AN1895 - Intersil

Application Note 1895
Total Dose Testing of the ISL71590SEH Radiation
Hardened Temperature Sensor
Introduction
Part Description
This report documents the results of low and high dose rate
total dose testing and subsequent anneals of the
ISL71590SEH radiation hardened temperature sensor. The
tests were conducted to provide an assessment of the total
dose hardness of the part and to provide an estimate of dose
rate sensitivity. Parts were irradiated under bias and with all
pins grounded at low and high dose rate. The ISL71590SEH is
acceptance tested on a wafer-by-wafer basis to 300krad(Si) at
high dose rate (50 to 300rad(Si)/s) and to 50krad(Si) at low
dose rate (0.01rad(Si)/s).
The ISL71590SEH is a radiation hardened two terminal
temperature transducer. It has a high impedance current
output that allows it to be insensitive to voltage drops across
long lines. With a supply voltage of between 4V and 36V
applied to the input pin, the device acts as a constant current
generator with a scale factor of 1μA/K. The ISL71590SEH is
specified across the -55°C to +125°C temperature range and
can operate across the -55°C to +150°C temperature range
without the need of additional circuitry.
Downpoints to date for the low dose rate tests were zero, 10,
30 and 50krad(Si); the test will be extended to 150krad(Si),
with a downpoint at 100krad(Si). Downpoints to date for the
low dose rate tests were zero, 10, 30, 50, 114 and
150krad(Si). Downpoints for the high dose rate tests were 0,
30, 50, 100, 300 and 450krad(Si). All irradiations and anneals
are complete.
Reference Documents
• MIL-STD-883 test method 1019
• ISL71590SEH datasheet
• Standard Microcircuit Drawing (SMD) 5962-13215
With power requirements as low as 1.5mW (5V at +25°C), the
part is an ideal choice for payload and booster temperature
sensing as any well-insulated twisted pair cable can be used
for proper operation. The ISL71590SEH can be used in a wide
range of applications including temperature compensation
networks, laser diode temperature compensation, sensor bias
and linearization functions and Proportional To Absolute
Temperature (PTAT) biasing. The high output impedance
(>10MΩ) leaves plenty of room for variations in the power
supply voltage. The part is electrically durable as it can
withstand an absolute maximum forward voltage of 40V
outside of the heavy ion environment (with a 37V absolute
maximum in-beam rating) and a reverse voltage of -40V. The
ISL71590SEH is available in a 2 lead hermetically sealed
flatpack.
Key Features
• Minimal accuracy shift over total dose rate
irradiation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.5K to +0.5K
• Linear output current. . . . . . . . . . . . . . . . . . . . . . . . . . 1.0μA/K
• Wide operating power supply range . . . . . . . . . . . . 4V to 31V
• Low power consumption . . . . . . . . . . . . . 1.5mW at 5V supply
• Operating temperature range. . . . . . . . . . . .-55°C to +125°C
• SEL/SEB threshold LET . . . . . . . . . . . . . . . 86.4MeV•cm2/mg
• Total dose tolerance, high dose rate . . . . . . . . . . 300krad(Si)
• Total dose tolerance, low dose rate . . . . . . . . . . . . .50krad(Si)
• QML qualified per MIL-PRF-38535
• Produced in conformance with Standard Microcircuit
Drawing (SMD) 5962-13215
September 24, 2015
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CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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Application Note 1895
Test Description
Characterization Equipment and Procedures
Irradiation Facilities
High dose rate testing was performed at 69.7rad(Si)/s using a
Gammacell 220 60Co irradiator located in the Palm Bay, Florida
Intersil facility. Low dose rate testing was performed at
0.01rad(Si)/s using the Intersil Palm Bay Hopewell Designs N40
panoramic 60Co irradiator. Annealing was performed under the
Figure 1 bias configuration at +100°C for 168 hours using a
small temperature chamber.
Test Fixturing
Figure 1 shows the configuration used for biased irradiation at
both high and low dose rate.
V1 = 5V ±5%
1
2
1
GND
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
U1
NOTE:
This socket/carrier holds ten
individual devices with the
carrier positions labeled
1 through 10.
U2
U3
All electrical testing was performed outside the irradiator using
the production Automated Test Equipment (ATE) with datalogging
at each downpoint. Downpoint electrical testing was performed
at room temperature. Due to the precision nature of the part, all
electrical characterisation is performed using production ATE and
an advanced constant-temperature liquid bath facility.
