800 PSI mode, 4ph to 1ph 220 270 310 4ph to 3ph 690 800 900 Delay to OC shutdown 225 256 285 µs - 4096 - µs VCCSTART 5.5 5.85 6.4 V VCC UVL Stop VCCSTOP 4.85 5.2 5.65 V VCC UVL Hysteresis VCCHYST 515 650 830 mV OC Delay Time OCDELAY OC Hiccup Time Relaxation Delay VCC Undervoltage VCC UVL Start VRRDY Output Output Voltage mV VRRDYLO I(VRRDY, VDRRY1) = 4mA - 150 300 mV Leakage Current VRRDYLEAK V(VRRDY, VDRRY1) = 5.5V - 0 10 µA VCC Activation Voltage VRRDYVCC 1 2 3.6 V VO-VDAC Undervoltage Threshold VOUVRISE I(VDRRY, VDRRY1) = 4mA, <300mV Reference to VDAC -340 -290 -230 mV 100 150 200 mV 25 60 80 mV 82 90 92 % 0.36 0.40 0.44 V 200 500 700 µA 6.5 6.8 7.1 V Open Sense Line Detection Sense Line Detection Active Comparator Threshold Voltage OPENACT Sense Line Detection Active Comparator Offset Voltage OPENOFF V(VO) < [V(VOSEN+) – V(LGND)] / 2 VOSEN+ Open Sense Line Comparator Threshold OPENCOMP+ Compare to V(VCC) VOSEN- Open Sense Line Comparator Threshold Sense Line Detection Source Currents VCC Buck Regulator OPENCOMP- VCC Output Voltage 12 OPENSRC V(VO) = 100mV VCC100 100–400 mA load current March 22, 2012 | FINAL | V2.27 IR3531 4+1 Phase Dual Output Control IC PARAMETER Switch Node Rise Time SYMBOL SWRISE MIN TYP MAX UNIT Note 1 - 5 - ns Switch Node Fall Time SWFALL Note 1 - 15 - ns ADDRBIAS -2 0 2 µA ICCP Pin Bias Current ICCPBIAS -2 0 2 µA TSENS Pin Bias Current TSENBIAS -2 0 2 µA A/D Comparator Offset ADOFFSET -5 0 5 mV VCCSTART 8.8 9.6 10.2 V VCC V12V Stop VCCSTOP 7.8 8.6 9.2 V VCC V12V Hysteresis VCCHYST 0.8 1 1.3 V - - 14.3 Ω A/D Program Inputs ADDR Pin Bias Current V12V Undervoltage VCC V12V Start SerialVID ALERT#, VDIO Buffer On Resistance ALERT#, VDIO Leakage Current CONDITIONS ALERTRES ALERTLEAK -10 0 10 µA VCLK Bias Current VCLKBIAS -1 0 1 µA VDIO Bias Current VDIOBIAS -1 0 1 µA Transmit Data Prop Delay XMITDELAY VCLK rising to VDIO change 4 6 12 ns Comparator Threshold SVIDTHRSH VCLK, VDIO rising 500 590 650 VCLK, VDIO falling 450 515 650 mV Comparator Hysteresis SVIDHYST 50 75 - mV Link States Reset Timer SVIDTIME 200 - 600 ns Source Resistance PWMSRCR 50 144 500 Ω Sink Resistance PWMSNKR 75 117 290 Ω Tri-state Source Impedance PWMTRIZ 2.0 5.4 7.5 KΩ Tri-state Bias Current PWMTRIBIAS V(PWMx) = 1.65V -5 0 5 µA Tri-state Active Pull-up PWMTRIPUP V(PWMx) while sourcing 100 µA to GND 0.5 1 1.2 V Disable Comparator Threshold PWMDISTHR 0.4 0.6 0.9 V PWM High Voltage PWMHIGH - - 1 V PWM Low Voltage PWMLOW I(PWM) = -1mA, measure VCC-PWM I(PWM) = -1mA - - 1 V BBRTHRFALL Measure relative to floor voltage -300 -200 -110 mV BBRTHRRISE Measure relative to floor voltage -200 -100 -10 mV 70 105 130 mV 30 65 90 ns 20 40 75 Ω PWMx Outputs Body Braking Comparator Threshold Voltage with EAIN Decreasing Threshold Voltage with EAIN Increasing Hysteresis Propagation Delay BBR1# Source Resistance 13 BBRTHRHYS BBRDELAY BBRSRCRES March 22, 2012 | FINAL | V2.27 VCC = 5V Measure time from EAIN < V(DACIN) (200mV overdrive) to GATEL transition to < 4V. IR3531 4+1 Phase Dual Output Control IC PARAMETER BBR1# Sink Resistance SYMBOL BBRSNKRES CONDITIONS BBR1# High Voltage BBRHIGH BBR1# Low Voltage BBRLOW I(BBR1#) = -1mA, measure V(VCC) – V(BBR1#) I(BBR1#) = 1mA Unity Gain Bandwidth RSABW Note 1 Input Outset Voltage RSAOFF MIN TYP MAX UNIT 10 35 60 Ω 0 0.4 0.8 V 0 0.35 0.8 V 1.5 3.2 4.5 mV -5 0 5 mV 0.4 1 2 Remote Sense Differential Amplifier High Voltage VOHIGH 0.25V≤ V(VOSEN+) - V(VOSEN-) ≤ 1.52V, 0.25V≤ V(VOSEN1+) - V(VOSEN1-) ≤ 1.52V 0.5V≤ V(VOSEN+) - V(VOSEN-) ≤ 1.52V, 0.5V≤ V(VOSEN1+) - V(VOSEN1-) ≤ 1.52V V(VOSEN+) - V(VOSEN-) = 0.25V, V(VOSEN1+) - V(VOSEN1-) = 0.25V 0.25V≤ V(VOSEN+) - V(VOSEN-) ≤ 1.52V, 0.25V≤ V(VOSEN1+) - V(VOSEN1-) ≤ 1.52V 0.25V≤ V(VOSEN+) - V(VOSEN-) ≤ 1.52V, 0.25V≤ V(VOSEN1+) - V(VOSEN1-) ≤ 1.52V 0.25 V < V(VOSEN+) < 1.52V, 0.25 V < V(VOSEN1+) < 1.52V -0.3V ≤ VOSEN- ≤ 0.3V, All VID Codes, -0.3V ≤ VOSEN1- ≤ 0.3V, All VID Codes V(VCC) – V(VO), V(VCC) – V(VO1) 1.5 2 2.5 V Low Voltage VOLOW V(VCC) = 7V - 60 100 mV VRHTOUT I(VRHOT#) = 30mA - 150 400 mV VRHTLEAK V(VRHOT#) = 5.5V - 0 10 µA PTMTHR Raise ADDR voltage after VIN power-up 2.2 2.6 3.1 V 20 - 24 µs Sink Current RSASINK Source Current RSASRC Slew Rate RSASLEW VOSEN+ Bias Current VOSNS-BIAS VOSEN- Bias Current VOSNS+BIAS VRHOT# Comparator Output Voltage VRHOT# Leakage Current Platform Test Mode Comparator Threshold Link States Reset Timer VR Settled Comparator Offset Delay to ALERT# PTMTIME mA 0.225 0.5 0.8 3 9 20 mA 2 4 8 V/µs - 27 50 µA - 27 70 µA VRSTLOFF Compare FB to VDAC reference - 20 - mV VRSTLDELAY Delay after DAC settled to within 2 VID steps of final value - 5 - µs Current Inputs IINx to IINx Impedance IINRES - 3000 - Ω IINx to IINx Leakage Current IINLEAK -1 0 1 µA -1 0 1 µA TRACK Inputs Input Leakage 14 March 22, 2012 | FINAL | V2.27 IR3531 4+1 Phase Dual Output Control IC PARAMETER TRACK to FB Offset SYMBOL Release Error Voltage CONDITIONS Error amp in unity gain TRACK = VDAC+100mV, VDAC-FB VO Discharge Comparators Tri-state Enable Threshold VO when PWM outputs enter tri-state MIN TYP MAX UNIT 15 36 65 mV -1 0 1 mV 200 250 300 mV 0.8 1.2 1.3 V SCLK Synchronization Input Rising Threshold Falling Threshold Note 1 0.625 0.85 1.025 V Input Leakage -5 0 5 µA Propagation Delay Rising - - 60 ns - - 10 pF 3 7 12 mA Input Capacitance Note 1 General VCC Supply Current VCCBIAS Notes: 1. Guaranteed by design but not tested in production 2. Error Amplifier input offset is trimmed to within ±1% for optimal system set point accuracy. 3. Final test VBOOT options of 0, 0.9, 1.35 and 1.5V are feasible. Contact International Rectifier Enterprise Power Business Unit for details. 4. Use of internal oscillator is not recommended, use SCLK input to set PWM frequency. 15 March 22, 2012 | FINAL | V2.27 4+1 Phase Dual Output Control IC THEORY OF OPERATION SYSTEM DESCRIPTION The IR3531 Multiphase Buck power system provides voltage regulation solutions for two individual supply outputs. The main output, Rail0, controls up to four phases and produce up to 200A when paired with appropriate power stages. The secondary output, Rail1, is a single phase output capable of up to 50A, again with appropriate power stage. The IR3531 control IC is specialized to allow external clock synchronization and tracking capability for each rail. Features include a serial control and telemetry bus that can control output voltage settings and slew rates while allowing monitoring of the system thermals and load currents. The IR3531 control IC contains all necessary housekeeping, protection and control functions and communicates a three-level PWM signal to each power stage. FREQUENCY AND PHASE TIMING CONTROL The IR3531 operates with external frequency synchronization which can be used to control input ripple from multiple paralleled power supply systems. Systems can be forced to operate out of phase thereby reducing instantaneous peak input currents and also controlling system noise signatures. The internal oscillator is used to calibrate the PWM ramp slopes and other functions at power up therefore it is desirable for the externally applied synchronization frequency to be very near the ROSC programmed internal frequency times the number of active phases. Calibration can take up to 1ms. This results in the PWM gain to be near the desired 50mV/% duty cycle. Furthermore, it is desired the SCLK input be stable prior to enabling the IR3531 voltage regulator. The SCLK input frequency provided needs to equal the desired base switching frequency multiplied by the active number of