LESHAN RADIO COMPANY, LTD. High-speed Diode DESCRIPTION The LBAS516T1 is a high-speed switching diode fabricated in planar technology and encapsulated in the SOD523(SC79) SMD plastic package. LBAS516T1G S-LBAS516T1G FEATURES · Ultra small plastic SMD package · High switching speed: max. 4 ns · Continuous reverse voltage: max. 75 V · Repetitive peak reverse voltage: max. 85 V · Repetitive peak forward current: max. 500 mA. 1 2 · We declare that the material of product compliance with RoHS requirements. SOD-523 · S- Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable. 1 CATHODE APPLICATIONS · High-speed switching in e.g. surface mounted circuits. 2 ANODE ORDERING INFORMATION Device Marking Shipping LBAS516T1G S-LBAS516T1G 6 3000 Tape & Reel LBAS516T3G S-LBAS516T3G 6 10000 Tape & Reel ELECTRICAL CHARACTERISTICS T j =25°C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MAX. UNIT VF forward voltage see Fig.2 I F = 1 mA I F = 10 mA 715 855 mV mV 1 1.25 V V 30 1 nA µA 30 50 µA µA 1 4 pF ns 1.75 V CONDITIONS VALUE UNIT note 1 120 K/W I F =50 mA I F = 150 mA IR reverse current see Fig.4 V R = 25 V V R =75 V V R = 25 V; T j = 150 °C V R = 75 V; T j = 150 °C; Cd t rr V fr diode capacitance reverse recovery time forward recovery voltage f = 1 MHz; V R = 0; see Fig.5 when switched from I F =10mA to I R = 10mA; R L = 100 Ω; measured at I R = 1 mA; see Fig.6 when switched from IF = 10 mA; tr = 20 ns; see Fig.7 THERMAL CHARACTERISTICS SYMBOL PARAMETER R Note thermal resistance from junction to soldering point 1. Soldering point of the cathode tab. th j-s Rev.O 1/4 LESHAN RADIO COMPANY, LTD. LBAS516T1G,S-LBAS516T1G LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER V RRM VR repetitive peak reverse voltage continuous reverse voltage IF I FRM continuous forward current repetitive peak forward current T s =90°C; note 1; see Fig.1 I FSM non-repetitive peak forward current P tot T stg CONDITIONS total power dissipation storage temperature junction temperature Tj MIN. MAX. UNIT – – 85 75 V V – – 250 500 mA mA square wave; T j =25°C prior to surge; see Fig.3 t =1µs – 4 A t =1 ms t =1 s – – 1 0.5 A A T s =90°C; note 1 – -65 – 500 +150 150 mW °C °C Note 1. Ts is the temperature at the soldering point of the cathode tab. 300 500 400 200 I F (mA) I F (mA) 300 200 100 100 (1) T j = 150 °C; typical values. (2)T j =25°C; typical values. (3) T j =25°C; maximum values. 0 0 50 100 150 200 0 0 T S ( °C ) 1 2 V F( V ) Fig.1 Maximum permissible continuous forward current as a function of soldering point temperature. Fig.2 Forward current as a function of forward voltage. 10 2 I FSM (A) 10 1 Based on square wave currents; T j =25°C prior to surge. 10 -1 0 10 102 103 104 t P ( µs ) Fig.3 Maximum permissible non-repetitive peak forward current as a function of pulse duration. Rev.O 2/4 LESHAN RADIO COMPANY, LTD. LBAS516T1G,S-LBAS516T1G 0.6 10 5 0.4 C d (pF) I R (nA) 10 4 10 3 0.2 10 2 f = 1 MHz ; T j =25°C; 10 0 100 200 T J ( °C ) Fig.4 Reverse current as a function of junction temperature. 0 0 4 8 12 16 V R( V ) Fig.5 Diode capacitance as a function of reverse voltage; typical values. (1) I R = 1 mA. Input signal: reverse pulse rise time t r = 0.6 ns; reverse voltage pulse duration t p = 100 ns; duty factor δ = 0.05; Oscilloscope: rise time t r = 0.35 ns. Fig.6 Reverse recovery voltage test circuit and waveforms. Input signal: forward pulse rise time t r = 20 ns; forward current pulse duration t p ≥ 100 ns; duty factor δ ≤ 0.005. Fig.7 Forward recovery voltage test circuit and waveforms. Rev.O 3/4 LESHAN RADIO COMPANY, LTD. LBAS516T1G,S-LBAS516T1G SOD−523 −X− D −Y− E 2X b 0.08 1 M 2 X Y TOP VIEW A c NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM A b c D E HE L L2 MILLIMETERS MIN NOM MAX 0.50 0.60 0.70 0.25 0.30 0.35 0.07 0.14 0.20 1.10 1.20 1.30 0.70 0.80 0.90 1.50 1.60 1.70 0.30 REF 0.15 0.20 0.25 HE SIDE VIEW RECOMMENDED SOLDERING FOOTPRINT* 2X 0.48 PACKAGE OUTLINE 1.80 2X 0.40 DIMENSION: MILLIMETERS Rev.O 4/4