Experimental Matrix
Total dose irradiation proceeded in accordance with the
guidelines of MIL-STD-883 Test Method 1019.7. The
experimental matrix consisted of five samples irradiated at low
dose rate under bias, five samples irradiated at low dose rate
with all pins grounded, five samples irradiated at high dose rate
under bias and five samples irradiated at high dose rate with all
pins grounded.
Samples of the ISL71590SEH were drawn from preproduction
wafer lot X0A8P and were packaged in the hermetic 2-pin
solder-sealed production flatpack (K2.A) package. Samples were
processed through the standard burn-in cycle before irradiation,
as required by MIL-STD-883.
Downpoints
Downpoints for the low dose rate tests were 0, 10, 30, 50, 114
and 150krad(Si). Downpoints for the high dose rate tests were
0, 30, 50, 100, 300 and 450krad(Si). All irradiations were
followed by a high temperature anneal at +100°C under bias.
U4
U5
U6
U7
U8
U9
U10
FIGURE 1. IRRADIATION BIAS CONFIGURATION FOR THE ISL71590SEH
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Application Note 1895
Test Results
Attributes Data
TABLE 1. ISL71590SEH TOTAL DOSE TEST ATTRIBUTES DATA
PART
DOSE RATE,
RAD(SI)/S
BIAS
SAMPLE
SIZE
0.01
Figure 1
5
ISL71590SEH
ISL71590SEH
0.01
ISL71590SEH
69.7
ISL71590SEH
69.7
Grounded
Figure 1
Grounded
5
5
5
PASS
(Note 1)
FAIL
Pre-irradiation
5
0-
10krad(Si)
5
0
30krad(Si)
5
0
50krad(Si)
5
0
114krad(Si)
1
4
150krad(Si)
0
5
Anneal
1
4
Pre-irradiation
5
--
10krad(Si)
5
0
30krad(Si)
5
0
50krad(Si)
5
0
114krad(Si)
0
5
150krad(Si)
0
5
Anneal
2
3
Pre-irradiation
5
30krad(Si)
5
0
50krad(Si)
5
0
100krad(Si)
5
0
300krad(Si)
5
0
450krad(Si)
5
0
Anneal
5
0
Pre-irradiation
5
30krad(Si)
5
0
50krad(Si)
5
0
100krad(Si)
5
0
300krad(Si)
5
0
450krad(Si)
5
0
Anneal
5
0
DOWNPOINT
NOTE:
1. ‘Pass’ indicates a sample that passes all post-irradiation SMD limits.
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Application Note 1895
Variables Data
The plots in Figures 2 through 7 show data at all downpoints. We
plotted the average, minimum and maximum of the total dose
response for each parameter at low and high dose rate. For
clarity in interpreting the temperature error data, Figure 2 shows
the combined low and high dose rate response, Figure 3 shows
the low dose rate response only and Figure 4 shows the high
dose rate response only.
1.0
LDR AND HDR
SPEC LIMIT
TEMPERATURE ERROR (KELVIN)
0.5
0
ANNEAL 2
-0.5
-1.0
ANNEAL 1
-1.5
SPEC LIMIT
-2.0
-2.5
LDR GND AVG
LDR GND MIN
LDR GND MAX
LDR BIAS AVG
LDR BIAS MIN
LDR BIAS MAX
HDR GND AVG
HDR GND MIN
HDR GND MAX
HDR BIAS AVG
HDR BIAS MIN
HDR BIAS MAX
-3.0
-3.5
0
100
200
300
400
500
TOTAL DOSE (krad(Si))
FIGURE 2. ISL71590SEH temperature error in Kelvin as a function of total dose irradiation at low and at high dose rate for the biased (per
Figure 1) and unbiased (all pins grounded) cases. The low dose rate was 0.01rad(Si)/s and the high dose rate was 69.7rad(Si)/s. The
irradiations were followed by a +100°C 168 hour biased anneal; ‘Anneal 1’ was performed after 150krad(Si) at low dose rate while
‘Anneal 2’ was performed after 450krad(Si) at high dose rate. The sample size for all cells was 5. The post-irradiation SMD
specification limits are -1.5K to +0.5K.