phases. Phase shedding is available however SCLK needs to be adjusted accordingly to match the number of active phases. Phase timing and interleave spacing is automatically optimized inside the controller and can accommodate changing phases on the fly (phase shedding). The PHSSHD pin can be used to dynamically drop from 1-3 phases while minimizing output voltage transients. Also, phases can be disabled by grounding the PWM outputs of the IR3531. Notice the driver ICs should be removed since a PWM low signal indicates a 0% duty cycle state which turns on the low-side MOSFETs and can potentially develop large negative inductor currents. The control IC detects which PWM pins are grounded during power up to determine the populated number of phases and automatically optimizes phase timing for minimal system ripple. TRACK FUNCTIONALITY Both Rail outputs of the IR3531 can be independently controlled through their respective TRACK inputs. TRACK pins override the internal VDAC reference inputs to the Error Amplifiers allowing users to control power up and power down VR output voltage characteristics. The IR3531 is fully soft-stop and pre-bias compatible. The control loop is full synchronous during soft stop events thereby preventing COUT capacitor discharge-induced inductive kicks. The control system allows non-synchronous buck operation once VO <=250mV ― this allows outputs to return to their pre-biased operating points if available. Figure 6: TRACK Operation with Pre-Bias 16 March 22, 2012 | FINAL | V2.27 IR3531 IR3531 4+1 Phase Dual Output Control IC Figure 7: TRACK Operation without Pre-Bias The TRACK inputs have a typical 36mV offset from the closed loop feedback operating point to ensure the error amplifier is in an off state when TRACK=0V. Furthermore, TRACK must exceed the respective VDAC by at least 100mV to ensure VDAC has complete control of the Error Amplifier as shown in Figures 6 and 7. across the inductor. Body Braking overshoot of the converter. TM reduces the peak As a cautionary note the track input provides direct control of the output PWM duty cycle. The presence of excessive noise or glitches on TRACK when this input is active can cause sudden increases in the PWM duty cycle (up to 100%), potentially causing damage to the power converter. An error amplifier output voltage greater than the common mode input range of the PWM comparator results in 100% duty cycle regardless of the voltage of the PWM ramp. The resulting PWM control loop is capable of transitioning from 0% duty cycle to 100% duty cycle with overlapping phases within a few tens of nanoseconds in response to a load step decrease. Figure 8 on the next page depicts PWM operating waveforms under various conditions. PWM CONTROL METHOD BODY BRAKINGTM The steady state control architecture utilized in the IR3531 is feed-forward voltage mode control with trailing edge modulation. A high-gain wide-bandwidth voltage type error amplifier is used to achieve accurate voltage regulation and ultra-fast transient response. Feed-forward control is established by varying the PWM ramp slope proportionally to the input voltage resulting in the error amplifier operating point being independent of the input voltage. The input voltage can change due to variations in the silver box output voltage or due to the wire and PCB-trace voltage drop related to changes in load current. All PWM ramp slopes are calibrated at initial power-up. The PWM pulse is terminated once the PWM ramp exceeds the Error Amplifier output voltage. In a conventional synchronous buck converter, the minimum time required to reduce the current in the inductor in response to a load-step decrease is: Under dynamic load transitions, the IR3531 utilizes our TM patented Body Braking algorithm allows all low-side MOSFETs to be turned off during a load relaxation event allowing the MOSFET body diodes to conduct and dissipate some of the stored inductor energy and also speed up the inductor current slew rate by introducing a larger voltage 17 March 22, 2012 | FINAL | V2.27 TSLEW L * ( I MAX I MIN ) VO The slew rate of the inductor current can be significantly increased by turning off the synchronous rectifier in response to a load-step decrease. The switch node voltage is then forced to decrease until conduction of the synchronous rectifier’s body diode occurs. This increases the voltage across the inductor from Vout to Vout + VBODYDIODE. The minimum time required to reduce the current in the inductor in response to a load transient decrease is now: TSLEW L * ( I MAX I MIN ) VO V BODYDIODE 4+1 Phase Dual Output Control IC Since the voltage drop in the body diode is often comparable to the output voltage, the inductor current IR3531 slew rate can be increased significantly. This patented PHASE CLOCK PULSE EAIN PWMRMP FLOOR GATEH GATEL STEADY-STATE OPERATION DUTY CYCLE INCREASE DUE TO LOAD INCREASE DUTY CYCLE DECREASE DUE TO V12V INCREASE (FEED-FORWARD) DUTY CYCLE DECREASE DUE TO LOAD DECREASE (BODY BRAKING) OT FAULT (VCC UV, OCP, VID FAULT) STEADY-STATE OPERATION Figure 8: PWM Operating Waveforms technique is referred to as “body braking” and is accomplished through the “body braking comparator.” If the error amplifier’s output voltage drops below VDAC, this comparator turns off the low-side gate driver, enabling the bottom FET body diode to take over. There is 100mV upslope and 200mV down slope hysteresis for the body braking comparator. BODY BRAKINGTM In a conventional synchronous buck converter, the minimum time required to reduce the current in the inductor in response to a load-step decrease is: TSLEW L * ( I MAX I MIN ) VO The slew rate of the inductor current can be significantly increased by turning off the synchronous rectifier in response to a load-step decrease. The switch node voltage is then forced to decrease until conduction of the synchronous rectifier’s body diode occurs. This increases the voltage across the inductor from Vout to Vout + VBODYDIODE. The minimum time required to reduce the current in the inductor in response to a load transient decrease is now: TSLEW L * ( I MAX I MIN ) VO V BODYDIODE Since the voltage drop in the body diode is often comparable to the output voltage, the inductor current 18 March 22, 2012 | FINAL | V2.27 slew rate can be increased significantly. This patented technique is referred to as “body braking” and is accomplished through the “body braking comparator.” If the error amplifier’s output voltage drops below VDAC, this comparator turns off the low-side gate driver, enabling the bottom FET body diode to take over. There is 100mV upslope and 200mV down slope hysteresis for the body braking comparator. LOSSLESS AVERAGE INDUCTOR CURRENT SENSING Inductor current can be sensed by connecting a series resistor and a capacitor network in parallel with the inductor and measuring the voltage across the capacitor, as shown in Figure 8. The equation of the sensing network is: 1 RL sL vC (s) vL ( s) iL ( s) 1 sRCSCCS 1 sRCSCCS Usually the resistor Rcs and capacitor Ccs are chosen, such that, the time constant of Rcs and Ccs equals the time constant of the inductor, which is the inductance L over the inductor DCR RL. If the two time constants match, the voltage across Ccs is proportional to the current through L, and the sense circuit can be treated as if only a sense resistor with the value of RL was used. The mismatch of the time constants does not affect the measurement of inductor DC current, but affects the AC component of the inductor current. 4+1 Phase Dual Output Control IC IR3531 The input offset of this amplifier is calibrated to within +/- 450µV (6 sigma limits) with a 200uV typical LSB calibration bit. This calibration routine is continuous and occurs at every 56 PWM cycles. Figure 9: Inductor Current Sensing and Current Sense Amplifier The advantage of sensing the inductor current versus high-side or low-side sensing is that actual output current being delivered to the load is obtained rather than peak or sampled information about the switch currents. The output voltage can be positioned to meet a load line based on real-time information. Except for a sense resistor in series with the inductor, this is the only sense method that can support a single cycle transient response. Other methods provide no information during either load increase (low-side sensing) or load decrease (high-side sensing). An additional problem associated with peak or valley current mode control for voltage positioning is that they suffer from peak-to-average errors. These errors will appear in many ways but one example is the effect of frequency variation. If the frequency of a particular unit is 10% low, the peak-to-peak inductor current will be 10% larger and the output impedance of the converter will drop by about 10%. Variations in inductance, current sense amplifier bandwidth, PWM prop delay, any added slope compensation, input voltage, and output voltage are all additional sources of peak-to-average errors. CURRENT SENSE AMPLIFIER A high speed differential current sense amplifier is located in our driver ICs, as shown in Figure 9. Its gain is nominally 32.5 over the entire temperature operating range therefore the 3850 ppm/ºC inductor DCR temperature coefficient should be compensated in the voltage loop feedback path. This can be accurately compensated by using a linearized Negative TC resistor network where the NTC can be located near the output inductors. The resulting temperature compensated current information is used by the control IC for voltage positioning and current reporting, and over current limit protection. 19 March 22, 2012 | FINAL | V2.27 The current sense amplifier can accept positive differential input up to 50mV and negative up to -10mV before clipping. The output of the current sense amplifier is summed with the VDAC voltage and is returned to the control IC through the IIN pin. The IIN pins in the control IC are internally tied together through 3 KOhm resistors to produce a voltage representative of the average phase inductor current. AVERAGE CURRENT SHARE LOOP A current sharing loop is also incorporated in the IR3531 to ensure balance between the multiphase buck power stages. Poor current sharing can hamper transient response and degrade overall system efficiency. The current information of each phase is compared against the average phase current through a Share Adjust Amplifier which then manipulates the respective PWM ramp start voltage to add or subtract PWM output duty cycle. The current share amplifier is internally compensated such that the crossover frequency of the current share loop is much slower than that of the voltage loop and the two loops do not interact. INSTANTANEOUS CURRENT BALANCE A form of coarse current sharing is also incorporated into the IR3531 to protect against Synchronized High Load Repetition Rate transients which can saturate inductors and cause OVP conditions. The phase firing order of the multiphase system is continually being re-assessed and adjusted if required on a cycle-by-cycle basis to prevent instantaneous phase currents from deviating from each other. This also improves transient response by ensuring all phase currents track each other within a few switching cycles. Individual switch nodes will appear to be variable frequency however input and output ripple are unaffected by the varying phase firing order. 4+1 Phase Dual Output Control IC SVID CONTROL The SVID bus allows the processor to communicate with the IR3531. The processor can program the voltage regulator output voltage and monitor telemetry data the IR3531 offers such as temperature and both rail currents. VCLK, VDIO and ALERT# communication lines are designed for external 50-75 ohm pull up resistors to 1.0-1.2V bias voltage and should not be floated. Note that ALERT# may assert twice for VID transitions of 2 VID steps or less. Addressing is programmed as a percentage of VDAC as shown by selecting the appropriate ADDR pin resistor divider combination and supports up to 14 addresses and 2 all call addresses (refer to Table 1). Table 2 provides a list of supported SVID commands. Table 3 provides a list of supported required SVID registers. The SVID communicates VID codes listed in Table 4a and 4b to program the VDAC set point. The IR3531 can accept changes in the VID code and will vary the VDAC voltage accordingly. The slew rate of the voltage at the VDAC pin can be set by the appropriate command. The slew rate is internally programmed and no external pins or components are necessary. Digital VID transitions result in a smooth analog transition of the VDAC voltage and converter output voltage minimizing inrush currents, false over current conditions and overshoot of the output voltage. The VID data from the SVID bus is stored in registers and is sent to the Digital-to-Analog Converter (DAC), whose output is sent to the VDAC buffer amplifier. The output of the buffer amplifier is the VDAC pin. To achieve optimal system setpoint voltage accuracy, first all contributing offsets of the IR3531 are independently trimmed and lastly the internal VDAC reference is trimmed to take into account all sum of all the offset components. Note that the resulting final VDAC voltage will have a slightly wider tolerance as it is compensating for the sum of all other offset components. This results in an overall 0.5% system set-point accuracy for VID range between 1V to 1.52V. IR3531 TABLE 1: ADDR/PSN A/D VOLTAGE PROGRAMMING (AS % OF VDAC) % of VDAC Binary Code Address Name Sync Turbo 1.5% 00000 A0/A1 Ext. Sync Enable 4.7% 00001 A0/A1 Ext. Sync Disable 7.8% 00010 A0/A1 Int. Clock Enable 11% 00011 A0/A1 Int. Clock Disable 14% 00100 A2/A3 Ext. Sync Enable 17.2% 00101 A2/A3 Ext. Sync Disable 20.3% 00110 A2/A3 Int. Clock Enable 23.4% 00111 A2/A3 Int. Clock Disable 26.5% 01000 A4/A5 Ext. Sync Enable 29.7% 01001 A4/A5 Ext. Sync Disable 32.8% 01010 A4/A5 Int. Clock Enable 36% 01011 A4/A5 Int. Clock Disable 39% 01100 A6/A7 Ext. Sync Enable 42.2% 01101 A6/A7 Ext. Sync Disable 45.3% 01110 A6/A7 Int. Clock Enable 48.4% 01111 A6/A7 Int. Clock Disable 51.5% 10000 A8/A9 Ext. Sync Enable 54.7% 10001 A8/A9 Ext. Sync Disable 57.8% 10010 A8/A9 Int. Clock Enable 61% 10011 A8/A9 Int. Clock Disable 64% 10100 A10/A11 Ext. Sync Enable 67.2% 10101 A10/A11 Ext. Sync Disable 70.3% 10110 A10/A11 Int. Clock Enable 73.4% 10111 A10/A11 Int. Clock Disable 76.6% 11000 A12/A13 Ext. Sync Enable 79.7% 11001 A12/A13 Ext. Sync Disable 82.8% 11010 A12/A13 Int. Clock Enable 86% 11011 A12/A13 Int. Clock Disable Note: A14/A15 are reserved all-call address. SVID COMMAND STRUCTURE SVID protocol has two main command groups: the Get and Set commands. The Get commands retrieve data from the voltage regulator controller, while the Set commands make changes to voltage regulator operating points and power states. 