1.0
LDR ONLY
TEMPERATURE ERROR (KELVIN)
0.5
SPEC LIMIT
0
-0.5
-1.0
-1.5
ANNEAL 1
-2.0
LDR GND AVG
LDR GND MIN
LDR GND MAX
LDR BIAS AVG
LDR BIAS MIN
LDR BIAS MAX
SPEC LIMIT
-2.5
-3.0
-3.5
0
100
200
300
400
500
TOTAL DOSE (krad(Si))
FIGURE 3. ISL71590SEH temperature error in Kelvin as a function of total dose irradiation at low dose rate for the biased (per Figure 1) and
unbiased (all pins grounded) cases. The dose rate was 0.01rad(Si)/s. The irradiations were followed by a +100°C 168 hour biased
anneal; ‘Anneal 1’ was performed after 150krad(Si) at low dose rate. The sample size for all cells was 5. The post-irradiation SMD
specification limits are -1.5K to +0.5K.
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1.0
HDR ONLY
SPEC LIMIT
TEMPERATURE ERROR (KELVIN)
0.5
0
HDR GND AVG
HDR GND MIN
HDR GND MAX
HDR BIAS AVG
HDR BIAS MIN
HDR BIAS MAX
-0.5
ANNEAL 2
-1.0
-1.5
SPEC LIMIT
-2
0
100
200
300
400
500
TOTAL DOSE (krad(Si))
FIGURE 4. ISL71590SEH temperature error in Kelvin as a function of total dose irradiation at high dose rate for the biased (per Figure 1) and
unbiased (all pins grounded) cases. The dose rate was 69.7rad(Si)/s. The irradiations were followed by a +100°C 168 hour biased
anneal; ‘Anneal 2’ was performed after 450krad(Si) at high dose rate. The sample size for all cells was 5. The post-irradiation SMD
specification limits are -1.5K to +0.5K.
0.6
POWER SUPPLY REJECTION, 4V (µA/V)
SPEC LIMIT
0.4
0.2
ANNEAL 1
LDR GND AVG
LDR GND MIN
LDR GND MAX
LDR BIAS AVG
LDR BIAS MIN
LDR BIAS MAX
HDR GND AVG
HDR GND MIN
HDR GND MAX
HDR BIAS AVG
HDR BIAS MIN
HDR BIAS MAX
0
ANNEAL 2
-0.2
-0.4
SPEC LIMIT
-0.6
0
100
200
300
400
500
TOTAL DOSE (krad(Si))
FIGURE 5. ISL71590SEH power supply rejection at 4V, in µA/V, as a function of total dose irradiation at low and at high dose rate for the biased
(per Figure 1) and unbiased (all pins grounded) cases. The low dose rate was 0.01rad(Si)/s and the high dose rate was 69.7rad(Si)/s.
The irradiations were followed by a +100°C 168 hour biased anneal; ‘Anneal 1’ was performed after 150krad(Si) at low dose rate
while ‘Anneal 2’ was performed after 450krad(Si) at high dose rate. The sample size for all cells was 5. The post-irradiation SMD
specification limits are -0.5µA/V to +0.5µA/V.
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Application Note 1895
0.25
SPEC LIMIT
POWER SUPPLY REJECTION, 15V (µA/V)
0.20
0.15
0.10
ANNEAL 1
ANNEAL 2
0.05
0
-0.05
-0.10
-0.15
LDR GND AVG
LDR GND MIN
LDR GND MAX
LDR BIAS AVG
LDR BIAS MIN
LDR BIAS MAX
HDR GND AVG
HDR GND MIN
HDR GND MAX
HDR BIAS AVG
HDR BIAS MIN
HDR BIAS MAX
SPEC LIMIT
-0.20
-0.25
0
100
200
300
400
500
TOTAL DOSE (krad(Si))
FIGURE 6. ISL71590SEH power supply rejection at 15V, in µA/V, as a function of total dose irradiation at low and at high dose rate for the biased
(per Figure 1) and unbiased (all pins grounded) cases. The low dose rate was 0.01rad(Si)/s and the high dose rate was 69.7rad(Si)/s.
The irradiations were followed by a +100°C 168 hour biased anneal; ‘Anneal 1’ was performed after 150krad(Si) at low dose rate
while ‘Anneal 2’ was performed after 450krad(Si) at high dose rate. Sample size for all cells was 5. The post-irradiation SMD
specification limits are -0.2µA/V to +0.2µA/V.