20 March 22, 2012 | FINAL | V2.27 IR3531 4+1 Phase Dual Output Control IC When the processor (master) issues a Get command, it transmits the intended controller address and the address of the register it wants to read. The addressed controller acknowledges the command and returns the requested data. Similarly, when the processor issues a Set command, it transmits the intended controller address and the data it wants to insert. The only exception is the SetRegADR command which is used to declare the register address that SetRegDAT will alter. The controller acknowledges these commands. Parity checking is not enforced on SetRegADR/SetRegDAT. TABLE 2: SUPPORTED COMMAND Command Description SetVIDfast Slews VOUT to a new Programmed setpoint at 20mV/usec TABLE 3: SUPPORTED REGISTER Register Description VendorID Identifies the VR vendor ProductID Identifies the product model ProductRev Identifies the product revision SVID Protocol ID Identifies the version of SVID protocol VR Capability Communicates functions the IR3531 supports Status1 Reg Stores VR status data Status2 Reg Stores SVID bus errors Temp Zone Temperature zone from Rail0 sensor Output Current Stores output current for Rail0/Rail1 Status2_last_read Stores previous data of status 2 SetVIDslow Slews VOUT to a new Programmed setpoint at 5mV/usec ICC Max Programs the maximum supported output current SetPS Sets power state Temp Max SetRegADR Declares the address of the register to be written to Programs maximum operating temperature SR-fast Stores the fast slew rate value SetRegDAT Writes data to the SetRegADR declared register SR-slow Stores the slow slew rate value GetReg Read data of a specified register Vboot Overrides the default Vboot value TestMode Test mode is used for final test trimming of the IR3531 and is not available to users. Vout Max Programs the maximum supported operational Vout VID Setting Register contains the current VID setting Power State Register contains the current power state Note: SetVID decay is not supported VID Offset 1 Allows margining around the VID setpoint Multi VR Config Configures other VR-s on the same SVID bus SetRegADR Scratch pad register for temporary storage of the SetRegADR pointer register Note 1: VID Offset commands that attempt to push the VID above 1.52V or below 0V are not acknowledged. 21 March 22, 2012 | FINAL | V2.27 4+1 Phase Dual Output Control IC IR3531 TABLE 4: VID VALUES VID7:VID0 (Hex) VID7:VID0 (Bin) Voltage VID7:VID0 (Hex) VID7:VID0 (Bin) Voltage VID7:VID0 (Hex) VID7:VID0 (Bin) Voltage 00 00000000 0 26 00100110 0.435 4C 01001100 0.625 01 00000001 0.250 27 00100111 0.440 4D 01001101 0.630 02 00000010 0.255 28 00101000 0.445 4E 01001110 0.635 03 00000011 0.260 29 00101001 0.450 4F 01001111 0.640 04 00000100 0.265 2A 00101010 0.455 50 01010000 0.645 05 00000101 0.270 2B 00101011 0.460 51 01010001 0.650 06 00000110 0.275 2C 00101100 0.465 52 01010010 0.655 07 00000111 0.280 2D 00101101 0.470 53 01010011 0.660 08 00001000 0.285 2E 00101110 0.475 54 01010100 0.665 09 00001001 0.290 2F 00101111 0.480 55 01010101 0.670 0A 00001010 0.295 30 00110000 0.485 56 01010110 0.675 0B 00001011 0.300 31 00110001 0.490 57 01010111 0.680 0C 00001100 0.305 32 00110010 0.495 58 01011000 0.685 0D 00001101 0.310 33 00110011 0.500 59 01011001 0.690 0E 00001110 0.315 34 00110100 0.505 5A 01011010 0.695 0F 00001111 0.320 35 00110101 0.510 5B 01011011 0.700 10 00010000 0.325 36 00110110 0.515 5C 01011100 0.705 11 00010001 0.330 37 00110111 0.520 5D 01011101 0.710 12 00010010 0.335 38 00111000 0.525 5E 01011110 0.715 13 00010011 0.340 39 00111001 0.530 5F 01011111 0.720 14 00010100 0.345 3A 00111010 0.535 60 01100000 0.725 15 00010101 0.350 3B 00111011 0.540 61 01100001 0.730 16 00010110 0.355 3C 00111100 0.545 62 01100010 0.735 17 00010111 0.360 3D 00111101 0.550 63 01100011 0.740 18 00011000 0.365 3E 00111110 0.555 64 01100100 0.745 19 00011001 0.370 3F 00111111 0.560 65 01100101 0.750 1A 00011010 0.375 40 01000000 0.565 66 01100110 0.755 1B 00011011 0.380 41 01000001 0.570 67 01100111 0.760 1C 00011100 0.385 42 01000010 0.575 68 01101000 0.765 1D 00011101 0.390 43 01000011 0.580 69 01101001 0.770 1E 00011110 0.395 44 01000100 0.585 6A 01101010 0.775 1F 00011111 0.400 45 01000101 0.590 6B 01101011 0.780 20 00100000 0.405 46 01000110 0.595 6C 01101100 0.785 22 March 22, 2012 | FINAL | V2.27 4+1 Phase Dual Output Control IC IR3531 VID7:VID0 (Hex) VID7:VID0 (Bin) Voltage VID7:VID0 (Hex) VID7:VID0 (Bin) Voltage VID7:VID0 (Hex) VID7:VID0 (Bin) Voltage 21 00100001 0.410 47 01000111 0.600 6D 01101101 0.790 22 00100010 0.415 48 01001000 0.605 6E 01101110 0.795 23 00100011 0.420 49 01001001 0.610 6F 01101111 0.800 24 00100100 0.425 4A 01001010 0.615 70 01110000 0.805 25 00100101 0.430 4B 01001011 0.620 71 01110001 0.810 72 01110010 0.815 99 10011001 1.010 C0 11000000 1.205 73 01110011 0.820 9A 10011010 1.015 C1 11000001 1.210 74 01110100 0.825 9B 10011011 1.020 C2 11000010 1.215 75 01110101 0.830 9C 10011100 1.025 C3 11000011 1.220 76 01110110 0.835 9D 10011101 1.030 C4 11000100 1.225 77 01110111 0.840 9E 10011110 1.035 C5 11000101 1.230 78 01111000 0.845 9F 10011111 1.040 C6 11000110 1.235 79 01111001 0.850 A0 10100000 1.045 C7 11000111 1.240 7A 01111010 0.855 A1 10100001 1.050 C8 11001000 1.245 7B 01111011 0.860 A2 10100010 1.055 C9 11001001 1.250 7C 01111100 0.865 A3 10100011 1.060 CA 11001010 1.255 7D 01111101 0.870 A4 10100100 1.065 CB 11001011 1.260 7E 01111110 0.875 A5 10100101 1.070 CC 11001100 1.265 7F 01111111 0.880 A6 10100110 1.075 CD 11001101 1.270 80 10000000 0.885 A7 10100111 1.080 CE 11001110 1.275 81 10000001 0.890 A8 10101000 1.085 CF 11001111 1.280 82 10000010 0.895 A9 10101001 1.090 D0 11010000 1.285 83 10000011 0.900 AA 10101010 1.095 D1 11010001 1.290 84 10000100 0.905 AB 10101011 1.100 D2 11010010 1.295 85 10000101 0.910 AC 10101100 1.105 D3 11010011 1.300 86 10000110 0.915 AD 10101101 1.110 D4 11010100 1.305 87 10000111 0.920 AE 10101110 1.115 D5 11010101 1.310 88 10001000 0.925 AF 10101111 1.120 D6 11010110 1.315 89 10001001 0.930 B0 10110000 1.125 D7 11010111 1.320 8A 10001010 0.935 B1 10110001 1.130 D8 11011000 1.325 8B 10001011 0.940 B2 10110010 1.135 D9 11011001 1.330 8C 10001100 0.945 B3 10110011 1.140 DA 11011010 1.335 8D 10001101 0.950 B4 10110100 1.145 DB 11011011 1.340 8E 10001110 0.955 B5 10110101 1.150 DC 11011100 1.345 23 March 22, 2012 | FINAL | V2.27 4+1 Phase Dual Output Control IC IR3531 VID7:VID0 (Hex) VID7:VID0 (Bin) Voltage VID7:VID0 (Hex) VID7:VID0 (Bin) Voltage VID7:VID0 (Hex) VID7:VID0 (Bin) Voltage 8F 10001111 0.960 B6 10110110 1.155 DD 11011101 1.350 90 10010000 0.965 B7 10110111 1.160 DE 11011110 1.355 91 10010001 0.970 B8 10111000 1.165 DF 11011111 1.360 92 10010010 0.975 B9 10111001 1.170 E0 11100000 1.365 93 10010011 0.980 BA 10111010 1.175 E1 11100001 1.370 94 10010100 0.985 BB 10111011 1.180 E2 11100010 1.375 95 10010101 0.990 BC 10111100 1.185 E3 11100011 1.380 96 10010110 0.995 BD 10111101 1.190 E4 11100100 1.385 97 10010111 1.000 BE 10111110 1.195 E5 11100101 1.390 98 10011000 1.005 BF 10111111 1.200 E6 11100110 1.395 E7 11100111 1.400 F0 11110000 1.445 F9 11111001 1.490 E8 11101000 1.405 F1 11110001 1.450 FA 11111010 1.495 E9 11101001 1.410 F2 11110010 1.455 FB 11111011 1.500 EA 11101010 1.415 F3 11110011 1.460 FC 11111100 1.505 EB 11101011 1.420 F4 11110100 1.465 FD 11111101 1.510 EC 11101100 1.425 F5 11110101 1.470 FE 11111110 1.515 ED 11101101 1.430 F6 11110110 1.475 FF 11111111 1.520 EE 11101110 1.435 F7 11110111 1.480 EF 11101111 1.440 F8 11111000 1.485 24 March 22, 2012 | FINAL | V2.27 4+1 Phase Dual Output Control IC IR3531 Adaptive Voltage Positioning (AVP) is a control algorithm where the output voltage is reduced as the load current increases. This may also be referred to as VR output impedance, Voltage Droop or Load Line. AVP is implemented to reduce the amount of bulk capacitance for a given load transient and regulation window and reduces power dissipation at heavy load. The IR3531 implementation of voltage positioning for Rail0 and Rail1 is shown in Figure 10. The output voltage is set by the VDAC or TRACK reference voltage at the positive input of the error amplifier. The VDRP pin is connected to the FB pin through the resistor RDRP. As load current increases, the VDRP voltage increases proportionally. Since the error amplifier will force the loop to maintain FB to be equal to the VDAC reference voltage, the additional RDRP current has to flow through the RFB resistor which introduces an offset voltage that is proportional to the load current. The RFB current is equal to (VDRP-VDAC)/RDRP. The positioning voltage can be programmed by the resistors RDRP and RFB so that the droop impedance produces the desired converter output impedance. The offset and slope of the converter output impedance are referenced to and therefore independent of the VDAC voltage. INDUCTOR DCR TEMPERATURE COMPENSATION CURRENT MONITOR (IMON) The load current information for all the phases is fed back to the control IC through the Driver IC IOUT pins where this information is averaged and buffered to the Thermal Compensation Amplifier. The gain of the Thermal Compensation Amplifier is modified by temperature by introducing a negative temperature coefficient (NTC) thermistor (RTHERM1) and linearizing resistor network (RTCMP1 and 2) connected between the VN and VDRP pins. The thermistor should be placed close to the power stage to accurately sense the thermal performance of the inductor DCR. The control IC generates a current monitor signal IMON using the VDRP voltage and the VDAC reference, also shown in Figure 10. The voltage at this pin reports the average load current information referenced to LGND. The slope of the IMON signal with respect to the load current can be adjusted with the resistors RTCMP2 and RTCMP3. The IMON signal is clamped at 1.09V in order to facilitate direct interfacing with the master. ADAPTIVE VOLTAGE POSITIONING Figure 10: Adaptive voltage positioning with thermal compensation 25 March 22, 2012 | FINAL | V2.27 4+1 Phase Dual Output Control IC IR3531 REMOTE VOLTAGE SENSING PROTECTION The remote sense differential amplifier in the IR3531 is a high speed, low input offset unity gain buffer that provides accurate voltage sensing and fast transient response. VOSEN+ and VOSEN- are the remote-sensing Kelvin connections that are tied directly to the load. Internal resistors to the differential amplifier produce VOSEN+ and VOSEN- bias currents of up to 50µA maximum and limits the size series resistors for acceptable regulation of the output voltage. Open sense lead detection is also included in this amplifier and is discussed further in the fault section. The Fault Table below describes the different faults that can occur and how the IR3531 reacts to protect the supply and the load from possible damage. The fault types that can occur are listed in row 1. Row 2 has the method that a fault is cleared. The first 3 faults are latched in the UV fault latch and the VCC power has to be recycled to clear. An over voltage fault can be cleared by recycling either VCC or the Enable signal. The rest of the faults (except for UVLO VOUT and SVID faults) are temporarily latched in the SS fault latch until the fault condition clears. Most faults disable the error amplifier (except for SVID and VOUT UVLO). Most faults (except SVID) flag VRRDY. VRRDY returns to active high when all faults are cleared. The delay row shows reaction time after detecting a fault condition. Delays are provided to minimize the possibility of nuisance faults. The table applies for both rails of the IC. PHASE SHEDDING IR3531 allows phases to be disabled through the PHSSHED pin. Shedding can be performed either statically at power up or can be exercised dynamically during normal operation. One, two or three phases can be disabled to help enhance light load efficiency. The internal clock frequency is automatically adjusted to achieve graceful transition. Phase shedding is not recommended if an external synchronization clock is being applied. TABLE 5: PHASE SHEDDING PROGRAMMING THRESHOLDS Threshold Action PHSSHED < 0.25VCC No Phases Shed 0.25VCC < PHSSHED < 0.5VCC Shed 1 Phase 0.5VCC < PHSSHED < 0.75VCC Shed 2 Phases PHSSHED < 0.75VCC Shed 3 Phases POWER STATES AND HIGH EFFICIENCY MODE AT LOW LOADS System processors can request the VR to enter higher efficiency Power Savings modes. The IR3531 enters single phase operation when a PS1 command is issued from the processor. This mode is intended for loads less than 20A. There is an 8 switching cycle delay before the VR transitions from PS0 to PS1. PS2 mode is not supported. PLATFORM TEST MODE Platform test mode allows users to test the VR solution when the default VBOOT voltage programmed on IR3531 is 0V and there is no communication capability to send commands. The address pin needs to be pulled up to 3.3V for IR3531 to go into platform test mode. IR3531 will boot to 1V in this mode. 26 March 22, 2012 | FINAL | V2.27 4+1 Phase Dual Output Control IC IR3531 TABLE 6: FAULT OPERATION FAULT TYPE Open Control Loop Fault Clearing Method Open Sense Line Yes ROSC/OVP drives high until OV clears No VRRDY Low? If fault occurs on Rail0 will Rail1 continue to operate? If fault occurs on Rail1 will Rail0 continue to operate? VCC UVLO Over Current VO UVLO Resume Normal Operation when Condition Clears Yes Yes No No No Yes Transition to 250mV and holds until fault is cleared Cycles from VBOOT to 250mV No Change No No No Yes No No No Hiccup Yes No No No Yes No No No Hiccup Yes No 4 SVID Clock Cycles to send NAK 250 ns Blank Time No 256μs OC duration, 4ms off duration No 8 PWM Cycles Delay V12V UVLO No Yes VDAC Response? Enable Low SVID Recycle VCC or Enable Recycle VCC Error Amp Disabled Over Voltage No No ENABLE INPUT OPEN REMOTE SENSE LINE PROTECTION The Enable pin has a 0.6V falling threshold that sets the Fault Latch, a 650mV rising threshold that clears the fault latch and has a 250ns filter to prevent chatter due to system noise. The VOSEN+ and VOSEN- remote sense line impedances are checked prior to power up to verify they are connected to low impedances. If high impedance is detected, an Open Sense Line fault is latched and requires VCC to be recycled to clear. During normal operation, the remote sense amp operating environment is monitored to ensure the remote sense lines are connected. Again, if an abnormal mode is detected, the sense line impedances are again checked. If high impedance is detected, an Open Sense Line fault is latched and requires VCC to be recycled to clear. OPEN VOLTAGE LOOP DETECTION If for some reason the control loop fails during operation, the system protects itself by latching an open loop fault that requires VCC recycling to clear. Detection is performed by monitoring the output of the error amplifier. The fault is latched if EAOUT operates above VCC-1.08V for 8 switching cycles indicating the control loop is broken. V12V AND VCC UNDER VOLTAGE LOCKOUT (UVLO) The IR3531 monitors the converter input voltage rails (V12V and VCC) and issues a UVLO fault if either voltage is below the desired operating range. The maximum power up clear thresholds are 10.2V for V12V and 6.2V for VCC. 27 March 22, 2012 | FINAL | V2.27 4+1 Phase Dual Output Control IC IR3531 