POWER SUPPLY REJECTION, 31V (µA/V)
0.15
SPEC LIMIT
0.10
ANNEAL 2
0.05
0
ANNEAL 1
-0.05
SPEC LIMIT
-0.10
-0.15
0
100
200
300
400
LDR GND AVG
LDR GND MIN
LDR GND MAX
LDR BIAS AVG
LDR BIAS MIN
LDR BIAS MAX
HDR GND AVG
HDR GND MIN
HDR GND MAX
HDR BIAS AVG
HDR BIAS MIN
HDR BIAS MAX
500
TOTAL DOSE (krad(Si))
FIGURE 7. ISL71590SEH power supply rejection at 31V, in µA/V, as a function of total dose irradiation at low and at high dose rate for the biased
(per Figure 1) and unbiased (all pins grounded) cases. The low dose rate was 0.01rad(Si)/s and the high dose rate was 69.7rad(Si)/s.
The irradiations were followed by a +100°C 168 hour biased anneal; ‘Anneal 1’ was performed after 150krad(Si) at low dose rate
while ‘Anneal 2’ was performed after 450krad(Si) at high dose rate. Sample size for all cells was 5. The post-irradiation SMD
specification limits are -0.1µA/V to +0.1µA/V.
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Application Note 1895
Discussion and Conclusion
We report the results of a characterisation total dose test of the
ISL71590SEH integrated temperature sensor. All irradiations
were followed by a high temperature anneal at +100°C under
bias. All electrical measurements were performed at room
temperature and were performed before irradiation, after each
irradiation step and after each annealing period. This is a simple
part with one key performance parameter, the temperature error,
but that simplicity does not necessarily translate into easy
electrical testing. Careful liquid-bath testing using Fluorocarbon
fluid is required for repeatable and accurate data (and for
adequate production testing as well, incidentally) and we used
four control units at each test operation to insure repeatable
data.
Figures 2 through 7 show the total dose and anneal response of
the part’s parameters. In Figure 2 we plot both the low and high
dose rate response on the same set of axes, while Figures 3 and 4
show the low dose rate and high dose rate responses separately.
The temperature error showed a very gradual change (Figures 2
and 4) from the pre-irradiation value of near zero to -0.5K after
450krad(Si) with no anneal response. The low dose rate
irradiation produced more pronounced shifts (Figures 2 and 3),
with the samples within the -1.5K to +0.5K SMD limits after
50krad(Si) but out of specification on the negative side after the
114krad(Si) and 150krad(Si) downpoints. We observed a strong
anneal response back to approximately the lower -1.5K limit, see
Figures 2 and 3. Interestingly, we observed no bias sensitivity at
all for either dose rate. The power supply rejection is the only
other measured parameter and was found to be stable at 4V,
15V and 31V supply voltage, although the data for the
114krad(Si) low dose rate downpoint is highly suspect, especially
for the 31V case (see Figure 7). The parameter remained well
within the respective SMD limits at all downpoints.
We conclude that the temperature error remained within the
-1.5K to +0.5K SMD post-irradiation specification limits after the
50krad(Si) at low dose rate or 300krad(Si) at high dose rate
specified in that drawing, but the part must be considered low
dose rate sensitive based on the ‘delta parameter’ diagnostic
algorithm outlined in MIL-STD-888 test method 1019 or based
simply on inspection of Figure 2. As noted before, the
ISL71590SEH is acceptance tested on a wafer-by-wafer basis at
both low and high dose rate. No differences in total dose
response between biased and grounded irradiation were noted at
either dose rate, and the part is hence not considered bias
sensitive. Interestingly, high temperature biased annealing
following low dose rate irradiation produced a strong anneal
signature, while performing the same step on high dose rate
samples produced no response at all.
Appendices
TABLE 2. REPORTED PARAMETERS AND THEIR POST-IRRADIATION LIMITS
FIGURE
PARAMETER
LIMIT
LOW
LIMIT
HIGH
UNITS
NOTES
2
Temperature error, high and low dose rate
-1.5
+0.5
K
3
Temperature error, low dose rate
-1.5
+0.5
K
4
Temperature error, high dose rate
-1.5
+0.5
K
5
Power supply rejection ratio
-0.5
+0.5
µA/V
4V supply
6
Power supply rejection ratio
-0.2
+0.2
µA/V
15V supply
7
Power supply rejection ratio
-0.1
+0.1
µA/V
31V supply
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that
you have the latest revision.
DATE
REVISION
CHANGE
September 2, 2015
AN1895.1
Final report - all irradiations and anneals are complete.
November 1, 2013
AN1895.0
Initial report.
Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is
cautioned to verify that the document is current before proceeding.
For information regarding Intersil Corporation and its products, see www.intersil.com
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