Figure 12 shows two different power-up responses where Enable going high is gating the first VDAC slew and the calibration routine is gating the second VDAC slew. The default slew rate is 5mV/µsec. The control loop ensures the regulator output voltage will track VDAC. The soft start sequence finishes when VOUT is settled to the VBOOT set point and VRRDY is asserted. START-UP AND SHUT-DOWN SEQUENCE The IR3531 has a programmable, digitally controlled softstart function to limit the surge current during the voltage regulator start-up. The default boot voltage for Rail0 rail is 0.9V, for Rail1 it is 1.5V. Figure 11 depicts an Enable gated power-up and V12V UVLO shutdown followed by a V12V UVLO gated power up and an Enable low shutdown. The IR3531 has soft stop capability which allows the voltage regulator to power down in a controlled fashion without producing negative undershoots resulting from fast discharge of output capacitance. Pre-biased outputs are also supported as shown in Figure 13. The IR3531 requires less than 1ms to perform calibration routines once V12V (VIN) UVLO is cleared. Note VDAC is forced to 1.52V during calibration and A/D sampling and settles to 250mV once calibration is complete. V12V UVLO Threshold 1.52V During Pin Program Sensing 1.52V During Pin Program Sensing VDAC=0.9V VDAC=0.9V 250mV 0V ENABLE tmax=(1.52-0.25)/5mV=254usec Allow 1msec after VIN UVLO to allow A/D pin sensing and internal calibration routines to occur before attempting power-up. Figure 12: V12V Power and Enable Cycling TRACK VOUT=PREBIAS VOUT= VDAC VOUT=>PREBIAS VDAC VDAC 250mV VRRDY DIODE EMULATION NOT ALLOWED DIODE EMULATION NOT ALLOWED ENABLE Figure 13: Enable Power Cycling Under Pre-bias 28 March 22, 2012 | FINAL | V2.27 4+1 Phase Dual Output Control IC OVER-CURRENT CONTROL DURING SOFT-START Over current protection is performed internally by comparing the VDRP pin voltage against an OC offset voltage that is added to the respective VDAC pin voltage. This OC offset voltage is adjusted to match the active number of phases since VDRP represents average perphase current. This ensures that the current limit is correctly adjusted during phase shedding operation. The OC offset voltage is set as percentages of 1.025V above VDAC. An over current condition is registered if the VDRP pin voltage, which is proportional to the average current plus VDAC voltage, exceeds the VDAC+ OC offset voltage. IR3531 Figure 14 shows the over-current control with delay during various soft start events. The delay time is fixed at 256μs. The delay is required since over-current conditions can occur as part of normal operation due to inrush current. If an over-current occurs during soft start (before VRRDY is asserted), the control IC will not react until the over current delay time has elapsed. If the over-current condition persists after delay time is reached, the fault latch will be set pulling the error amplifier’s output low and inhibiting switching in the driver ICs. The VDAC voltage will slowly ramp down until it reaches 0.25V and the fault latch is reset allowing a normal soft start to occur. If an over-current condition is again encountered during the soft start cycle, the constant over-current control actions will repeat and the converter will be in hiccup mode. ENABLE INTERNAL OC DELAY TRACK 4ms DELAY 4ms DELAY 4ms DELAY VDAC EA VOUT VRRDY OCP THRESHOLD IOUT START-UP WITH OUTPUT SHORTED HICCUP OVER-CURRENT PROTECTION (OUTPUT SHORTED) NORMAL START-UP OCP DELAY NORMAL OPERATION OUTPUT SHORTED OVER-CURRENT PROTECTION (OUTPUT SHORTED) Figure 14: Over-Current Waveforms during and after start-up 29 March 22, 2012 | FINAL | V2.27 NORMAL NORMAL START-UP OPERATION POWER DOWN IR3531 4+1 Phase Dual Output Control IC ICCP (ICC MAX) PROGRAMMING TEMPERATURE TELEMETRY SVID register ICC MAX contains information on the maximum allowable current supported by the voltage regulator solution and can be equivalent to the CPU’s ICC_MAX. The CPU reads this register for platform compatibility during boot and uses this data in conjunction with the IOUT register for performance management. This data is in an 8-bit binary formant equivalent to amps, i.e. 75A=4Bh. The maximum temperature TMAX (22h) value is factory programmed to 110C. This register contains the maximum temperature the VR supports prior to issuing a thermal alert or VR_Hot. The master reads this register and uses this data in conjunction with the Temperature Zones for performance management. Factory trim options are listed in Table 8. TABLE 8: TEMP MAX (PROGRAMMED AT FINAL TEST) 30 Binary Code 00000 00001 00010 00011 00100 00101 00110 00111 01000 01001 01010 01011 01100 01101 01110 01111 10000 10001 10010 10011 10100 10101 10110 10111 11000 11001 11010 11011 11100 11101 11110 11111 Current Level 60A/25A 60A/35A 70A/25A 70A/35A 80A/25A 80A/35A 90A/25A 90A/35A 100A/25A 100A/35A 110A/25A 110A/35A 120A/25A 120A/35A 130A/25A 130A/35A 140A/25A 140A/35A 150A/25A 150A/35A 160A/25A 160A/35A 170A/25A 170A/35A 180A/25A 180A/35A 190A/25A 190A/35A 200A/25A 200A/35A 225A/25A 225A/35A March 22, 2012 | FINAL | V2.27 Binary Code Temperature 0000 90 Deg C 1000 106 Deg C 0001 92 Deg C 1001 108 Deg C 0010 94 Deg C 1010 110 Deg C 0011 96 Deg C 1011 112 Deg C 0100 98 Deg C 1100 114 Deg C 0101 100 Deg C 1101 116 Deg C 0110 102 Deg C 1110 118 Deg C 0111 104 Deg C 1111 120 Deg C THERMAL MONITORING (VRHOT#) The IR3531 provides two methods of thermal monitoring: a VRHOT# pin which flags an over temperature event and temperature telemetry is available through the SVID bus and the Temperature Zone register. A thermal sense network which includes an NTC thermistor provides board temperature information at TSENS pin as shown in Figure 15. The thermistor is usually placed in a temperature sensitive region of the converter and is linearized by a resistor network. VRHOT# will be active low once the voltage on TSENS crosses Zone 7, or 56.3% of VDAC. VRHOT# will de-assert once TSENS falls below Zone 5. The VRHOT# pin is an open-collector output and should be pulled up to a voltage source through a resistor. VDAC RTHERM2 RHOTSET1 Control IC RHOTSET2 %VDAC 1.5 4.7 7.8 11 14 17.2 20.3 23.4 26.5 29.7 32.8 36 39 42.2 45.3 48.4 51.5 54.7 57.8 61 64 67.2 70.3 73.4 76.6 79.7 82.8 86 89 92.2 95.3 98.4 Temperature VRHOT# TSENS RHOTSET3 VDAC Zone 5: 53.1% Zone 7: 56.3% - TABLE 7: ICCP (ICC MAX) A/D VOLTAGE PROGRAMMING (AS % OF VDAC) Binary Code + The voltage is programmed by an external resistor divider string referenced to VDAC. Table 7 lists the available current thresholds Figure 15: Over Temperature Detection Circuit IR3531 4+1 Phase Dual Output Control IC The IR3531 compares the TSENS pin voltage against fixed percentages of VDAC thresholds as indicated in Table 9. The user can program the external TSENS network to achieve a desired offset and slope to associate a zone (stored in register 12h) with a desired temperature. Zones correspond to the bit number of this 8-bit register, i.e. Zone 0=bit 0 and Zone 3=bit3 and therefore register 12h behaves like a thermometer. Notice that the zones 1 through 7 thresholds are equally spaced (~1.6% between thresholds) and the separation between Zone0 and Zone1 is approximately double. Since these zone thresholds are fixed and equally separated, the respective zone temperature values will also be equally separated for a TSENS voltage which has a linear slope vs. temperature. The SVID status register bit#1 and the ALERT# serve as thermal warning flags when zones 5 and 6 are crossed as indicated in Table 9. These warning flags may be used by the system to reduce the load, increase airflow, and prevent the system from entering thermal shutdown. The VRHOT# pin is asserted as zones 6 and 7 are crossed and can be used as a thermal shutdown flag. TMAX is merely a reference point to communicate with downstream system monitors what temperature a zone equates to. For example, the TMAX register is defaulted in the IR3531 as 110°C. The micro processor can perform a GetReg on TMAX and is now able to associate a Zone 4 declaration by the IR3531 to equate to 100.1°C TABLE 9: TEMPERATURE ZONES Temperature Zone TSENS Threshold % VDAC % of TMAX Degrees C based on 110°C TMAX Zone 0 43.8% 75% 82.5C Zone 1 46.9% 82% 90.2 Zone 2 48.4% 85% 93.5 Zone 3 50% 88% 96.8 Zone 4 51.6% 91% 100.1 Falling, Status bit 1 de-asserted, ALERT#. Zone 5 53.1% 94% 103.4 Falling, VRHOT# de-asserted Zone 6 54.7% 97% 106.7 Rising, Status bit 1 asserted, ALERT#. Zone 7 56.3% 100% 110 Rising, VRHOT# asserted OVER VOLTAGE PROTECTION (OVP) The IR3531 offers multilevel output over-voltage protection to ensure no conflicts occur during pre-biased conditioned power-up or no/light load soft stop. OVP is sensed through the FB which allows users to externally use FB resistor dividers if output voltages greater than 1.52V are desired. The OVP threshold is set to 1.65V during power up until VR Settled is reached, then the threshold is reduced to VDAC+130mV. This OVP threshold is maintained during normal operation and remains until VO, the output of the remote sense amplifier, reaches 250mV with respect to ground. This ensures OVP protection during soft stop events or down tracking events. The OVP threshold then returns to 1.65V on the FB pin to allow pre-bias startup. The over voltage condition also sets the over voltage fault latch which ensures the voltage regulator is off. OVP overrides the normal PWM operation and will regulate the output voltage by modulating the low-side MOSFET within approximately 150ns to prevent the FB pin from exceeding the OVP threshold. The OVP fault condition can only be cleared by cycling VCC UVLO or ENABLE. OV THRESHOLD VDAC + 130mV VDAC + 130mV VDAC NORMAL OPERATION IR3531 drives the ROSC/OVP pin above V(VCC)–1V to indicate an over voltage event has occurred. This ROSC/ OVP flag can be used by the system designer to shut the input if desired. 31 March 22, 2012 | FINAL | V2.27 VID DOWN VID LOW VID UP NORMAL OPERATION Figure 16: Over Voltage Protection during SETVID Fast/Slow IR3531 4+1 Phase Dual Output Control IC DESIGN PROCEDURES RICCP1 IR3531 EXTERNAL COMPONENTS Switching Frequency Setting Use of internal oscillator mode is not recommended. Use the SCLK input to set PWM frequency. When SCLK is used, ROSC should be present, and selected for the per phase switching frequency in use. The chart below shows the relationship between the per-phase switching frequency and the ROSC value. %VDAC 100 *100 * RICCP 2 %VDAC 1 where, %VDAC is the desired percentage of VDAC found in Table 7. PHASE SHEDDING IMPLEMENTATION CIRCUITS The following is a proposed circuit to implement phase shedding. Two signals (S1 and S2) drive logic level MOSFETs to produce a four level PHSSHED signal. The operation is described in Table 6. Figure 17: RROSC vs. Per-phase Switching Frequency Figure 18: Phase Shedding Implementation ADDRESS AND PHASE NUMBER PROGRAMMING RESISTORS RADDR1 AND RADDR2 The ADDR pin is multi-function: SVID addressing for Rail0 and Rail1, internal/external clock synchronization and Turbo enable/disable is selected through this pin. Choose RADDR2 and apply the following equation to determine RADDR1: %VDAC 100 * 100 * RADDR2 RADDR1 %VDAC TABLE 10: PHASE SHEDDING CONTROL S1 S2 V(PHSSHED) Phases 0 0 VCC Drop 3 Phases 0 1 0.625* VCC Drop 2 Phases 1 0 0.31* VCC Drop 1 Phases 1 1 0V Drop 0 Phases 1 IMON AND IMON1 CAPACITORS where, %VDAC is the desired percentage of VDAC found in Table 1. Use 100nF for CIMON and CIMON1 to provide an approximate 1ms filtered time constant for current reporting data. ICCP PROGRAMMING RESISTORS RICCP1 AND RICCP2 VCC BIAS REGULATOR POWER STAGE COMPONENTS The ICCP programming resistors are used to program the maximum currents Rail0 and Rail1 can support. Choose RICCP2 and follow the equation below to calculate RICCP1. Use a 10 µH inductor with a current rating no less than 2 A. Use a Schottky diode with operating current of 1 A or higher and capable of withstanding 2 A for short periods of time. A 10 µF capacitor ceramic capacitor rated for 16V is recommended for charge storage and filtering. 32 March 22, 2012 | FINAL | V2.27 4+1 Phase Dual Output Control IC TEMPERATURE SENSING The TSENS pin is used to provide temperature information of the voltage regulator by providing temperature zone information to the microprocessor through the SVID. This information is also used to flag VRHOT#. Temperature is sensed via a linearized NTC resistor network. Temperature sensing and temperature zones are represented as a percentage of the reference voltage VDAC as required by the processor specification. A properly designed network will get the TSENS voltage very close to the required target. 1% thermistors are highly recommended to achieve the specified accuracy. Thermistor Beta is the biggest factor in attaining accuracy. The target and TSENS voltages are calculated from the equations below. The analysis is done at VDAC of 1.5, because that is where the biggest error occurs. VTARGET VTSENSE RTSeq 0.11 *1.5 0.11 *1.5 * T 0.453 *1.5 * T min T max T min T max T min RHOTSET 3 *1.5 RHOTSET 3 RTSeq ( RHOTSET1 RTHERM 2) * RHOTSET 2 RHOTSET1 RHOTSET 2 RTHERM 2 RTHERM 2 RTHERM 2 ROOM * exp(beta ( 1 1 )) T TROOM where RTHERM2ROOM is the thermistor value at room temperature, beta is the thermistor coefficient, Tmax and Tmin are the temperatures of the highest and lowest temperature zone respectively. The temperature sensing components are chosen by finding an approximate solution that brings the target and TSENS as close to each other as possible. This can be done using an optimization routine of your choice such as the IR3531 excel design tool. RAIL0 THERMAL COMPENSATION Thermal compensation is required to counter the effect of the inductor DCR positive temperature coefficient. Failure to compensate results in large current reporting errors and poor load line regulation. Thermal compensation is done using a NTC thermistor and a linearizing resistor network. A properly design network is necessary to achieve the required accuracy targets. 1% thermistors are highly recommended to achieve the specified accuracy. Thermistor Beta is the biggest factor in attaining accuracy. 33 March 22, 2012 | FINAL | V2.27 IR3531 The goal is to keep VDRP-VDAC at 900 mV for all temperatures at the maximum current. Thus, the equation below has to be satisfied. 1 DCR * Gcs RTCeq VDRP VDAC * ( ) * (1 ) * Im ax 900mV 3 n RTCMP3 RTCeq RTCMP 2 * ( RTCMP1 RTHERM 1) RTCMP1 RTCMP 2 RTHERM 1 RTHERM 1 RTHERM 1ROOM * exp(beta ( 1 1 )) T TROOM DCR DCRROOM * (1 3850e 6 * (T TROOM )) where RTHERM1ROOM is the thermistor value at room temperature, beta is the thermistor coefficient, Tmax and Tmin are the temperatures of the highest and lowest temperature zone respectively, Gcs is the typical current sense amplifier gain of 32.5, and DCRROOM is the inductor series resistance at room temperature. The temperature sensing components are chosen by finding an approximate solution that results in VDRP-VDAC=900mV over the entire temperature operating range. This can be done using an optimization routine of your choice such as the IR3531 excel design tool. RAIL0 DROOP RESISTOR CALCULATION RDRP in combination with the feedback resistor RFB sets the load line of Rail0. RFB is first chosen with a typical suggested value of 2kOhm. The following equation calculates RDRP. RDRP RFB * DCRROOM * Gcs RTCeq ROOM * (1 ) 3 * Ro * n RTCMP3 where Ro is the load line, DCRROOM is the inductor series resistance at room temperature, Gcs is the typical current sense amplifier gain of 32.5, n is the number of phases and RTCeqROOM is the same as RTCeq in section Rail0 Thermal Compensation with RTHERM1 value at room temperature. 4+1 Phase Dual Output Control IC RAIL1 THERMAL COMPENSATION RSCALE1, RSCALE2, RSCALE3 and RTHERM3 are used to provide current reporting thermal compensation for Rail1. The purpose is to keep VDRP1-VDAC1 equal to 900mV for all temperatures at the maximum load current. This is expressed mathematically in the following equation. VDRP1 VDAC1 9 * DCR * Gcs * Im ax * ( RSCALE1 RTHERM 3) * RSCALE 2 RSCALE 1 RTHERM 3 RSCALE 3 ( RSCALE1 RTHERM 3) * RSCALE 3 RSCALE 2 RSCALE1 RTHERM 3 RSCALE 3 900 mV IR3531 COMPENSATION NETWORKS IR3531 utilizes voltage mode control for small signal loop regulation. The compensation scheme is a classic type 3 system consisting of components RFB(1), CFB(1), RCFB(1), CEA(1), CCP(1) and RCP(1). The system dynamics can change significantly when transitioning from 4 phases to 1 phase. Loop 0 has an additional component, RPSC, that is inserted in the loop when in PS1 mode (single phase) to optimize phase margin. RPSC adds to RCP thereby reducing the system bandwidth if desired. To disable this feature, place RPSC as a zero ohm resistor. The IR3531 excel design tool can be used to calculate an initial starting point. Note RDRP needs to be recalculated if RFB is changed. where DCR and RTHERM3 are expressed in section Rail0 Thermal Compensation. Imax is the maximum current for Rail1 and Gcs is the typical current sense amplifier gain of 32.5. The temperature sensing components are chosen by finding an approximate solution that results in VDRP1VDAC1=900mV over the entire temperature operating range. This can be done using an optimization routine of your choice such as the IR3531 excel design tool. LAYOUT GUIDELINES VCC bias inductor LVCC must be close to SW pin. VCC bias bulk cap COUTVCC must be located near LVCC and connections for COUTVCC must be as short as possible. For both rails, all components connected to EA, FB, VDRP, and VO pins must be located on the same layer as the IR3531 as close to these pins as possible. Insert 9 equally spaced connection vias to GND tab of IR3531. V12V decoupling cap must be near pin of IR3531 with GND connection as short as possible. ROSC must be located close to pin of IR3531. RTHERM1 and RTHERM3 must be located close to inductor of associated voltage regulator. Locate RTHERM2 to provide overall temperature reading of the power converter. RAIL 1 DROOP RESISTOR CALCULATION RDRP1 in combination with the feedback resistor RFB1 sets the load line of Rail1. RFB1 is first chosen with a typical suggested value of 2kOhm. The equation below calculates RDRP1. RFB1 * DCRROOM * Gcs * Ro ( RSCALE1 RTHERM 3 ROOM ) * RSCALE 3 RSCALE 1 RTHERM 3 RSCALE 3 ROOM RSCALE1 RTHERM 3 ROOM ) * RSCALE 3 RSCALE 2 RSCALE1 RTHERM 3 ROOM RSCALE 3 RDRP1 9 * where Ro is the load line, DCRROOM is the inductor series resistance at room temperature, Gcs is the typical current sense amplifier gain of 32.5, RTHERM3ROOM value at room temperature. 34 March 22, 2012 | FINAL | V2.27 4+1 Phase Dual Output Control IC IR3531 METAL AND COMPONENT PLACEMENT Lead land width should be equal to nominal part lead width. The minimum lead to lead spacing should be ≥ 0.2mm to minimize prevent shorting. Lead land length should be equal to maximum part lead length + 0.3 mm outboard extension + 0.05mm inboard extension. The outboard extension ensures a large and inspectable toe fillet, and the inboard extension will accommodate any part misalignment and ensure a fillet. Center pad land length and width should be equal to maximum part pad length and width. However, the minimum metal to metal spacing should be ≥ 0.17mm for 2 oz. Copper (≥ 0.1mm for 1 oz. Copper and ≥ 0.23mm for 3 oz. Copper) A single 0.30mm diameter via shall be placed in the center of the pad land and connected to ground to minimize the noise effect on the IC. No PCB traces should routed nor Vias placed under any of the 4 corners of the IC package. Doing so can cause the IC to rise up from the PCB resulting in poor solder joints to the IC leads. Figure 19: Metal and Component Placement * Contact International Rectifier to receive an electronic PCB Library file in your preferred format. 35 March 22, 2012 | FINAL | V2.27 4+1 Phase Dual Output Control IC IR3531 SOLDER RESIST The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder resist misalignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non Solder Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads. The minimum solder resist width is 0.13mm. At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a fillet so a solder resist width of ≥ 0.17mm remains. The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto the copper of 0.06mm to accommodate solder resist miss-alignment. In 0.5mm pitch cases it is allowable to have the solder resist opening for the land pad to be smaller than the part pad. Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high aspect ratio of the solder resist strip separating the lead lands from the pad land. The vias in the large center pad should be tented or plugged from bottom board side with solder resist. Figure 20: Solder Resist * Contact International Rectifier to receive an electronic PCB Library file in your preferred format. 36 March 22, 2012 | FINAL | V2.27 4+1 Phase Dual Output Control IC IR3531 STENCIL DESIGN The land pad aperture should be approximately 70% area of solder on the center pad. If too much solder is deposited on the center pad the part will float and the lead lands will be open. The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands. Reducing the amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm pitch devices the leads are only 0.25mm wide, the stencil apertures should not be made narrower; openings in stencils < 0.25mm wide are difficult to maintain repeatable solder release. The stencil lead land apertures should therefore be shortened in length by 80% and centered on the lead land. The maximum length and width of the land pad stencil aperture should be equal to the solder resist opening minus an annular 0.2mm pull back to decrease the incidence of shorting the center land to the lead lands when the part is pushed into the solder paste. . Figure 21: Stencil Design * Contact International Rectifier to receive an electronic PCB Library file in your preferred format. 37 March 22, 2012 | FINAL | V2.27 4+1 Phase Dual Output Control IC MARKING INFORMATION 3531 ?YWW? XXXXX SITE/DATE/MARKING CODE LOT CODE Figure 22: Package Marking PACKAGE INFORMATION 48L MLPQ (7 x 7 mm Body) θJA = 23.5 ºC/W, θJC = 1 ºC/W Figure 23: Package Dimensions 38 March 22, 2012 | FINAL | V2.27 IR3531 4+1 Phase Dual Output Control IC IR3531 Data and specifications subject to change without notice. This product will be designed and qualified for the Consumer market. Qualification Standards can be found on IR’s Web site. IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. www.irf.com 39 March 22, 2012 | FINAL | V2.27